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Data Book and Design Guide
TECCOR ELECTRONICS
1800 Hurd Drive Irving, Texas 75038 United States of America Phone: +1 972-580-7777 Fax: +1 972-550-1309 Web site: http://www.teccor.com E-mail: sidactor.techsales@teccor.com
An Invensys company
Teccor Electronics is the proprietor of the SIDACtor(R), Battrax(R), and TeleLink(R) trademarks. All other brand names may be trademarks of their respective companies. Teccor Electronics SIDACtor products are covered by these and other U.S. Patents: 4,685,120 4,827,497 4,905,119 5,479,031 5,516,705
All SIDACtor products are recognized and listed under UL file E133083 as a UL 497B compliant device. All TeleLink fuses are recognized under UL file E191008 and are also listed for CSA marking by certificate LR 702828.
ISO 9001
TEC
COR ELECTRONICS
Teccor Electronics reserves the right to make changes at any time in order to improve designs and to supply the best products possible. The information in this catalog has been carefully checked and is believed to be accurate and reliable; however, no liability of any type shall be incurred by Teccor for the use of the circuits or devices described in this publication. Furthermore, no license of any patent rights is implied or given to any purchaser.
NOTES
1 Product Selection
Guide
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 Product Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4 Part Number Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6 Description of Part Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10 Quality and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11 Standard Terms and Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
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Product Selection Guide
Product Description
Product Description
SIDACtor components are solid state crowbar devices designed to protect telecom equipment during hazardous transient conditions. Capitalizing on the latest in thyristor advancements, Teccor makes SIDACtor devices with a patented ion implant technology. This technology ensures effective protection within nanoseconds, up to 5000 A surge current ratings, and simple solutions for regulatory requirements such as GR 1089, TIA-968 (formerly known as FCC Part 68), ITU-T K.20, ITU-T K.21, and UL 60950.
Operation
In the standby mode, SIDACtor devices exhibit a high off-state impedance, eliminating excessive leakage currents and appearing transparent to the circuits they protect. Upon application of a voltage exceeding the switching voltage (VS), SIDACtor devices crowbar and simulate a short circuit condition until the current flowing through the device is either interrupted or drops below the SIDACtor device's holding current (IH). Once this occurs, SIDACtor devices reset and return to their high off-state impedance.
+I
IT IS IH IDRM -V VT VDRM VS +V
-I
V-I Characteristics
Advantages
Compared to surge suppression using other technologies, SIDACtor devices offer absolute surge protection regardless of the surge current available and the rate of applied voltage (dv/dt). SIDACtor devices: * * * * * *
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Cannot be damaged by voltage Eliminate hysteresis and heat dissipation typically found with clamping devices Eliminate voltage overshoot caused by fast-rising transients Are non-degenerative Will not fatigue Have low capacitance, making them ideal for high-speed transmission equipment
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Product Description
Applications
When protecting telecommunication circuits, SIDACtor devices are connected across Tip and Ring for metallic protection and across Tip and Ground and Ring and Ground for longitudinal protection. They typically are placed behind some type of current-limiting device, such as Teccor's F1250T Telelink slow blow fuse. Common applications include: * Central office line cards (SLICs) * T-1/E-1, ISDN, and xDSL transmission equipment * Customer Premises Equipment (CPE) such as phones, modems, and caller ID adjunct boxes * PBXs, KSUs, and other switches * Primary protection including main distribution frames, five-pin modules, building entrance equipment, and station protection modules * Data lines and security systems * CATV line amplifiers and power inserters * Sprinkler systems For more information regarding specific applications, design requirements, or surge suppression, please contact Teccor Electronics directly at +1 972-580-7777 or through our local area representative. Access Teccor's web site at http://www.teccor.com or e-mail us at sidactor.techsales@teccor.com.
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Product Selection Guide
Product Packages
Product Packages
Surface Mount Packages DO-214AA Modified DO-214AA Modified MS-013 Six-pin Surface Mount (Fuse)
Balanced SIDACtor Device Battrax Dual Negative SLIC Protector Battrax Dual Positive/Negative SLIC Protector Battrax Quad Negative SLIC Protector Battrax SLIC Protector CATV/HFC SIDACtor Device CATV Line Amplifiers/Power Inserters SIDACtor Device Fixed Voltage SLIC Protector Four-port Metallic Line Protector High Surge (D-rated) SIDACtor Device LCAS Asymmetrical Device Longitudinal Protector MC Balanced SIDACtor Device MC SIDACtor Device Multiport Balanced SIDACtor Device Multiport Quad SLIC Protector Multiport SIDACtor Device SIDACtor Device TeleLink Fuse Twin SLIC Protector

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Product Packages
Through-hole Packages TO-92 Modified TO-220 TO-218 Hybrid SIP
Balanced SIDACtor Device Battrax Dual Negative SLIC Protector Battrax Dual Positive/Negative SLIC Protector Battrax Quad Negative SLIC Protector Battrax SLIC Protector

CATV/HFC SIDACtor Device CATV Line Amplifiers/Power Inserters SIDACtor Device
Fixed Voltage SLIC Protector Four-port Metallic Line Protector High Surge (D-rated) SIDACtor Device LCAS Asymmetrical Device

Longitudinal Protector MC Balanced SIDACtor Device MC SIDACtor Device Multiport Balanced SIDACtor Device Multiport Quad SLIC Protector Multiport SIDACtor Device SIDACtor Device TeleLink Fuse Twin SLIC Protector
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Part Number Index
Part Number Index
Note: For explanation of part numbers, see "Description of Part Number" on page 1-8.
Part Number A1220U_4 A1225U_4 A2106A_ A2106U_ A2106U_6 A2106Z_ A5030A_ A5030U_ A5030U_6 A5030Z_ B1100C_ B1101U_ B1101U_4 B1160C_ B1161U_ B1161U_4 B1200C_ B1201U_ B1201U_4 B2050C_ B3104U_ B3164U_ B3204U_ F0500T F1250T F1251T P0080E_ P0080S_ P0080SA MC P0080SC MC P0080SD P0080Z_ P0084U_ P0300E_ P0300S_ P0300SA MC P0300SC MC P0300SD P0300Z_ P0304U_ Page 2-36 2-36 2-32 2-20 2-24 2-40 2-32 2-20 2-24 2-40 2-52 2-54 2-58 2-52 2-54 2-58 2-52 2-54 2-58 2-52 2-56 2-56 2-56 2-66 2-66 2-66 2-16 2-4 2-8 2-6 2-10 2-44 2-22 2-16 2-4 2-8 2-6 2-10 2-44 2-22 Part Number P0602A_ P0602AC MC P0602Z_ P0640E_ P0640EC MC P0640S_ P0640SC MC P0640SD P0640Z_ P0641CA2 P0641S_ P0641U_ P0642S_ P0644U_ P0720E_ P0720S_ P0720SC MC P0720SD P0720Z_ P0721CA2 P0721S_ P0721U_ P0722S_ P0724U_ P0900E_ P0900S_ P0900SC MC P0900SD P0900Z_ P0901CA2 P0901S_ P0901U_ P0902S_ P0904U_ P1100E_ P1100S_ P1100SC MC P1100SD P1100Z_ P1101CA2 Page 2-28 2-30 2-42 2-16 2-18 2-4 2-6 2-10 2-44 2-48 2-46 2-50 2-14 2-22 2-16 2-4 2-6 2-10 2-44 2-48 2-46 2-50 2-14 2-22 2-16 2-4 2-6 2-10 2-44 2-48 2-46 2-50 2-14 2-22 2-16 2-4 2-6 2-10 2-44 2-48 Part Number P1101S_ P1101U_ P1102S_ P1104U_ P1200S_ P1300E_ P1300S_ P1300SC MC P1300SD P1300Z_ P1304U_ P1400AD P1402A_ P1402AC MC P1402Z_ P1500E_ P1500EC MC P1500S_ P1500SC MC P1500SD P1500Z_ P1504U_ P1553A_ P1553AC MC P1553U_ P1553Z_ P1556U_ P1602A_ P1602AC MC P1602Z_ P1800AD P1800E_ P1800S_ P1800SC MC P1800SD P1800Z_ P1803A_ P1803AC MC P1803U_ P1803Z_ Page 2-46 2-50 2-14 2-22 2-38 2-16 2-4 2-6 2-10 2-44 2-22 2-60 2-28 2-30 2-42 2-16 2-18 2-4 2-6 2-10 2-44 2-22 2-32 2-34 2-20 2-40 2-24 2-28 2-30 2-42 2-60 2-16 2-4 2-6 2-10 2-44 2-32 2-34 2-20 2-40
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Part Number Index
Part Number P1804U_ P1806U_ P1900ME P2000AA61 P2000S_ P2103A_ P2103AC MC P2103U_ P2103Z_ P2106U_ P2200AA61 P2202A_ P2202AC MC P2202Z_ P2300E_ P2300ME P2300S_ P2300SC MC P2300SD P2300Z_ P2304U_ P2353A_ P2353AC MC P2353U_ P2353Z_ P2356U_ P2400AA61 P2500AA61 P2500S_ P2600E_ P2600EC MC P2600S_ P2600SC MC P2600SD P2600Z_ P2604U_ P2702A_ P2702AC MC P2702Z_ P2703A_
Page 2-22 2-24 2-64 2-26 2-38 2-32 2-34 2-20 2-40 2-24 2-26 2-28 2-30 2-42 2-16 2-64 2-4 2-6 2-10 2-44 2-22 2-32 2-34 2-20 2-40 2-24 2-26 2-26 2-38 2-16 2-18 2-4 2-6 2-10 2-44 2-22 2-28 2-30 2-42 2-32
Part Number P2703AC MC P2703U_ P2703Z_ P2706U_ P3000AA61 P3002A_ P3002AC MC P3002CA P3002S_ P3002Z_ P3100AD P3100E_ P3100EC MC P3100S_ P3100SC MC P3100SD P3104U_ P3100Z_ P3203A_ P3203AC MC P3203U_ P3203Z_ P3206U_ P3300AA61 P3403A_ P3403AC MC P3403U_ P3403Z_ P3406U_ P3500E_ P3500S_ P3500SC MC P3500SD P3500Z_ P3504U_ P3602A_ P3602AC MC P3602Z_ P4202A_ P4202AC MC
Page 2-34 2-20 2-40 2-24 2-26 2-28 2-30 2-12 2-14 2-42 2-62 2-16 2-18 2-4 2-6 2-10 2-22 2-44 2-32 2-34 2-20 2-40 2-24 2-26 2-32 2-34 2-20 2-40 2-24 2-16 2-4 2-6 2-10 2-44 2-22 2-28 2-30 2-42 2-28 2-30
Part Number P4202Z_ P4802A_ P4802AC MC P4802Z_ P5103A_ P5103AC MC P5103U_ P5106U_ P6002A_ P6002AC MC P6002AD P6002CA P6002Z_
Page 2-42 2-28 2-30 2-42 2-32 2-34 2-20 2-24 2-28 2-30 2-62 2-12 2-42
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Description of Part Number
Description of Part Number
The following illustration shows a description of a sample SIDACtor device part number.
P
DEVICE TYPE P = SIDACtor MEDIAN VOLTAGE RATING 210 = 210 V CONSTRUCTION VARIABLE 0 = One chip 1 = Unidirectional part 2 = Two chips 3 = Three chips
210
2
A
A
61 RP
PACKING OPTIONS RP1 = TO-92 reel pack (0.100" lead spacing) RP2 = TO-92 reel pack (0.200" lead spacing) AP = Ammo pack RP = Reel pack TP = Tube pack LEAD FORM OPTIONS TO-220 modified type 60, 61, or 62 For U type: 3 = 3 chips 4 = 4 chips 6 = 6 chips IPP RATING A = 50 A (10x560 s) B = 100 A (10x560 s) C = 500 A (2x10 s) D = 1000 A (8x20 s) E = 3000 A (8x20 s) PACKAGE TYPE A = TO-220 C = Three-leaded DO-214 E = TO-92 M = TO-218 S = DO-214 U = Six-pin SOIC Z = SIP
0 = One SIDACtor Chip
1 2 3
2 = Two Matched SIDACtor Chips
1 3
Patented
2
3 = Three Matched SIDACtor Chips
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Description of Part Number
The following illustration shows a description of a sample Battrax device part number.
B 1 10 1
DEVICE TYPE B = Battrax Battrax TYPE 1 = Negative 2 = Positive 3 = Dual HOLDING CURRENT 05 = 50 mA 10 = 100 mA 16 = 160 mA 20 = 200 mA
U
A
IPP RATING A = 50 A (10x560 s) B = 100 A (10x560 s) C = 500 A (2x10 s) PACKAGE TYPE C = Three-leaded DO-214 U = Six-pin SOIC CONSTRUCTION VARIABLE 0 = No diode 1 = Diode 4 = Four Battrax Devives
The following illustration shows a description of a sample asymmetrical SIDACtor device part number.
A 1806
DEVICE TYPE A = Asymmetrical SIDACtor
U
C
4
TP
PACKING OPTIONS AP = Ammo pack RP = Reel pack TP = Tube pack
MEDIAN VOLTAGE RATING 1806 = 180 V and 60 V
LEAD FORM OPTIONS TO-220 modified type 60, 61, or 62 For U type: 3 = 3 chips 4 = 4 chips 6 = 6 chips
3
1
Patented
2
3 = Three Matched SIDACtor chips
IPP RATING A = 50 A (10x560 s) B = 100 A (10x560 s) C = 500 A (2x10 s) D = 1000 A (8x20 s) E = 3000 A (8x20 s) PACKAGE TYPE A = TO-220 M = TO-218 U = Six-pin SOIC
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Electrical Parameters
Electrical Parameters
Electrical parameters are based on the following definition of conditions: * On state (also referred to as the crowbar condition) is the low impedance condition reached during full conduction and simulates a short circuit. * Off state (also referred to as the blocking condition) is the high impedance condition prior to beginning conduction and simulates an open circuit. CO di/dt dv/dt IS IDRM IH IPP IT ITSM VS VDRM VF VT Off-state Capacitance -- typical capacitance measured in off state Rate of Rise of Current -- maximum rated value of the acceptable rate of rise in current over time Rate of Rise of Voltage -- rate of applied voltage over time Switching Current -- maximum current required to switch to on state Leakage Current -- maximum peak off-state current measured at VDRM Holding Current -- minimum current required to maintain on state Peak Pulse Current -- maximum rated peak impulse current On-state Current -- maximum rated continuous on-state current Peak One-cycle Surge Current -- maximum rated one-cycle AC current Switching Voltage -- maximum voltage prior to switching to on state Peak Off-state Voltage -- maximum voltage that can be applied while maintaining off state On-state Forward Voltage -- maximum forward voltage measured at rated on-state current On-state Voltage -- maximum voltage measured at rated on-state current
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Quality and Reliability
Quality and Reliability
It is Teccor's policy to ship quality products on time. We accomplish this through Total Quality Management based on the fundamentals of customer focus, continuous improvement, and people involvement. In support of this commitment, Teccor applies the following principles: * Employees shall be respected, involved, informed, and qualified for their job with appropriate education, training, and experience. * Customer expectations shall be met or exceeded by consistently shipping products that meet the agreed specifications, quality levels, quantities, schedules, and test and reliability parameters. * Suppliers shall be selected by considering quality, service, delivery, and cost of ownership. * Design of products and processes will be driven by customer needs, reliability, and manufacturability. It is the responsibility of management to incorporate these principles into policies and systems. It is the responsibility of those in leadership roles to coach their staff and to reinforce these principles. It is the responsibility of each individual employee to follow the spirit of this statement to ensure that we meet the primary policy -- to ship quality products on time.
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Standard Terms and Conditions
Standard Terms and Conditions
Supplier shall not be bound by any term proposed by Buyer in the absence of written agreement to such term signed by an authorized officer of Supplier. (1) PRICE: (A) Supplier reserves the right to change product prices at any time but, whenever practicable, Supplier will give Buyer at least thirty (30) days written notice before the effective date of any price change. Unless Supplier has specifically agreed in writing, signed by an authorized officer of Supplier, that a quoted price shall not be subject to change for a certain time, all products shipped on or after the effective date of a price change may be billed at the new price level. (B) Whenever Supplier agrees to a modification of Buyer's order (which modification must be in writing and signed by an authorized officer of Supplier), Supplier reserves the right to alter its price, whether or not such price was quoted as "firm". (C) Prices do not include federal, state or local taxes, now or hereafter enacted, applicable to the goods sold. Taxes will be added by Supplier to the sales prices whenever Supplier has legal obligation to collect them and will be paid by Buyer as invoiced unless Buyer provides Supplier with a proper tax exemption certificate. (2) PRODUCTION: Supplier may, at its sole discretion and at any time, withdraw any catalog item from further production without notice or liability to Buyer. (3) INTEREST: (A) All late payments shall bear interest thirty (30) days after the due date stated on the invoice until paid at the lower of one and one-half percent per month or the maximum rate permitted by law. All interest becoming due shall, if not paid when due, be added to principal and bear interest from the due date. At Supplier's option, any payment shall be applied first to interest and then to principal. (B) It is the intention of the parties to comply with the laws of the jurisdiction governing any agreement between the parties relating to interest. If any construction of the agreement between the parties indicates a different right given to Supplier to demand or receive any sum greater than that permissible by law as interest, such as a mistake in calculation or wording, this paragraph shall override. In any contingency which will cause the interest paid or agreed to be paid to exceed the maximum rate permitted by law, such excess will be applied to the reduction of any principal amount due, or if there is no principal amount due, shall be refunded. (4) TITLE AND DELIVERY: Title to goods ordered by Buyer and risk of loss or damage in transit or thereafter shall pass to Buyer upon Supplier's delivery of the goods at Supplier's plant or to a common carrier for shipment to Buyer. (5) CONTINGENCIES: Supplier shall not be responsible for any failure to perform due to causes reasonably beyond its control. These causes shall include, but not be restricted to, fire, storm, flood, earthquake, explosion, accident, acts of public enemy, war rebellion, insurrection, sabotage, epidemic, quarantine restrictions, labor disputes, labor shortages, labor slow downs and sit downs, transportation embargoes, failure or delays in transportation, inability to secure raw materials or machinery for the manufacture of its devices, acts of God, acts of the Federal Government or any agency thereof, acts of any state or local government or agency thereof, and judicial action. Similar causes shall excuse Buyer for failure to take goods ordered by Buyer, from the time Supplier receives written notice from Buyer and for as long as the disabling cause continues, other than for goods already in transit or specially fabricated and not readily saleable to other buyers. Supplier assumes no responsibility for any tools, dies, and other equipment furnished Supplier by Buyer. (6) LIMITED WARRANTY AND EXCLUSIVE REMEDY: Supplier warrants all catalog products to be free from defects in materials and workmanship under normal and proper use and application for a period of twelve (12) months from the date code on the product in question (or if none, from the date of delivery to Buyer.) With respect to products assembled, prepared, or manufactured to Buyer's specifications, Supplier warrants only that such products will meet Buyer's specifications upon delivery. As the party responsible for the specifications, Buyer shall be responsible for testing and inspecting the products for adherence to specifications, and Supplier shall have no liability in the absence of such testing and inspection or if the product passes such testing or inspection. THE ABOVE WARRANTY IS THE ONLY WARRANTY EXTENDED BY SUPPLIER, AND IS IN LIEU OF AND EXCLUDES ALL OTHER WARRANTIES AND CONDITIONS, EXPRESSED OR IMPLIED (EXCEPT AS PROVIDED HEREIN AS TO TITLE), ON ANY GOODS OR SERVICES SOLD OR RENDERED BY SUPPLIER, INCLUDING ANY IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. THIS WARRANTY WILL NOT CREATE WARRANTY COVERAGE FOR ANY ITEM INTO WHICH ANY PRODUCT SOLD BY SUPPLIER MAY HAVE BEEN INCORPORATED OR ADDED. SUPPLIER'S ENTIRE LIABILITY AND BUYER'S EXCLUSIVE REMEDY UNDER THIS WARRANTY SHALL BE, AT SUPPLIER'S OPTION, EITHER THE REPLACEMENT OF, REPAIR OF, OR ISSUANCE OF CREDIT TO BUYER'S ACCOUNT WITH SUPPLIER FOR ANY PRODUCTS WHICH ARE PROPERLY RETURNED BY BUYER DURING THE WARRANTY PERIOD. All returns must comply with the following conditions:
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Standard Terms and Conditions
Supplier is to be promptly notified in writing upon discovery of defects by Buyer. Buyer must obtain a Return Material Authorization (RMA) number from the Supplier prior to returning product. The defective product is returned to Supplier, transportation charges prepaid by Buyer. Supplier's examination of such product discloses, to its satisfaction, that such defects have not been caused by misuse, neglect, improper installation, repair, alteration, or accident. (E) The product is returned in the form it was delivered with any necessary disassembly carried out by Buyer at Buyer's expense. IN NO EVENT SHALL SUPPLIER, OR ANYONE ELSE ASSOCIATED IN THE CREATION OF ANY OF SUPPLIER'S PRODUCTS OR SERVICES, BE LIABLE TO BUYER FOR INCIDENTAL OR CONSEQUENTIAL DAMAGES OF ANY NATURE INCLUDING LOSS OF PROFITS, LOSS OF USE, BUSINESS INTERUPTION, AND THE LIKE. BUYER ACKNOWLEDGES THAT THE ABOVE WARRANTIES AND LIMITATIONS THEREON ARE APPROPRIATE AND REASONABLE IN EFFECTUATING SUPPLIER'S AND BUYER'S MUTUAL INTENTION TO CONDUCT AN EFFICIENT TRANSACTION AT PRICES MORE ADVANTAGEOUS TO BUYER THAN WOULD BE AVAILABLE IN THE PRESENCE OF OTHER WARRANTIES AND ASSURANCES. (7) PATENTS: Buyer shall notify Supplier in writing of any claim that any product or any part of use thereof furnished under this agreement constitutes an infringement of any U.S. patent, copyright, trade secret, or other proprietary rights of a third party. Notice shall be given within a reasonable period of time which should in most cases be within ten (10) days of receipt by Buyer of any letter, summons, or complaint pertaining to such a claim. At its option, Supplier may defend at its expense any action brought against Buyer to the extent that it is based on such a claim. Should Supplier choose to defend any such claim, Supplier may fully participate in the defense, settlement, or appeal of any action based on such claim. Should any product become, or in Supplier's opinion be likely to become, the subject of an action based on any such claim, Supplier may, at its option, as the Buyer's exclusive remedy, either procure for the Buyer the right to continue using the product, replace the product or modify the product to make it noninfringing. IN NO EVENT SHALL SUPPLIER BE LIABLE FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES BASED ON ANY CLAIM OF INFRINGEMENT. Supplier shall have no liability for any claim based on modifications of a product made by any person or entity other than Supplier, or based on use of a product in conjunction with any other item, unless expressly approved by Supplier. Supplier does not warrant goods against claims of infringement which are assembled, prepared, or manufactured to Buyer's specifications. (8) NON-WAIVER OF DEFAULT: Each shipment made under any order shall be treated as a separate transaction, but in the event of any default by Buyer, Supplier may decline to make further shipments without in any way affecting its rights under such order. If, despite any default by Buyer, Supplier elects to continue to make shipments, its action shall not constitute a waiver of that or any default by Buyer or in any way affect Supplier's legal remedies for any such default. At any time, Supplier's failure to exercise any right to remedy available to it shall not constitute a waiver of that right or remedy. (9) TERMINATION: If the products to be furnished under this order are to be used in the performance of a Government contract or subcontract, and the Government terminates such contract in whole or part, this order may be canceled to the extent it was to be used in the canceled portion of said Government contract and the liability of Buyer for termination allowances shall be determined by the then applicable regulations of the Government regarding termination of contracts. Supplier may cancel any unfilled orders unless Buyer shall, upon written notice, immediately pay for all goods delivered or shall pay in advance for all goods ordered but not delivered, or both, at Supplier's option. (10) LAW: The validity, performance and construction of these terms and conditions and any sale made hereunder shall be governed by the laws of the state of Texas. (11) ASSIGNS: This agreement shall not be assignable by either Supplier or Buyer. However, should either Supplier or Buyer be sold or transferred in its entirety and as an ongoing business, or should Supplier or Buyer sell or transfer in its entirety and as an ongoing concern, any division, department, or subsidiary responsible in whole or in part for the performance of this Agreement, this Agreement shall be binding upon and inure to the benefit of those successors and assigns of Supplier, Buyer, or such division, department, or subsidiary. (12) MODIFICATION OF STANDARD TERMS AND CONDITIONS: No attempted or suggested modification of or addition to any of the provisions upon the face or reverse of this form, whether contained or arising in correspondence and/or documents passing between Supplier and Buyer, in any course of dealing between Supplier or Buyer, or in any customary usage prevalent among businesses comparable to those of Supplier and/or Buyer, shall be binding upon Supplier unless made and agreed to in writing and signed by an officer of Supplier. (13) QUANTITIES: Any variation in quantities of electronic components, or other goods shipped over or under the quantities ordered (not to exceed 5%) shall constitute compliance with Buyer's order and the unit price will continue to apply.
(A) (B) (C) (D)
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NOTES
2 Data Sheets
DO-214AA Package Symbolization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 DO-214AA SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 MicroCapacitance (MC) SC SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6 MicroCapacitance (MC) SA SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8 High Surge Current (D-rated) SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10 Compak Two-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12 Ethernet/10BaseT/100BaseT Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14 TO-92 SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16 MicroCapacitance (MC) SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18 Modified MS-013 (Six-pin Surface Mount) Balanced Three-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20 Multiport SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22 Multiport Balanced SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-24 Modified TO-220 SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26 Two-chip SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-28 Two-chip MicroCapacitance (MC) SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-30 Balanced Three-chip SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-32 Balanced Three-chip MicroCapacitance (MC) SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . 2-34 LCAS LCAS Asymmetrical Multiport Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-36 LCAS Asymmetrical Discrete Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-38 SIP Hybrid Overvoltage and Overcurrent Protector Four-Port Balanced Three-chip Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-40 Four-Port Longitudinal Two-chip Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-42 Four-Port Metallic Line Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-44 SLICs Fixed Voltage SLIC Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-46 Twin SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-48 Multiport SLIC Protector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-50 Battrax Battrax SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-52 Battrax Dual Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-54 Battrax Dual Positive/Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-56 Battrax Quad Negative SLIC Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-58 CATVs CATV and HFC SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-60 High Surge Current SIDACtor Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-62 CATV Line Amplifiers/Power Inserters SIDACtor Device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-64 TeleLink Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-66 Acronyms: CATV HFC LCAS SIP SLIC Community Antenna TV Hybrid Fiber Coax Line Circuit Access Switch Single In-line Package Subscriber Line Interface Circuit
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Data Sheets
This section presents complete electrical specifications for Teccor's SIDACtor solid state overvoltage protection devices.
DO-214AA Package Symbolization
DO-214AA Package Symbolization
Part Number Catalog P0080SA P0080SA MC P0080SB P0080SC P0080SD P0080SC MC P0300SA P0300SA MC P0300SB P0300SC P0300SD P0300SC MC P0640SA P0640SB P0640SC P0640SD P0640SC MC P0641CA2 P0641SA P0641SC P0720SA P0720SB P0720SC P0720SD P0720SC MC P0721CA2 P0721SA P0721SC P0900SA P0900SB P0900SC P0900SD P0900SC MC P0901CA2 P0901SA Symbolized P-8A P-8AM P-8B P-8C P-8D P-8CM P03A P03AM P03B P03C P03D P03CM P06A P06B P06C P06D P06CM P62A P61A P61C P07A P07B P07C P07D P07CM P72A P71A P71C P09A P09B P09C P09D P09CM P92A P91A P0901SC P1100SA P1100SB P1100SC P1100SD P1100SC MC P1101CA2 P1101SA P1101SC P1200SA P1200SB P1200SC P1200SD P1200SC MC P1300SA P1300SB P1300SC P1300SD P1300SC MC P1500SA P1500SB P1500SC P1500SD P1500SC MC P1800SA P1800SB P1800SC P1800SD P1800SC MC P2000SA P2000SB P2000SC P2000SD P2000SC MC P2300SA Part Number Catalog Symbolized P91C P11A P11B P11C P11D P11CM P02A P01A P01C P12A P12B P12C P12D P12CM P13A P13B P13C P13D P13CM P15A P15B P15C P15D P15CM P18A P18B P18C P18D P18CM P20A P20B P20C P20D P20CM P23A P2300SB P2300SC P2300SD P2300SC MC P2500SA P2500SB P2500SC P2500SD P2500SC MC P2600SA P2600SB P2600SC P2600SD P2600SC MC P3002CB P3002SB P3100SA P3100SB P3100SC P3100SD P3100SC MC P3500SA P3500SB P3500SC P3500SD P3500SC MC P6002CB B1100CA B1100CC B1160CA B1160CC B1200CA B1200CC B2050CA B2050CC Part Number Catalog Symbolized P23B P23C P23CM P25A P25B P25C P25D P25CM P26A P26B P26C P26D P26CM P30B P30B P31A P31B P31C P31D P31CM P35A P35B P35C P35D P35CM P60B B10A B10C B16A B16C B12A B12C B25A B25C P23D
Note: Date code is located below the symbolized part number.
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Data Sheets
SIDACtor Device
SIDACtor Device
DO-214AA SIDACtor solid state protection devices protect telecommunications equipment such as modems, line cards, fax machines, and other CPE. SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68).
Electrical Parameters
Part Number * P0080S_ P0300S_ P0640S_ P0720S_ P0900S_ P1100S_ P1300S_ P1500S_ P1800S_ P2300S_ P2600S_ P3100S_ P3500S_ VDRM Volts 6 25 58 65 75 90 120 140 170 190 220 275 320 VS Volts 25 40 77 88 98 130 160 180 220 260 300 350 400 VT Volts 4 4 4 4 4 4 4 4 4 4 4 4 4 IDRM Amps 5 5 5 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 50 50 150 150 150 150 150 150 150 150 150 150 150 CO pF 100 110 50 50 50 40 40 40 30 30 30 30 30
* For individual "SA", "SB", and "SC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for "SA" and "SB" product. "SC" capacitance is approximately 2x the listed value. The off-state capacitance of the P0080SB is equal to the "SC" device.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 30 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
SIDACtor Device
Thermal Considerations
Package DO-214AA Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 90 Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
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Data Sheets
MicroCapacitance (MC) SC SIDACtor Device
MicroCapacitance (MC) SC SIDACtor Device
The DO-214AA SC MC SIDACtor series is intended for applications sensitive to load values. Typically, high speed connections require a lower capacitance. CO values for the MicroCapacitance device are 40% lower than a standard SC part. This MC SIDACtor series is used to enable equipment to meet various regulatory requirements including GR 1089, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68). Contact factory regarding ITU K.20, K.21, and K.45.
Electrical Parameters
Part Number * P0080SC MC ** P0300SC MC ** P0640SC MC P0720SC MC P0900SC MC P1100SC MC P1300SC MC P1500SC MC P1800SC MC P2300SC MC P2600SC MC P3100SC MC P3500SC MC VDRM Volts 6 25 58 65 75 90 120 140 170 190 220 275 320 VS Volts 25 40 77 88 98 130 160 180 220 260 300 350 400 VT Volts 4 4 4 4 4 4 4 4 4 4 4 4 4 IDRM Amps 5 5 5 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 50 50 150 150 150 150 150 150 150 150 150 150 150 CO pF 55 35 60 60 60 50 50 50 40 40 40 40 40
* For surge ratings, see table below. ** Contact factory for release date. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias.
Surge Ratings
IPP 2x10 s Amps 500 IPP 8x20 s Amps 400 IPP 10x160 s Amps 200 IPP 10x560 s Amps 150 IPP 10x1000 s Amps 100 ITSM 60 Hz Amps 30 di/dt Amps/s 500
Series C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
MicroCapacitance (MC) SC SIDACtor Device
Thermal Considerations
Package DO-214AA Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 90 Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
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Data Sheets
MicroCapacitance (MC) SA SIDACtor Device
MicroCapacitance (MC) SA SIDACtor Device
The DO-214AA SA MC SIDACtor series is intended for applications sensitive to load values. Typically, high speed connections require a lower capacitance. CO values for the MicroCapacitance device are 40% lower than a standard SA part. This MC SIDACtor series is used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA968 (formerly known as FCC Part 68).
Electrical Parameters
Part Number * P0080SA MC P0300SA MC VDRM Volts 6 25 VS Volts 25 40 VT Volts 4 4 IDRM Amps 5 5 IS mAmps 800 800 IT Amps 2.2 2.2 IH mAmps 50 50 CO pF 45 25
* For surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias.
Surge Ratings
IPP 2x10 s Amps 150 IPP 8x20 s Amps 150 IPP 10x160 s Amps 90 IPP 10x560 s Amps 50 IPP 10x1000 s Amps 45 ITSM 60 Hz Amps 20 di/dt Amps/s 500
Series A
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
MicroCapacitance (MC) SA SIDACtor Device
Thermal Considerations
Package DO-214AA Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 90 Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
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Data Sheets
High Surge Current (D-rated) SIDACtor Device
High Surge Current (D-rated) SIDACtor Device
DO-214AA SIDACtor solid state protection devices with a D surge rating protect telecommunications equipment such as modems, line cards, fax machines, and other CPE. These SIDACtor devices withstand simultaneous surges incurred in GR 1089 lightning tests. (See "First Level Lightning Surge Test" on page 4-5.) Surge ratings are twice that of a device with a C surge rating. This allows a discrete surface mount version of Teccor's patented "Y" configuration. (US Patent 4,905,119) SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68).
Electrical Parameters
Part Number * P0080SD ** P0300SD ** P0640SD ** P0720SD ** P0900SD ** P1100SD P1300SD P1500SD P1800SD P2300SD P2600SD P3100SD P3500SD VDRM Volts 6 25 58 65 75 90 120 140 170 190 220 275 320 VS Volts 25 40 77 88 98 130 160 180 220 260 300 350 400 VT Volts 4 4 4 4 4 4 4 4 4 4 4 4 4 IDRM Amps 5 5 5 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 50 50 50 50 50 50 50 50 50 50 50 50 50 CO pF 200 220 100 100 100 80 80 80 60 60 60 60 60
* For surge ratings, see table below. ** Contact factory for release date. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Surge Ratings
IPP 2x10 s Amps 1000 IPP 8x20 s Amps 800 IPP 10x160 s Amps 400 IPP 10x560 s Amps 300 IPP 10x1000 s Amps 200 ITSM 60 Hz Amps 50 di/dt Amps/s 1000
Series D
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
High Surge Current (D-rated) SIDACtor Device
Thermal Considerations
Package DO-214AA Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 90 Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
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Data Sheets
Compak Two-chip SIDACtor Device
Compak Two-chip SIDACtor Device
1 (T) 3 (R) 2 (G)
The modified DO-214AA SIDACtor device provides low-cost, longitudinal protection. SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68).
Electrical Parameters
Part Number P3002CA P6002CA VDRM Volts 140 275 VS Volts 180 350 VDRM Volts Pins 1-3 280 550 360 700 VS Volts VT Volts 4 4 IDRM Amps 5 5 IS mAmps 800 800 IT Amps 1 1 IH mAmps 120 120 CO pF Pins 1-3 15 15
Pins1-2, 2-3
* For surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 1-3 at 1 MHz with a 2 V bias. * UL 60950 creepage requirements must be considered.
Surge Ratings
IPP 2x10 s Amps 150 IPP 8x20 s Amps 150 IPP 10x160 s Amps 90 IPP 10x560 s Amps 50 IPP 10x1000 s Amps 45 ITSM 60 Hz Amps 20 di/dt Amps/s 500
Series A
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Compak Two-chip SIDACtor Device
Thermal Considerations
Package Modified DO-214AA
Pin 3
Symbol TJ TS RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +150 -65 to +150 85
Unit C C C/W
Pin 1 Pin 2
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
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Data Sheets
Ethernet/10BaseT/100BaseT Protector
Ethernet/10BaseT/100BaseT Protector
The DO-214AA SIDACtor Ethernet protection series is intended for applications sensitive to load values. Typically, high speed connections require a lower capacitance. CO values are 40% lower than standard devices. SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68).
Electrical Parameters
Part Number * P0642S_ P0722S_ P0902S_ P1102S_ P3002S_ VDRM Volts 58 65 75 90 280 VS Volts 77 88 98 130 360 VT Volts 4 4 4 4 4 IDRM Amps 5 5 5 5 5 IS mAmps 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 IH mAmps 120 120 120 120 120 CO pF 25 25 25 20 15
* For surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias.
Surge Ratings
IPP 2x10 s Amps 150 250 IPP 8x20 s Amps 150 250 IPP 10x160 s Amps 90 150 IPP 10x560 s Amps 50 100 IPP 10x1000 s Amps 45 80 ITSM 60 Hz Amps 20 30 di/dt Amps/s 500 500
Series A B**
** Contact factory for release date of B-rated devices.
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Ethernet/10BaseT/100BaseT Protector
Thermal Considerations
Package DO-214AA Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 90 Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
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Data Sheets
SIDACtor Device
SIDACtor Device
TO-92 SIDACtor solid state protection devices protect telecommunications equipment such as modems, line cards, fax machines, and other CPE. SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68)
.
Electrical Parameters
Part Number * P0080E_ P0300E_ P0640E_ P0720E_ P0900E_ P1100E_ P1300E_ P1500E_ P1800E_ P2300E_ P2600E_ P3100E_ P3500E_ VDRM Volts 6 25 58 65 75 90 120 140 170 190 220 275 320 VS Volts 25 40 77 88 98 130 160 180 220 260 300 350 400 VT Volts 4 4 4 4 4 4 4 4 4 4 4 4 4 IDRM Amps 5 5 5 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 50 50 150 150 150 150 150 150 150 150 150 150 150 CO pF 100 110 50 50 50 40 40 40 30 30 30 30 30
* For individual "EA", "EB", and "EC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for "EA" and "EB" product. "EC" capacitance is approximately 2x the listed value. The off-state capacitance of the P0080EB is equal to the "EC" device.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
SIDACtor Device
Thermal Considerations
Package TO-92 Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 90 Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
MicroCapacitance (MC) SIDACtor Device
MicroCapacitance (MC) SIDACtor Device
The TO-92 MC SIDACtor series is intended for applications sensitive to load values. Typically, high speed connections require a lower capacitance. CO values for MC devices are 40% lower than a standard EC part. This MC SIDACtor series is used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA968 (formerly known as FCC Part 68) without the need of series resistors.
Electrical Parameters
Part Number * P0640EC MC P1500EC MC P2600EC MC P3100EC MC VDRM Volts 58 140 220 275 VS Volts 77 180 300 350 VT Volts 4 4 4 4 IDRM Amps 5 5 5 5 IS mAmps 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 IH mAmps 150 150 150 150 CO pF 60 50 40 40
* For surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias.
Surge Ratings
IPP 2x10 s Amps 500 IPP 8x20 s Amps 400 IPP 10x160 s Amps 200 IPP 10x560 s Amps 150 IPP 10x1000 s Amps 100 ITSM 60 Hz Amps 50 di/dt Amps/s 500
Series C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
MicroCapacitance (MC) SIDACtor Device
Thermal Considerations
Package TO-92 Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 90 Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
Balanced Three-chip SIDACtor Device
Balanced Three-chip SIDACtor Device
1 2 3 6 5 4
This balanced protector is a surface mount alternative to the modified TO-220 package. Based on a six-pin surface mount SOIC package, it uses Teccor's patented "Y" (US Patent 4,905,119) configuration. It is available in surge current ratings up to 500 A. SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68).
Electrical Parameters
Part Number * P1553U_ P1803U_ P2103U_ P2353U_ P2703U_ P3203U_ P3403U_ P5103U_ A2106U_3 ** A5030U_3 ** VDRM Volts 130 150 170 200 230 270 300 420 170 400 VS Volts 180 210 250 270 300 350 400 600 250 550 VDRM Volts 130 150 170 200 230 270 300 420 50 270 VS Volts 180 210 250 270 300 350 400 600 80 350 VT Volts 8 8 8 8 8 8 8 8 8 8 IDRM Amps 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 150 150 150 150 150 150 150 150 120 150 CO pF 40 40 40 40 30 30 30 30 40 30
Pins 1-3, 1-4
Pins 3-4
* For individual "UA", "UB", and "UC" surge ratings, see table below. ** Asymmetrical General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 1-3 and 1-4 at 1 MHz with a 2 V bias and is a typical value for "UA" product. "UB" and "UC" capacitance is approximately 2x higher. * Device is designed to meet balance requirements of GTS 8700 and GR 974.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Balanced Three-chip SIDACtor Device
Thermal Considerations
Package Modified MS-013
6 5 4 1 2
Symbol TJ TS RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +125 -65 to +150 60
Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
3
Multiport SIDACtor Device
Multiport SIDACtor Device
1 (R1) 2 (G1) 3 (T1) 6 (T2) 5 (G2) 4 (R2)
The multiport line protector is an integrated multichip solution for protecting multiple twisted pair from overvoltage conditions. Based on a six-pin surface mount SOIC package, it is equivalent to four discrete DO-214AA or two TO-220 packages. Available in surge current ratings up to 500 A, the multiport line protector is ideal for densely populated, high-speed line cards that cannot afford PCB inefficiencies or the use of series power resistors. SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68).
Electrical Parameters
Part Number * P0084U_ P0304U_ P0644U_ P0724U_ P0904U_ P1104U_ P1304U_ P1504U_ P1804U_ P2304U_ P2604U_ P3104U_ P3504U_ VDRM Volts 6 25 58 65 75 90 120 140 170 190 220 275 320 VS Volts 25 40 77 88 98 130 160 180 220 260 300 350 400 VDRM Volts 12 50 116 130 150 180 240 280 340 380 440 550 640 VS Volts 50 80 154 176 196 260 320 360 440 520 600 700 800 VT Volts 4 4 4 4 4 4 4 4 4 4 4 4 4 IDRM Amps 5 5 5 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 50 50 150 150 150 150 150 150 150 150 150 150 150 CO pF 100 110 50 50 50 40 40 40 30 30 30 30 30
Pins 1-2, 3-2, 4-5, 6-5
Pins 1-3, 4-6
* For individual "UA", "UB", and "UC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM, and VS is measured at 100 V/s. * Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for "UA" product. "UB" and "UC" capacitance is approximately 2x higher.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Multiport SIDACtor Device
Thermal Considerations
Package Modified MS-013
6 5 4 1 2 3
Symbol TJ TS RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +150 -65 to +150 60
Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
Multiport Balanced SIDACtor Device
Multiport Balanced SIDACtor Device
1 2 3 6 5 4
This multiport balanced protector is a surface mount alternative to the modified TO-220 package. It is based on a six-pin surface mount SOIC package and uses Teccor's patented "Y" (US Patent 4,905,119) configuration. It is available in surge current ratings up to 500 A. SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68).
Electrical Parameters -- Symmetrical
Part Number * P1556U_ P1806U_ P2106U_ P2356U_ P2706U_ P3206U_ P3406U_ P5106U_ VDRM Volts 130 150 170 200 230 270 300 420 VS Volts 180 210 250 270 300 350 400 600 VDRM Volt 130 150 170 200 230 270 300 420 VS Volts 180 210 250 270 300 350 400 600 VT Volts 8 8 8 8 8 8 8 8 IDRM Amps 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 150 150 150 150 150 150 150 150 CO pF Pins 3-2, 6-5, 1-2, 4-5 50 50 40 40 40 40 40 40
Pins 1-2, 2-3, 1-3
Pins 4-5, 5-6, 4-6
Electrical Parameters -- Asymmetrical
VDRM Volts Part Number * A2106U_6 A5030U_6 VS Volts VDRM Volt VS Volts VT Volts 3.5 3.5 IDRM Amps 5 5 IS mAmps 800 800 IT Amps 2.2 2.2 IH mAmps 120 150 CO pF 40 30
Pins 1-2, 2-3, 4-5, 5-6 170 400 250 550
Pins 4-6, 1-3 50 270 80 350
* For individual "UA", "UB", and "UC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for "UA" product. "UB" and "UC" capacitance is approximately 10 pF higher. * Device is designed to meet balance requirements of GTS 8700 and GR 974.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Multiport Balanced SIDACtor Device
Thermal Considerations
Package Modified MS-013
6 5 4 1 2
Symbol TJ TS RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +125 -65 to +150 60
Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
3
SIDACtor Device
SIDACtor Device
The modified TO-220 Type 61 SIDACtor solid state protection device can be used in telecommunication protection applications that do not reference earth ground. SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68).
Electrical Parameters
Part Number * P2000AA61 P2200AA61 P2400AA61 P2500AA61 P3000AA61 P3300AA61 VDRM Volts 180 200 220 240 270 300 VS Volts 220 240 260 290 330 360 VT Volts 4 4 4 4 4 4 IDRM Amps 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 150 150 150 150 150 150 CO pF 30 30 30 30 30 30
* For surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Surge Ratings
IPP 0.2x310 s Amps 20 IPP 2x10 s Amps 150 IPP 8x20 s Amps 150 IPP 10x160 s Amps 90 IPP 10x560 s Amps 50 IPP 5x320 s Amps 75 IPP 10x1000 s Amps 45 ITSM 60 Hz Amps 20 di/dt Amps/s 500
Series A
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
SIDACtor Device
Thermal Considerations
Package Modified TO-220 Type 61 Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 50 Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH I DRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
Two-chip SIDACtor Device
Two-chip SIDACtor Device
1 (T) 3 (R) 2 (G)
The two-chip modified TO-220 SIDACtor solid state device protects telecommunication equipment in applications that reference Tip and Ring to earth ground but do not require balanced protection. SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68).
Electrical Parameters
Part Number * P0602A_ P1402A_ P1602A_ P2202A_ P2702A_ P3002A_ P3602A_ P4202A_ P4802A_ P6002A_ VDRM Volts 25 58 65 90 120 140 170 190 220 275 VS Volts 40 77 95 130 160 180 220 250 300 350 VDRM Volts 50 116 130 180 240 280 340 380 440 550 VS Volts 80 154 190 260 320 360 440 500 600 700 VT Volts 4 4 4 4 4 4 4 4 4 4 IDRM Amps 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 50 150 150 150 150 150 150 150 150 150 CO pF 110 50 50 40 40 40 40 30 30 30
Pins 1-2, 3-2
Pins 1-3
* For individual "AA", "AB", and "AC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for "AA" and "AB" product. "AC" capacitance is approximately 2x the listed value.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Two-chip SIDACtor Device
Thermal Considerations
Package Modified TO-220 Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 50 Unit C C C/W
PIN 1 PIN 2
PIN 3
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
Two-chip MicroCapacitance (MC) SIDACtor Device
Two-chip MicroCapacitance (MC) SIDACtor Device
1 (T) 3 (R) 2 (G)
The two-chip modified TO-220 MC SIDACtor solid state device protects telecommunication equipment in applications that reference Tip and Ring to earth ground but do not require balanced protection. SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68).
Electrical Parameters
Part Number * P0602AC MC P1402AC MC P1602AC MC P2202AC MC P2702AC MC P3002AC MC P3602AC MC P4202AC MC P4802AC MC P6002AC MC VDRM Volts 25 58 65 90 120 140 170 190 220 275 VS Volts 40 77 95 130 160 180 220 250 300 350 VDRM Volts 50 116 130 180 240 280 340 380 440 550 VS Volts 80 154 190 260 320 360 440 500 600 700 VT Volts 4 4 4 4 4 4 4 4 4 4 IDRM Amps 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 50 150 150 150 150 150 150 150 150 150 CO pF 60 60 60 50 50 50 40 40 40 40
Pins 1-2, 3-2
Pins 1-3
* For surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias.
Surge Ratings
IPP 2x10 s Amps 500 IPP 8x20 s Amps 400 IPP 10x160 s Amps 200 IPP 10x560 s Amps 150 IPP 10x1000 s Amps 100 ITSM 60 Hz Amps 50 di/dt Amps/s 500
Series C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Two-chip MicroCapacitance (MC) SIDACtor Device
Thermal Considerations
Package Modified TO-220 Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 50 Unit C C C/W
PIN 1 PIN 2
PIN 3
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
Balanced Three-chip SIDACtor Device
Balanced Three-chip SIDACtor Device
1 3
2
The three-chip modified TO-220 SIDACtor balanced solid state device is designed for telecommunication protection systems that reference Tip and Ring to earth ground. Applications include any piece of transmission equipment that requires balanced protection. This device is built using Teccor's patented "Y" (US Patent 4,905,119) configuration. The SIDACtor device is used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20,K.21 and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68).
Electrical Parameters
Part Number * P1553A_ P1803A_ P2103A_ P2353A_ P2703A_ P3203A_ P3403A_ P5103A_ A2106A_3 ** A5030A_3 ** VDRM Volts 130 150 170 200 230 270 300 420 170 400 VS Volts 180 210 250 270 300 350 400 600 250 550 VDRM Volts 130 150 170 200 230 270 300 420 50 270 VS Volts 180 210 250 270 300 350 400 600 80 350 VT Volts 8 8 8 8 8 8 8 8 8 8 IDRM Amps 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 150 150 150 150 150 150 150 150 120 150 CO pF 40 40 40 40 30 30 30 30 40 30
Pins 1-2, 2-3
Pins 1-3
* For individual "AA", "AB", and "AC" surge ratings, see table below. ** Asymmetrical General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for "AA" product. "AB" and "AC" capacitance is approximately 2x the listed value. * Device is designed to meet balance requirements of GTS 8700 and GR 974.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Balanced Three-chip SIDACtor Device
Thermal Considerations
Package Modified TO-220 Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 50 Unit C C C/W
PIN 1 PIN 2
PIN 3
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
2 - 33
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Data Sheets
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device
1 3
The balanced three-chip TO-220 MC SIDACtor solid state device protects telecommunication equipment in high-speed applications that are sensitive to load values and that require a lower capacitance. CO values for the MC are 40% lower than a standard AC part. This MC SIDACtor series is used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68) without the need of series resistors.
2
Electrical Parameters
Part Number * P1553AC MC P1803AC MC P2103AC MC P2353AC MC P2703AC MC P3203AC MC P3403AC MC P5103AC MC VDRM Volts 130 150 170 200 230 270 300 420 VS Volts 180 210 250 270 300 350 400 600 VDRM Volts 130 150 170 200 230 270 300 420 VS Volts 180 210 250 270 300 350 400 600 VT Volts 8 8 8 8 8 8 8 8 IDRM Amps 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 150 150 150 150 150 150 150 150 CO pF 40 40 40 40 30 30 30 30
Pins 1-2, 2-3
Pins 1-3
* For surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias. * Device is designed to meet balance requirements of GTS 8700 and GR 974.
Surge Ratings
IPP 2x10 s Amps 500 IPP 8x20 s Amps 400 IPP 10x160 s Amps 200 IPP 10x560 s Amps 150 IPP 10x1000 s Amps 100 ITSM 60 Hz Amps 50 di/dt Amps/s 500
Series C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Balanced Three-chip MicroCapacitance (MC) SIDACtor Device
Thermal Considerations
Package Modified TO-220 Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 50 Unit C C C/W
PIN 1 PIN 2
PIN 3
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
LCAS Asymmetrical Multiport Device
LCAS Asymmetrical Multiport Device
1 (R1) 2 (G1) 3 (T1) 6 (T2) 5 (G2) 4 (R2)
This is an integrated multichip solution for protecting multiple twisted pair from overvoltage conditions. Based on a six-pin surface mount SOIC package, it is equivalent to four discrete DO-214AA or two TO-220 packages. Available in surge current ratings up to 500 A, the multiport line protector is ideal for densely populated line cards that cannot afford PCB inefficiencies or the use of series power resistors. For a diagram of an LCAS (Line Circuit Access Switch) application, see Figure 3.21.
Electrical Parameters
Part Number * A1220U_4 A1225U_4 VDRM Volts 100 100 VS Volts 130 130 VDRM Volts 180 230 VS Volts 220 290 VT Volts 4 4 IDRM Amps 5 5 IS mAmps 800 800 IT Amps 2.2 2.2 IH mAmps 120 120 CO pF Pins 3-2, 6-5, 1-2, 4-5 30 30
Pins 3-2, 6-5
Pins 1-2, 4-5
* For individual "UA", "UB", and "UC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for "UA" product. "UB" and "UC" capacitance is approximately 2x higher.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
LCAS Asymmetrical Multiport Device
Thermal Considerations
Package Modified MS-013
6 5 4 1 2 3
Symbol TJ TS RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +125 -65 to +150 60
Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
LCAS Asymmetrical Discrete Device
LCAS Asymmetrical Discrete Device
These DO-214AA SIDACtor devices are intended for LCAS (Line Circuit Access Switch) applications that require asymmetrical protection in discrete (individual) packages. They enable the protected equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21, K.45, IEG 60950, UL 60950, and TIA-968.
Electrical Parameters
Part Number * P1200S_ P2000S_ P2500S_ VDRM Volts 100 180 230 VS Volts 130 220 290 VT Volts 4 4 4 IDRM Amps 5 5 5 IS mAmps 800 800 800 IT Amps 2.2 2.2 2.2 IH mAmps 120 120 120 CO pF 40 30 30
* For individual "SA", "SB", and "SC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 1-2 and 3-2 at 1 MHz with a 2 V bias and is a typical value for "SA" and "SB" product. "SC" capacitance is approximately 10 pF higher.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
LCAS Asymmetrical Discrete Device
Thermal Considerations
Package DO-214AA Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +125 -65 to +150 60 Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IT IS S IH IDRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I -I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
2 - 39
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Data Sheets
Four-Port Balanced Three-chip Protector
Four-Port Balanced Three-chip Protector
This hybrid Single In-line Package (SIP) protects four twisted pairs from overcurrent and overvoltage conditions. Comprised of twelve discrete DO-214AA SIDACtor devices and eight TeleLink surface mount fuses, it is ideal for densely populated line cards that cannot afford PCB inefficiencies or the use of series power resistors. Surge current ratings up to 500 A are available.
F2 Tip
2 5
F4 Tip
7 10
F6 Tip
12 15
F8 Tip
17 20
Z3 Z2 Gnd
3
Z6 Z5 Gnd
8
Z9 Z8 Gnd
13
Z12 Z11 Gnd
18
Z1 Ring
4 1
Z4 Ring
9 6
Z7 Ring
14 11
Z10 Ring
19 16
F1
F3
F5
F7
Electrical Parameters
VDRM Volts Part Number * P1553Z_ P1803Z_ P2103Z_ P2353Z_ P2703Z_ P3203Z_ P3403Z_ A2106Z_ ** A5030Z_ ** VS Volts VDRM Volts VS Volts VT Volts 8 8 8 8 8 8 8 8 8 IDRM Amps 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 150 150 150 150 150 150 150 120 150 CO pF Pins 1-3 40 40 40 40 30 30 30 40 30
Pins 2-3, 4-3, 7-8, 9-8, 12-13, 14-13, 17-18, 19-18 130 150 170 200 230 270 300 170 400 180 210 250 270 300 350 400 250 550
Pins 2-4, 7-9, 12-14, 17-19 130 150 170 200 230 270 300 50 270 180 210 250 270 300 350 400 80 350
* For individual "ZA," "ZB," and "ZC" surge ratings, see table below. ** Asymmetrical General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 4-3 and Pins 2-3 at 1 MHz with a 2 V bias and is a typical value for "ZA" product. "ZB" and "ZC" capacitance is approximately 10 pF higher. * Device is designed to meet balance requirements of GTS 8700 and GR 974.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Four-Port Balanced Three-chip Protector
Thermal Considerations
Package SIP Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 90 Unit C C C/W
+I
+I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IIT
T
IIS S IIH H IIDRM DRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I
V-I Characteristics tr x td Pulse Waveform
-I
Percent of VS Change - %
14 12 10 8
IH IH (TC = 25 C)
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
6 4 2 0 -4 -6 -8
25 C
25 C
Ratio of
-40 -20 0 20 40 60 80 100 120 140 160
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
Four-Port Longitudinal Two-chip Protector
Four-Port Longitudinal Two-chip Protector
This hybrid Single In-line Package (SIP) protects four twisted pairs from overcurrent and overvoltage conditions. Comprised of eight discrete DO-214AA SIDACtor devices and eight TeleLink surface mount fuses, it is ideal for densely populated line cards that cannot afford PCB inefficiencies or the use of series power resistors. Surge current ratings up to 500 A are available.
F2 Tip
2 5
F4 Tip
7 10
F6 Tip
12 15
F8 Tip
17 20
Z2 Gnd
3
Z4 Gnd
8
Z6 Gnd
13
Z8 Gnd
18
Z1 Ring
4 1
Z3 Ring
9 6
Z5 Ring
14 11
Z7 Ring
19 16
F1
F3
F5
F7
Electrical Parameters
VDRM Volts Part Number * P0602Z_ P1402Z_ P1602Z_ P2202Z_ P2702Z_ P3002Z_ P3602Z_ P4202Z_ P4802Z_ P6002Z_ VS Volts VDRM Volts VS Volts VT Volts 4 4 4 4 4 4 4 4 4 4 IDRM Amps 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 50 150 150 150 150 150 150 150 150 150 CO pF Pins 2-3, 3-4 110 50 50 40 40 40 40 30 30 30
Pins 2-3, 4-3, 7-8, 9-8, 12-13, 14-13, 17-18, 19-18 25 58 65 90 120 140 160 190 220 275 40 77 95 130 160 180 220 250 300 350
Pins 2-4, 7-9, 12-14, 17-19 50 116 130 180 240 280 320 380 440 550 80 154 190 260 320 360 440 500 600 700
* For individual "ZA," "ZB," and "ZC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 4-3 and Pins 2-3 at 1 MHz with a 2 V bias and is a typical value for "ZA" product. "ZB" and "ZC" capacitance is approximately 2x higher. * Device is designed to meet balance requirements of GTS 8700 and GR 974. * Lower capacitance MC versions may be available. Contact factory for further information.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Four-Port Longitudinal Two-chip Protector
Thermal Considerations
Package SIP Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 90 Unit C C C/W
+I
+I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IIT
T
IIS S IIH H IIDRM DRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I
V-I Characteristics tr x td Pulse Waveform
-I
Percent of VS Change - %
14 12 10 8
IH IH (TC = 25 C)
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
6 4 2 0 -4 -6 -8
25 C
25 C
Ratio of
-40 -20 0 20 40 60 80 100 120 140 160
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
2 - 43
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Data Sheets
Four-Port Metallic Line Protector
Four-Port Metallic Line Protector
The four-port hybrid Single In-line Package (SIP) line protector protects multiple twisted pair from overcurrent and overvoltage conditions. Based on a SIP, it is equivalent to four discrete DO-214AA SIDACtor devices and four surface mount fuses. Available in surge current ratings up to 500 A, this four-port SIP line protector is ideal for densely populated line cards that cannot afford PCB inefficiencies or the use of series power resistors.
F1 Tip
1 2
F2 Tip
4 5
F3 Tip
7 8
F4 Tip
10 11
Z1
Z2
Z3
Z4
Ring
3
Ring
6
Ring
9
Ring
12
Electrical Parameters
Part Number * P0080Z_ P0300Z_ P0640Z_ P0720Z_ P0900Z_ P1100Z_ P1300Z_ P1500Z_ P1800Z_ P2300Z_ P2600Z_ P3100Z_ P3500Z_ VDRM Volts 6 25 58 65 75 90 120 140 170 190 220 275 320 VS Volts 25 40 77 88 98 130 160 180 220 260 300 350 400 VT Volts 4 4 4 4 4 4 4 4 4 4 4 4 4 IDRM Amps 5 5 5 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 50 50 150 150 150 150 150 150 150 150 150 150 150 CO pF 100 110 50 50 50 40 40 40 30 30 30 30 30
* For individual "ZA," "ZB," and "ZC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for "ZA" and "ZB" product. "ZC" capacitance is approximately 2x the listed value. * Lower capacitance MC versions may be available. Contact factory for further information.
Surge Ratings
IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500
Series A B C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Four-Port Metallic Line Protector
Thermal Considerations
Package SIP Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 90 Unit C C C/W
+I
+I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IIT
T
IIS S IIH H IIDRM DRM
-V -V VT VT VDRM VDRM VS V
S
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
0 0 tr td t - Time (s)
-I
V-I Characteristics tr x td Pulse Waveform
-I
Percent of VS Change - %
14 12 10 8
IH IH (TC = 25 C)
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
6 4 2 0 -4 -6 -8
25 C
25 C
Ratio of
-40 -20 0 20 40 60 80 100 120 140 160
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
Fixed Voltage SLIC Protector
Fixed Voltage SLIC Protector
(T/R)
(G)
These DO-214AA unidirectional protectors are constructed with a SIDACtor device and an integrated diode. They protect SLICs (Subscriber Line Interface Circuits) from damage during transient voltage activity and enable line cards to meet various regulatory requirements including GR 1089, ITU K.20, K.21 and K.45, IEC 60950, UL 60950, and TIA968 (formerly known as FCC Part 68). For specific design criteria, see details in Figure 3.21.
Cathode
Electrical Parameters
Part Number * P0641S_ P0721S_ P0901S_ P1101S_ VDRM Volts 58 65 75 95 VS Volts 77 88 98 130 VT Volts 4 4 4 4 VF Volts 5 5 5 5 IDRM Amps 5 5 5 5 IS mAmps 800 800 800 800 IT Amps 1 1 1 1 IH mAmps 120 120 120 120 CO pF 70 70 70 70
* For individual "SA" and "SC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * VDRM is measured at IDRM. * VS and VF are measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value for "SA" and "SB" product. "SC" capacitance is approximately 2x the listed value. * Parallel capacitive loads may affect electrical parameters.
Surge Ratings (Preliminary Data)
IPP 2x10 s Amps 150 500 IPP 8x20 s Amps 150 400 IPP 10x160 s Amps 90 200 IPP 10x560 s Amps 50 120 IPP 10x1000 s Amps 45 100 ITSM 60 Hz Amps 20 50 di/dt Amps/s 500 500
Series A C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Fixed Voltage SLIC Protector
Thermal Considerations
Package DO-214AA Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 90 Unit C C C/W
+I
+I
tr = rise time to peak value td = decay time to half value
IT IS IH
VS VDRM VT
VF
IPP - Peak Pulse Current - %IPP
100
Peak Value
Waveform = tr x td
IDRM
-V -V +V +V
50
Half Value
VT
IDRM IH IS IT
VDRM VS
0 0 tr td t - Time (s)
-I
-I
V-I Characteristics tr x td Pulse Wave-form
14
Percent of VS Change - %
10
IH (TC = 25 C)
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
IH
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature
Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
Twin SLIC Protector
Twin SLIC Protector
1 (T) 3 (R) 2 (G)
Subscriber Line Interface Circuits (SLIC) are highly susceptible to transient voltages, such as lightning and power cross conditions. To minimize this threat, Teccor provides this dualchip, fixed-voltage SLIC protector device. For specific design criteria, see details in Figure 3.23.
Electrical Parameters
Part Number * P0641CA2 P0721CA2 P0901CA2 P1101CA2 VDRM Volts 58 65 75 95 VS Volts 77 88 98 130 VDRM Volts 58 65 75 95 VS Volts 77 88 98 130 VT Volts 4 4 4 4 VF Volts 5 5 5 5 IDRM Amps 5 5 5 5 IS mAmps 800 800 800 800 IT Amps 1 1 1 1 IH mAmps 120 120 120 120 CO pF 60 60 60 60
Pins 1-2, 2-3
Pins 1-3
* For surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * VDRM is measured at IDRM. * VS and VF are measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured across pins 1-2 or 2-3 at 1 MHz with a 2 V bias. Capacitance across pins 1-3 is approximately half. * Parallel capacitive loads may affect electrical parameters. * Compliance with GR 1089 or UL 60950 power cross tests may require special design considerations. Contact the factory for further information.
Surge Ratings (Preliminary Data)
IPP 2x10 s Amps 150 IPP 8x20 s Amps 150 IPP 10x160 s Amps 90 IPP 10x560 s Amps 50 IPP 10x1000 s Amps 45 ITSM 60 Hz Amps 20 di/dt Amps/s 500
Series A
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Twin SLIC Protector
Thermal Considerations
Package Modified DO-214AA
Pin 3
Symbol TJ TS RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +150 -65 to +150 85
Unit C C C/W
Pin 1
+I +I
IPP - Peak Pulse Current - %IPP
VF
tr = rise time to peak value td = decay time to half value
IT IS IH IDRM
100
Peak Value
VS VDRM -V -V
VT
Waveform = tr x td
+V +V VT
IDRM VDRM IH IS IT -I -I
50
Half Value
VS
0 0 tr td t - Time (s)
V-I Characteristics
tr x td Pulse Wave-form
Percent of VS Change - %
14 12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
IH IH (TC = 25 C)
10
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
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Data Sheets
Pin 2
Multiport SLIC Protector
Multiport SLIC Protector
1 (T1) 2 (G1) 3 (R1) 6 (T2) 5 (G2) 4 (R2)
This multiport line protector is designed as a single-package solution for protecting multiple twisted pair from overvoltage conditions. Based on a six-pin SOIC package, it is equivalent to four discrete DO-214AA packages. Available in surge current ratings up to 500 A for a 2x10 s event, the multiport line protector is ideal for densely populated line cards that cannot afford PCB inefficiencies or the use of series power resistors. For specific design criteria, see details in Figure 3.24.
Electrical Parameters
VDRM Volts Part Number * P0641U_ P0721U_ P0901U_ P1101U_ VS Volts VDRM Volts VS Volts VT Volts 77 88 98 130 4 4 4 4 VF Volts 5 5 5 5 IDRM Amps 5 5 5 5 IS mAmps 800 800 800 800 IT Amps 1 1 1 1 IH mAmps 120 120 120 120 CO pF 70 70 70 70
Pins 1-2, 2-3, 4-5, 5-6 58 65 75 95 77 88 98 130 58 65 75 95
Pins 1-3, 4-6
* For individual "UA" and "UC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * VDRM is measured at IDRM. * VS and VF are measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured across pins 1-2, 2-3, 4-5, or 5-6 at 1 MHz with a 2 V bias and is a typical value. Capacitance across pins 1-3 or 4-6 is approximately half. "UC" capacitance is approximately 2x the listed value for "UA" product. * Parallel capacitive loads may affect electrical parameters.
Surge Ratings
IPP 2x10 s Amps 150 500 IPP 8x20 s Amps 150 400 IPP 10x160 s Amps 90 200 IPP 10x560 s Amps 50 120 IPP 10x1000 s Amps 45 100 ITSM 60 Hz Amps 20 50 di/dt Amps/s 500 500
Series A C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Multiport SLIC Protector
Thermal Considerations
Package Modified MS-013
6 5 4 1 2 3
Symbol TJ TS RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +150 -65 to +150 60
Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
VF
tr = rise time to peak value td = decay time to half value
IT IS IH IDRM
100
Peak Value
VS VDRM -V -V
VT
Waveform = tr x td
+V +V VT
IDRM VDRM IH IS IT -I -I
50
Half Value
VS
0 0 tr td t - Time (s)
V-I Characteristics
tr x td Pulse Wave-form
Percent of VS Change - %
14 12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
IH IH (TC = 25 C)
10
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
Battrax SLIC Protector
Battrax SLIC Protector
This solid state protection device can be referenced to either a positive or negative voltage source. The B1xx0C_ is for a -VREF and the B2050C_ is for a +VREF. Designed using an SCR and a gate diode, the B1xx0C_ Battrax begins to conduct at |-VREF| + |-1.2 V| while the B2050C_ Battrax begins to conduct at |+VREF| + |1.2 V|. For a diagram of a Battrax application, see Figure 3.29.
Pin 2 (Ground) Pin 3 (-VREF) Gate -Battrax B1xx0C_ Pin 1 (Line)
Pin 3 (+VREF)
Pin 1 (Line)
+Battrax B2050C_
Pin 2 (Ground)
Electrical Parameters
Part Number * B1100C_ B1160C_ B1200C_ B2050C_ VDRM Volts |-VREF| + |-1.2 V| |-VREF| + |-1.2 V| |-VREF| + |-1.2 V| |+VREF| + |1.2 V| VS Volts |-VREF| + |-10 V| |-VREF| + |-10 V| |-VREF| + |-10 V| |+VREF| + |10 V| VT Volts 4 4 4 4 IDRM Amps 5 5 5 5 IGT mAmps 100 100 100 50 IT Amps 1 1 1 1 IH mAmps 100 160 200 5 CO pF 50 50 50 50
* For individual "CA" and "CC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * IPP ratings assume VREF = 48 V. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. "CC" product is approximately 2x the listed value. * Positive Battrax information is preliminary data. * VREF maximum value for the negative Battrax is -200 V. * VREF maximum value for the positive Battrax is 110 V.
Surge Ratings
IPP 2x10 s Amps 150 500 IPP 8x20 s Amps 150 400 IPP 10x160 s Amps 90 200 IPP 10x560 s Amps 60 150 IPP 10x1000 s Amps 50 100 ITSM 60 Hz Amps 40 50 di/dt Amps/s 500 500
Series A C
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Battrax SLIC Protector
Thermal Considerations
Package Modified DO-214AA
Pin 3 (VREF)
Symbol TJ TS RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +150 -65 to +150 85
Unit C C C/W
+I +I
IT
+I
IT IS IH IDRM +V +V VT
IDRM VDRM IH IS IT -I
V-I Characteristics for Negative Battrax
IS IH
VS VDRM -V -V
VT
-V
IDRM +V VT VDRM VS
VS
-I
V-I Characteristics for Positive Battrax
Percent of VS Change - %
14 12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
IH IH (TC = 25 C)
10
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
Pin 1 (Line)
Pin 2 (Ground)
Battrax Dual Negative SLIC Protector
Battrax Dual Negative SLIC Protector
(G)
5
This solid state Battrax protection device is referenced to a negative voltage source. Its dual-chip package also includes internal diodes for transient protection from positive surge events. For a diagram of a Battrax application, see Figure 3.27.
1
(T)
2
(-VREF)
3
(R)
Electrical Parameters
Part Number * B1101U_ B1161U_ B1201U_ VDRM Volts |-VREF| + |-1.2V| |-VREF| + |-1.2V| |-VREF| + |-1.2V| VS Volts |-VREF| + |-10V| |-VREF| + |-10V| |-VREF| + |-10V| VT Volts 4 4 4 VF Volts 5 5 5 IDRM Amps 5 5 5 IGT mAmps 100 100 100 IT Amps 1 1 1 IH mAmps 100 160 200 CO pF 50 50 50
* For individual "UA" and "UC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * IPP ratings assume a VREF = -48 V. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. "UC" product is approximately 2x the listed value. * VREF maximum value for the B1101, B1161, and/or B1201 is -200 V.
Surge Ratings
IPP 2x10 s Amps 150 500 IPP 8x20 s Amps 150 400 IPP 10x160 s Amps 90 200 IPP 10x560 s Amps 50 120 IPP 10x1000 s Amps 45 100 ITSM 60 Hz Amps 20 50 di/dt Amps/s 500 500
Series A C**
** Call factory for release date.
http://www.teccor.com +1 972-580-7777
2 - 54
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Battrax Dual Negative SLIC Protector
Thermal Considerations
Package Modified MS-013
6 5 4 1 2 3
Symbol TJ TS RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +125 -65 to +150 60
Unit C C C/W
+I +I
IPP - Peak Pulse Current - %IPP
VF
tr = rise time to peak value td = decay time to half value
IT IS IH IDRM
100
Peak Value
VS VDRM -V -V
VT
Waveform = tr x td
+V +V VT
IDRM VDRM IH IS IT -I -I
50
Half Value
VS
0 0 tr td t - Time (s)
V-I Characteristics
tr x td Pulse Wave-form
Percent of VS Change - %
14 12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
IH IH (TC = 25 C)
10
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
Battrax Dual Positive/Negative SLIC Protector
Battrax Dual Positive/Negative SLIC Protector
(+VREF) 5
This Battrax device protects Subscriber Line Interface Circuits (SLIC) that use both a positive and negative Ring voltage. It limits transient voltages with rise times of 100 V/ s to VREF 10 V. Teccor's six-pin Battrax devices are constructed using four SCRs and four gate diodes. The SCRs conduct when a voltage that is more negative than -VREF (and/or more positive than +VREF) is applied to the cathode (Pins 1 and 3) of the SCR. During conduction, the SCRs appear as a low-resistive path which forces all transients to be shorted to ground. For a diagram of a Battrax application, see Figure 3.30.
Ground 4, 6
1 (T)
2 (-VREF)
3 (R)
Electrical Parameters
Part Number * B3104U_ B3164U_ B3204U_ VDRM Volts |-VREF| + |1.2V| |-VREF| + |1.2V| |-VREF| + |1.2V| VS Volts |-VREF| + |10V| |-VREF| + |10V| |-VREF| + |10V| VT Volts 4 4 4 IDRM Amps 5 5 5 IGT mAmps 100 100 100 IT Amps 1 1 1 IH mAmps 100 160 200 CO pF 50 50 50
* For individual "UA" and "UC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * IPP ratings assume a VREF = 48 V. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. "UC" product is approximately 2x the listed value. * Positive Battrax information is preliminary data. * VREF maximum value for the negative Battrax is -200 V. * VREF maximum value for the positive Battrax is 110 V.
Surge Ratings
IPP 2x10 s Amps 150 500 IPP 8x20 s Amps 150 400 IPP 10x160 s Amps 90 200 IPP 10x560 s Amps 50 120 IPP 10x1000 s Amps 45 100 ITSM 60 Hz Amps 20 50 di/dt Amps/s 500 500
Series A C**
** Call factory for release date.
http://www.teccor.com +1 972-580-7777
2 - 56
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Battrax Dual Positive/Negative SLIC Protector
Thermal Considerations
Package Modified MS-013
6 5 4 1 2
Symbol TJ TS RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +125 -65 to +150 60
Unit C C C/W
+I
IPP - Peak Pulse Current - %IPP
Positive Battrax Characteristics
tr = rise time to peak value td = decay time to half value
IT IS IH IDRM -V -V
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
VT
VDRM DRM
VS VS
Negative Battrax Characteristics -I -I
V-I Characteristics
0 0 tr td t - Time (s)
tr x td Pulse Wave-form
14
Percent of VS Change - %
12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
IH IH (TC = 25 C)
10
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
3
Battrax Quad Negative SLIC Protector
Battrax Quad Negative SLIC Protector
(T) 6 Ground 5 (R) 4
This Battrax device is an integrated overvoltage protection solution for SLIC-based (Subscriber Line Interface Circuit) line cards. This six-pin device is constructed using four SCRs and four gate diodes. The device is referenced to VBAT and conducts when a voltage that is more negative than -VREF is applied to the cathode (pins 1, 3, 4, or 6) of the SCR. During conduction, all negative transients are shorted to Ground. All positive transients are passed to Ground by steering diodes. For specific diagrams showing these Battrax applications, see Figure 3.28.
1 (T)
2 (-VREF)
3 (R)
Electrical Parameters
Part Number * B1101U_4 B1161U_4 B1201U_4 VDRM Volts |-VREF| + |-1.2V| |-VREF| + |-1.2V| |-VREF| + |-1.2V| VS Volts |-VREF| + |-10V| |-VREF| + |-10V| |-VREF| + |-10V| VT Volts 4 4 4 IDRM Amps 5 5 5 IGT mAmps 100 100 100 IT Amps 1 1 1 IH mAmps 100 160 200 CO pF 50 50 50
* For individual "UA" and "UC" surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * IPP ratings assume a VREF = 48 V. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value. "UC" product is approximately 2x the listed value. * VREF maximum value for the negative Battrax is -200 V.
Surge Ratings
IPP 2x10 s Amps 150 500 IPP 8x20 s Amps 150 400 IPP 10x160 s Amps 90 200 IPP 10x560 s Amps 50 120 IPP 10x1000 s Amps 45 100 ITSM 60 Hz Amps 20 50 di/dt Amps/s 500 500
Series A C
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2 - 58
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Battrax Quad Negative SLIC Protector
Thermal Considerations
Package Modified MS-013
6 5 4 1 2
Symbol TJ TS RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient
Value -40 to +125 -65 to +150 60
Unit C C C/W
+I
IPP - Peak Pulse Current - %IPP
Positive Battrax Characteristics
tr = rise time to peak value td = decay time to half value
IT IS IH IDRM -V -V
100
Peak Value
Waveform = tr x td
+V +V
50
Half Value
VT
VDRM DRM
VS VS
Negative Battrax Characteristics -I -I
V-I Characteristics
0 0 tr td t - Time (s)
tr x td Pulse Wave-form
Percent of VS Change - %
14 12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
IH IH (TC = 25 C)
10
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
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Data Sheets
3
CATV and HFC SIDACtor Device
CATV and HFC SIDACtor Device
1 3
This SIDACtor device is a 1000 A solid state protection device offered in a TO-220 package. It protects equipment located in the severe surge environment of Community Antenna TV (CATV) applications. Used in Hybrid Fiber Coax (HFC) applications, this device replaces the gas tube traditionally used for station protection, because a SIDACtor device has a much tighter voltage tolerance.
Electrical Parameters
Part Number * P1400AD P1800AD VDRM Volts 120 170 VS Volts 160 220 VT Volts 3 5.5 IDRM Amps 5 5 IS mAmps 800 800 IT Amps 2.2 2.2 IH mAmps 50 50 CO pF Pins 1-3 200 150
* For surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Surge Ratings
IPP 8x20 s Amps 1000 IPP 10x1000 s Amps 250 ITSM 60 Hz Amps 120 di/dt Amps/s 500
Series D
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CATV and HFC SIDACtor Device
Thermal Considerations
Package Modified TO-220 Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 60 Unit C C C/W
1
3
+I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IS IH IDRM -V VT VDRM VS +V
100
Peak Value
Waveform = tr x td
50
Half Value
0 0 tr td t - Time (s)
-I
V-I Characteristics tr x td Pulse Wave-form
Percent of VS Change - %
14 12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
IH IH (TC = 25 C)
10
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
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Data Sheets
High Surge Current SIDACtor Device
High Surge Current SIDACtor Device
1 (T) 3 (R) 2 (G)
This SIDACtor device is a 1000 A solid state protection device offered in a TO-220 package. It protects equipment located in the severe surge environment of Community Antenna TV (CATV) applications. This device can replace the gas tubes traditionally used for station protection because SIDACtor devices have much tighter voltage tolerances.
Electrical Parameters
Part Number * P6002AD VDRM Volts 550 VS Volts 700 VT Volts 5.5 IDRM Amps 5 IS mAmps 800 IT Amps 2.2 IH mAmps 50 CO pF Pins 1-3 60
* For surge ratings, see table below.
Electrical Parameters
Part Number * P3100AD VDRM Volts 280 VS Volts 360 VT Volts 5.5 IDRM Amps 5 IS mAmps 800 IT Amps 2.2 IH mAmps 120 CO pF Pins 1-3 115
* For surge ratings, see table below. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Surge Ratings
IPP 8x20 s Amps 1000 IPP 10x1000 s Amps 250 ITSM 60 Hz Amps 120 di/dt Amps/s 1000
Series D
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High Surge Current SIDACtor Device
Thermal Considerations
Package Modified TO-220 Symbol TJ TS RqJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +150 -65 to +150 60 Unit C C C/W
PIN 1 PIN 2
PIN 3
Note: P6002AD is shown. P3100AD has no center lead.
+I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IS IH IDRM -V VT VDRM VS +V
100
Peak Value
Waveform = tr x td
50
Half Value
0 0 tr td t - Time (s)
-I
V-I Characteristics tr x td Pulse Wave-form
Percent of VS Change - %
14 12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
IH IH (TC = 25 C)
10
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
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Data Sheets
CATV Line Amplifiers/Power Inserters SIDACtor Device
CATV Line Amplifiers/Power Inserters SIDACtor Device
1 2
This SIDACtor device is a 5000 A solid state protection device offered in a non-isolated TO-218 package. It protects equipment located in the severe surge environment of CATV (Community Antenna TV) applications. In CATV line amplifiers and power inserters, this device can replace the gas tubes traditionally used for station protection because SIDACtor devices have much tighter voltage tolerances.
Electrical Parameters
Part Number * P1900ME P2300ME VDRM Volts 140 180 VS Volts 220 260 VT Volts 4 4 IDRM Amps 5 5 IS mAmps 800 800 IT Amps ** 2.2/25 2.2/25 IH mAmps 50 50 CO pF 750 750
* For surge ratings, see table below. ** IT is a free air rating; heat sink IT rating is 25 A. General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured at 1 MHz with a 2 V bias and is a typical value.
Surge Ratings
IPP 8x20 s Amps 5000 ITSM 60 Hz Amps 400 di/dt Amps/s 500
Series E
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
CATV Line Amplifiers/Power Inserters SIDACtor Device
Thermal Considerations
Package TO-218
2
Symbol TJ TS TC RqJC * RqJA
Parameter Operating Junction Temperature Range Storage Temperature Range Maximum Case Temperature Thermal Resistance: Junction to Case Thermal Resistance: Junction to Ambient
Value -40 to +150 -65 to +150 100 1.7 56
Unit C C C C/W C/W
1
2
3 (No Connection)
* RqJC rating assumes the use of a heat sink and on state mode for extended time at 25 A, with average power dissipation of 29.125 W.
+I
IPP - Peak Pulse Current - %IPP
tr = rise time to peak value td = decay time to half value
IT IS IH IDRM -V VT VDRM VS +V
100
Peak Value
Waveform = tr x td
50
Half Value
0 0 tr td t - Time (s)
-I
V-I Characteristics tr x td Pulse Wave-form
Percent of VS Change - %
14 12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160
IH IH (TC = 25 C)
10
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160
25 C
25 C
Ratio of
Case Temperature (TC) - C
Junction Temperature (TJ) - C
Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature
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Data Sheets
TeleLink Fuse
TeleLink Fuse
The TeleLink Surface Mount (SM) surge resistant fuse offers circuit protection without requiring a series resistor. When used in conjunction with the SIDACtor Transient Voltage Suppressor (TVS), the TeleLink SM fuse and the SIDACtor TVS provide a complete regulatory-compliant solution for standards such as GR 1089, TIA-968 (formerly known as FCC Part 68), UL 60950, and ITU K.20 and K.21. No series resistor is required for the F1250T and F1251T to comply with these standards. Contact factory for enhanced K.20 and K.21 details.
Surge Ratings
IPP 2x10 s Amps not rated 500 500 IPP 10x160 s Amps 75 160 160 IPP 10x560 s Amps 45 115 115 IPP 10x1000 s Amps 35 100 100
TeleLink SM Fuse F0500T F1250T F1251T
Interrupting Values
TeleLink SM Fuse F0500T F1250T F1251T Voltage Rating 250 V 250 V 250 V Current Rating 500 mA 1.25 A 2A I2t Measured at DC Rated Voltage 1.3 A2s 22.2 A2s 30 A2s Interrupting Rating Voltage, Current 600 V, 40 A 600 V, 60 A * 600 V, 60 A * MIN 1 ms 1 ms 1 ms TYP 2 ms 2 ms 2 ms MAX 60 ms 60 ms 60 ms
* Interrupt test characterized at 50 to 70 phase angle. Phase angles approximating 90 may result in damage to the body of the fuse. Notes: * The TeleLink SM fuse is designed to carry 100% of its rated current for four hours and 250% of its rated current for one second minimum and 120 seconds maximum. Typical time is four to 10 seconds. For optimal performance, an operating current of 80% or less is recommended. * I2t is a non-repetitive RMS surge current rating for a period of 16.7 ms.
Resistance Ratings
TeleLink SM Fuse F0500T F1250T F1251T Typical Voltage Drop @ Rated Current 0.471 V 0.205 V 0.110 V DC Cold Resistance MIN 0.420 W 0.107 W 0.050 W MAX 0.640 W 0.150 W 0.100 W
Notes: * Typical inductance @ 4 H up to 500 MHz. * Resistance changes 0.5% for every C. * Resistance is measured at 10% rated current.
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TeleLink Fuse
Qualification Data
The F1250T and F1251T meet the following test conditions per GR 1089 without additional series resistance. However, in-circuit test verification is required. Note that considerable heating may occur during Test 4 of the Second Level AC Power Fault Test.
First Level Lightning Surge Test
1 2 3 4 5
600 1000 1000 2500 1000
10x1000 10x360 10x1000 2x10 10x360
100 100 100 500 25
25 25 25 10 5
Second Level Lightning Surge Test
Test 1 Surge Voltage Volts 5000 Wave-form s 2x10 Surge Current Amps 500 Repetitions Each Polarity 1
First Level AC Power Fault Test
Test 1 2 3 4 5 6 7 8 9 Applied Voltage, 60 Hz VRMS 50 100 200, 400, 600 1000 * 600 600 600 1000 Short Circuit Current Amps 0.33 0.17 1 at 600 V 1 * 0.5 2.2 3 5 Duration 15 min 15 min 60 applications, 1 s each 60 applications, 1 s each 60 applications, 5 s each 30 s each 2 s each 1 s each 0.5 s each
* Test 5 simulates a high impedance induction fault. For specific information, please contact Teccor Electronics.
Second Level AC Power Fault Test for Non-Customer Premises Equipment
Test 1 2 3 4 Applied Voltage, 60 Hz VRMS 120, 277 600 600 100-600 Short Circuit Current Amps 30 60 7 2.2 at 600 V Duration 30 min 5s 5s 30 min
Notes: * Power fault tests equal or exceed the requirements of UL 60950 3rd edition. * Test 4 is intended to produce a maximum heating effect. Temperature readings can exceed 150 C. * Test 2 may be dependent on the closing angle of the voltage source. Fuse is characterized at 50 to 70. Closing angles approximating 90 may result in damage to the body of the fuse. * Use caution when routing internal traces adjacent to the F1250T and F1251T.
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Data Sheets
Test
Surge Voltage Volts
Wave-form s
Surge Current Amps
Repetitions Each Polarity
TeleLink Fuse
1000 800 700 600 500 400 300 200
100 90 80 70 60 50 40 30 20
F0500T
10 9 8 7 6 5 4 3 2
F1250T
F1251T
Time in seconds
1 .9 .8 .7 .6 .5 .4 .3
.2
.1 .09 .08 .07 .06 .05 .04 .03 .02
.01
.1
.2
.3
.4
.5
.6 .7 .8 .9 1
2
3
4
5
6
7 8 9 10
20
30
40
50 60 70 80 90100
Current in Amperes
Time Current Curve
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TeleLink Fuse
Temperature Derating Curve
Operating temperature is -55 C to +125 C with proper correction factor applied.
150 140 130 120
Percent of Rating
110 100 90 80 70 60 50 40 30 -55 -60 -40 -20 0 20 40 60 80 100 125
Effect on Current Rating
Ambient C
Chart of Correction Factor
Maximum Temperature Rise
TeleLink Fuse F0500T F1250T F1251T * Higher currents and PCB layout designs can affect this parameter. Notes: * Readings are measured at rated current after temperature stabilizes * The F1250T meets the requirements of UL 248-14. However, board layout, board trace widths, and ambient temperature values can cause higher than expected rises in temperature. During UL testing, the typical recorded heat rise for the F1250T at 2.2 A was 120 C. Temperature Reading 75 C (167 F) * 75 C (167 F) * 75 C (167 F) *
Package Symbolization
Marking FU FT JU JT NU NT F0500T F F J J N N U T U T F1250T F1251T Manufactured in USA U T Manufactured in Taiwan
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Data Sheets
NOTES
3 Reference Designs
This section offers specific examples of how SIDACtor devices can be used to ensure longterm operability of protected equipment and uninterrupted service during transient electrical activity. For additional line interface protection circuits, see "Regulatory Compliant Solutions" on page 4-34. Customer Premises Equipment (CPE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 High Speed Transmission Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7 ADSL Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7 HDSL Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 ISDN Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 Pair Gain Circuit Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-11 T1/E1 Circuit Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14 Additional T1 Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16 T3 Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16 Analog Line Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-17 PBX Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-25 CATV Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26 Primary Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29 Secondary Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-31 Triac Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-33 Data Line Protectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34 LAN / WAN Protectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-35 10Base-T Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-35 100Base-T Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36 Note: The circuits referenced in this section represent typical interfaces used in telecommunications equipment. SIDACtor devices are not the sole components required to pass applicable regulatory requirements such as UL 60950, GR 1089, or TIA-968 (formerly known as FCC Part 68), nor are these requirements specifically directed at SIDACtor devices.
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Reference Designs
Customer Premises Equipment (CPE)
Customer Premises Equipment (CPE)
CPE is defined as any telephone terminal equipment which resides at the customer's site and is connected to the Public Switched Telephone Network (PSTN). Telephones, modems, caller ID adjunct boxes, PBXs, and answering machines are all considered CPE.
Protection Requirements
CPE should be protected against overvoltages that can exceed 800 V and against surge currents up to 100 A. In Figure 3.1 through Figure 3.6, SIDACtor devices were chosen because their associated peak pulse current (IPP) rating is sufficient to withstand the lightning immunity test of TIA-968 (formerly known as FCC Part 68) without the additional use of series line impedance. Likewise, the fuse shown in Figure 3.1 through Figure 3.6 was chosen because the amps2time (I2t) rating is sufficient to withstand the lightning immunity tests of TIA-968 without opening, but low enough to pass UL power cross conditions. The following regulatory requirements apply: * TIA-968 (formerly known as FCC Part 68) * UL 60950 All CPE intended for connection to the PSTN must be registered in compliance with TIA-968. Also, because the National Electric Code mandates that equipment intended for connection to the telephone network be listed for that purpose, consideration should be given to certifying equipment with an approved safety lab such as Underwriters Laboratories.
CPE Reference Circuits
Figure 3.1 through Figure 3.6 show examples of interface circuits which meet all applicable regulatory requirements for CPE. The P3100SB and P3100EB are used in these circuits because the peak off-state voltage (VDRM) is greater than the potential of a Type B ringer superimposed on a POTS (plain old telephone service) battery. 150 VRMS O2 + 56.6 VPK = 268.8 VPK Note that the circuits shown in Figure 3.1 through Figure 3.6 provide an operational solution for TIA-968 (formerly known as FCC Part 68). However TIA-968 allows CPE designs to pass non-operationally as well. For a non-operational solution, coordinate the IPP rating of the SIDACtor device and the I2t rating of the fuse so that (1) both will withstand the Type B surge, and (2) during the Type A surge, the fuse will open. (See Table 5.1, Surge Rating Correlation to Fuse Rating on page 5-8.) Note: For alternative line interface protection circuits, see "Regulatory Compliant Solutions" on page 4-34.
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Reference Designs
Customer Premises Equipment (CPE)
F1250T Tip
P3100SB or P3100EB
To Protected Components
Ring
Figure 3.1
Basic CPE Interface
Transmit / Receive F1250T Tip P3100SB or P3100EB Ring
+
-
Ring Detect
+
Figure 3.2
Transformer Coupled Tip and Ring Interface
F1250T Tip P3100SB or P3100EB Ring Relay Transmit/ Receive Circuitry
Ring Detect
Figure 3.3
Modem Interface
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Customer Premises Equipment (CPE)
F1250T Tip
Hook Switch
Transistor Network Interface
Ring Option 1 P3100SB or P3100EB Ringer
Dialer IC
DTMF
Speech Network
Handset
Figure 3.4
CPE Transistor Network Interface -- Option 1
F1250T Tip
Hook Switch
Transistor Network Interface
Ring Ringer
Option 2 P1800SB or P1800EB
Dialer IC
DTMF
Speech Network
Handset
Figure 3.5
CPE Transistor Network Interface -- Option 2
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Reference Designs
Customer Premises Equipment (CPE)
F1250T Tip Transistor Network Interface
P3100SB or P3100EB
Ring
Ring Detect
Note: Different Ground References Shown.
F1250T Tip
P3100SB or P3100EB
Ring
Transistor Network Interface
Ring Detect
Figure 3.6
Two-line CPE Interface
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
High Speed Transmission Equipment
High Speed Transmission Equipment
High speed transmission equipment encompasses a broad range of transmission protocols such as T1/E1, xDSL, and ISDN. Transmission equipment is located at the central office, customer premises, and remote locations.
Protection Requirements
Transmission equipment should be protected against overvoltages that can exceed 2500 V and surge currents up to 500 A. In Figure 3.7 through Figure 3.17, SIDACtor devices were chosen because their associated peak pulse current (IPP) rating is sufficient to withstand the lightning immunity tests of GR 1089 without the additional use of series line impedance. Likewise, the fuse shown in Figure 3.7 through Figure 3.17 was chosen because the amps2time (I2t) rating is sufficient to withstand the lightning immunity tests of GR 1089, but low enough to pass GR 1089 current limiting protector test and power cross conditions (both first and second levels). The following regulatory requirements apply: * TIA-968 (formerly known as FCC Part 68) * GR 1089-CORE * ITU-T K.20/K.21 * UL 60950 Most transmission equipment sold in the US must adhere to GR 1089. For Europe and other regions, ITU-T K.20/K.21 is typically the recognized standard.
ADSL Circuit Protection
Asymmetric Digital Subscriber Lines (ADSLs) employ transmission rates up to 6.144 Mbps from the Central Office Terminal (COT) to the Remote Terminal (RT) and up to 640 kbps from the RT to the COT at distances up to 12,000 feet. (Figure 3.7)
Central Office Site ADSL transceiver unit
Local Loop
Remote Site ADSL transceiver unit ATU-R
video voice data
Digital Network
ATU-C
PSTN
Splitter up to 12 kft
POTS
Figure 3.7
ADSL Overview
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Reference Designs
High Speed Transmission Equipment
Protection Circuitry
Longitudinal protection was not used at either the ADSL Transceiver Unit - Central Office (ATU-C) interface or the ADSL Transceiver Unit - Remote (ATU-R) interface due to the absence of earth ground connections. (Figure 3.8) In both instances, the P3500SC MC SIDACtor device and the F1250T TeleLink fuse provide metallic protection. For ATUs not isolated from earth ground, reference the HDSL protection topology.
F1250T TIP
P3500SC MC
ADSL chip set
RING
Figure 3.8
ADSL Protection
Component Selection
The P3500SC MC SIDACtor device and F1250T TeleLink fuse were chosen to protect the ATUs because both components meet GR 1089 surge immunity requirements without the use of additional series resistance. Although the P3100 series SIDACtor device may be used to meet current ANSI specifications, Teccor recommends the P3500 series to avoid interference with the 20 VP-P x DSL signal on a 150 V rms ringing signal superimposed on a 56.5 V battery.
HDSL Circuit Protection
HDSL (High-bit Digital Subscriber Line) is a digital line technology that uses a 1.544 Mbps (T1 equivalent) transmission rate for distances up to 12,000 feet, eliminating the need for repeaters. The signaling levels are a maximum of 2.5 V while loop powering is typically under 190 V. (Figure 3.9)
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High Speed Transmission Equipment
Central Office Site DS-1 Rate Interface (1.544 Mbps) HDSL transceiver unit 784 kbps Full-Duplex loop HTU-C 784 kbps Full-Duplex loop < 12,000 ft, 200 kHz BW +2.5 V signal level 2B1Q, ZO=135 W
Remote Site HDSL transceiver unit DS-1 Rate Interface (1.544 Mbps)
HTU-R
Figure 3.9
HDSL Overview
Protection Circuitry Reference Designs
Longitudinal protection is required at both the HDSL Transceiver Unit - Central Office (HTU-C) and HDSL Transceiver Unit - Remote (HTU-R) interfaces because of the ground connection used with loop powering. Two P2300SC MC SIDACtor devices provide overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on Ring) provide overcurrent protection. (Figure 3.10) For the transceiver side of the coupling transformer, additional overvoltage protection is provided by the P0080SA SIDACtor device. The longitudinal protection on the primary coil of the transformer is an additional design consideration for prevention of EMI coupling and ground loop issues.
HTU-C/HTU-R Interface Protection F1250T Tip P2300SC MC P2300SC MC Ring F1250T Power Sink HDSL Transceiver P0080SA MC TX
F1250T Tip P2300SC MC P2300SC MC Ring F1250T
Figure 3.10 HDSL Protection
P0080SA MC
RX
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High Speed Transmission Equipment
Component Selection
The P2300SC MC SIDACtor device and the F1250T TeleLink fuse were chosen because both components meet GR 1089 surge immunity requirements without the use of additional series resistance. The P2300SC MC voltage rating was selected to ensure loop powering up to 190 V. For loop powering greater than 190 V, consider the P2600SC MC. The P0080SA MC SIDACtor device was chosen to eliminate any sneak voltages that may appear below the voltage rating of the P2300SC MC.
ISDN Circuit Protection
Integrated Services Digital Network (ISDN) circuits require protection at the Network Termination Layer 1 (NT1) U-interface and at the Terminating Equipment (TE) or Terminating Adapter (TA) S/T interface. Signal levels at the U-interface are typically 2.5 V; however, with sealing currents and maintenance loop test (MLT) procedures, voltages approaching 150 V rms can occur. (Figure 3.11)
Terminal Adapter ISDN Compliant Central Office Switching System CO Network Termination Layer 1 NT1 U Reference T T TA
Non-ISDN Terminal POTS
Terminal Equipment (ISDN Compliant) B1 TE D S TE T NT2 PBX T Reference 4-Wire S TA S Reference, 4-Wire B1 D ISDN Terminal B2 B2
ISDN DSL 2-Wire, 160 kbps 2B1Q 2.5 V
Figure 3.11
ISDN Overview
Protection Circuitry
Longitudinal protection was not used at either the U- or the TA/TE-interface due to the absence of an earth-to-ground connection. (Figure 3.12) At the U-interface, the P2600SC MC SIDACtor device and F1250T TeleLink fuse provide metallic protection, while the TA/TE-interface uses the P0640SC MC SIDACtor device and F1250T TeleLink fuse. Figure 3.12 also shows interfaces not isolated from earth ground.
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High Speed Transmission Equipment
ISDN U-Interface F1250T Tip P2600SC MC Ring TX ISDN Transceiver RX
ISDN S/T Interface
F1250T P0640SC MC
RX ISDN Transceiver TX
F1250T P0640SC MC
Power Source
Power Sink
Figure 3.12
ISDN Protection
Component Selection
The "SC MC" SIDACtor devices and F1250T TeleLink fuse were chosen because these components meet GR 1089 surge immunity requirements without the use of additional series resistance. An MC is chosen to reduce degradation of data rates. The P2600SC MC voltage rating was selected to ensure coordination with MLT voltages that can approach 150 V rms. The voltage rating of the P0640SC MC was selected to ensure coordination with varying signal voltages.
Pair Gain Circuit Protection
A digital pair gain system differs from an ISDN circuit in that ring detection, ring trip, ring forward, and off-hook detection are carried within the 64 kbps bit stream for each channel rather than using a separate D channel. The pair gain system also uses loop powering from 10 V up to 145 V with a typical maximum current of 75 mA. (Figure 3.13)
Central Office (CO)
Remote Terminal (RT) building or pedestal mounted Remote Terminal VF 1 HF HF VF 2
Customer Premises (CP)
Switching System Line 1
MDF
Central Office Terminal (COT) VF 1 VF 2
POTS
Line 2
POTS
Line powered DSL 2-Wire, 160 kbps 2B1Q
Figure 3.13
Pair Gain Overview
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Reference Designs
High Speed Transmission Equipment
Protection Circuitry
Longitudinal protection is required at the Central Office Terminal (COT) interface because of the ground connection used with loop powering. (Figure 3.14) Two P1800SC MC SIDACtor devices provide overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on Ring) provide overcurrent protection. For the U-interface side of the coupling transformer, the illustration shows the P0080SA MC SIDACtor device used for additional overvoltage protection.
Central Office Terminal (COT) Interface Tip1
F1250T Tip
P1800SC MC Ring1 U-Interface Tip2 P1800SC MC Ring2 Ring F1250T Power Source
Figure 3.14 Pair Gain COT Protection
P0080SA
For Customer Premises (CP) and Remote Terminal (RT) interfaces where an earth ground connection is not used, only metallic protection is required. Figure 3.15 shows metallic protection satisfied using a single P3100SC MC across Tip and Ring and a single F1250T on either Tip or Ring to satisfy metallic protection.
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High Speed Transmission Equipment
Remote Terminal Interface F1250T Tip U-Interface P3100SC MC Ring F1250T Power Sink P3100SC MC Ring Detect Ring Trip Ring Forward Off-Hook Detection F1250T P3100SC MC
CPE Interface
CPE Line 1
Line 2
Figure 3.15
Pair Gain RT Protection
Component Selection
The "SC MC" SIDACtor device and F1250T TeleLink fuse were chosen because both components meet GR 1089 surge immunity requirements without the use of additional series resistance. An MC is chosen to reduce degradation of data rates. The voltage rating of the P1800SC MC was selected to ensure coordination with loop powering up to 150 V. The voltage rating of the P3100SC MC was selected to ensure coordination with POTS ringing and battery voltages.
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Reference Designs
High Speed Transmission Equipment
T1/E1 Circuit Protection
T1/E1 networks offer data rates up to 1.544 Mbps (2.058 for E1) on four-wire systems. Signal levels on the transmit (TX) pair are typically between 2.4 V and 3.6 V while the receive (RX) pair could go as high as 12 V. Loop powering is typically 130 V at 60 mA, although some systems can go as high as 150 V. (Figure 3.16)
Central Office T1 Transceiver 3000 ft
Line Regenerator 6000 ft
Line Regenerator
TX Pair
RX Pair
Line powered DLC Four-wire,1.544 Mbps/2.048 Mbps
Figure 3.16
T1/E1 Overview
Protection Circuitry
Longitudinal protection is required at the Central Office Terminal (COT) interface because of the ground connection used with loop powering. (Figure 3.17) Two P1800SC MC SIDACtor devices provide overvoltage protection and two F1250T TeleLink fuses (one on Tip, one on Ring) provide overcurrent protection. The P1800SC MC device is chosen because its VDRM is compliant with TIA-968 regulations, Section 4.4.5.2, "Connections with protection paths to ground." These regulations state: Approved terminal equipment and protective circuitry having an intentional dc conducting path to earth ground for protection purposes at the leakage current test voltage that was removed during the leakage current test of section 4.3 shall, upon its replacement, have a 50 Hz or 60 Hz voltage source applied between the following points: a. Simplexed telephone connections, including Tip and Ring, Tip-1 and Ring-1, E&M leads and auxiliary leads b. Earth grounding connections The voltage shall be gradually increased from zero to 120 V rms for approved terminal equipment, or 300 V rms for protective circuitry, then maintained for one minute. The current between (a) and (b) shall not
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High Speed Transmission Equipment
exceed 10 mAPK at any time. As an alternative to carrying out this test on the complete equipment or device, the test may be carried out separately on components, subassemblies, and simulated circuits, outside the unit, provided that the test results would be representative of the results of testing the complete unit.
COT F1250T P1800SC MC TX P0300SA P1800SC MC T1 Transceiver
Regenerator F1250T
P0640SC MC
RX
Power Source F1250T P1800SC MC F1250T
T1 Transceiver
RX
P0300SA P1800SC MC F1250T
P0640SC MC
TX
Figure 3.17
T1/E1 Protection
The peak voltage for 120 V rms is 169.7 V. The minimum stand-off voltage for the P1800 is 170 V, therefore, the P1800SC MC will pass the test in Section 4.4.5.2 by not allowing 10 mA of current to flow during the application of this test voltage. For the transceiver side of the coupling transformer, additional overvoltage protection is shown in Figure 3.17 using the P0300SA SIDACtor device. When an earth ground connection is not used, only metallic protection is required. Metallic protection is satisfied using a single P0640SC MC SIDACtor device across Tip and Ring and a single F1250T TeleLink fuse on either Tip or Ring.
Component Selection
The "SC MC" SIDACtor device and F1250T TeleLink fuse were chosen because these components meet GR 1089 surge immunity requirements without the use of additional series resistance. An MC is chosen to reduce degradation of data rates. The voltage rating of the P1800SC MC was selected to ensure loop powering up to 150 V. The voltage rating of the P0640SC MC was selected to ensure coordination with varying voltage signals.
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Reference Designs
F1250T
High Speed Transmission Equipment
Additional T1 Design Considerations
A T1 application can be TIA-968 approved as two different possible device types. An XD device means an external CSU is used and the unit does not have to meet the TIA-968 environmental test conditions, but it must connect only behind a separately registered DE device. This XD equipment does not have to meet the T1 pulse template requirements. If not classified as an XD device, then typically the application must adhere to TIA-968 environmental test conditions.
T3 Protection
The capacitance across the pair of wires = (D1 || D2) + P0640EC/SC. The diode capacitance is approximately (10 pF || 10 pF) 20 pF. Then adding the capacitive effect of the P0640EC/SCMC, which is typically 60 pF, the total capacitance across the pair of wires is approximately 15 pF. The MUR 1100E diodes are fast-switching diodes that will exhibit this level of capacitance. MURS160T3 is a surface mount equivalent. (Figure 3.18)
F1250T
D1
D2
P0640EC/SC MC or P0720EC/SC MC
Figure 3.18
T3 Protection
Alternately, the advanced P0642SA exhibits very low capacitance and can be used as a stand-alone device.
P0642SA
Figure 3.19
Alternate T3 Protection
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Analog Line Cards
Analog Line Cards
Given that line cards are highly susceptible to transient voltages, network hazards such as lightning and power cross conditions pose a serious threat to equipment deployed at the central office and in remote switching locations. To minimize this threat, adequate levels of protection must be incorporated to ensure reliable operation and regulatory compliance.
Protection Requirements
When designing overvoltage protection for analog line cards, it is often necessary to provide both on-hook (relay) and off-hook (SLIC) protection. This can be accomplished in two stages, as shown in Figure 3.20.
F1250T
On Hook Protection
R E L A Y
Off Hook Protection
S L I C
F1250T
Figure 3.20
SLIC Overview
The following regulatory requirements may apply: * GR 1089-CORE * ITU-T K.20/K.21 * UL 60950 * TIA-968 (formerly known as FCC Part 68)
On-Hook (Relay) Protection
On-hook protection is accomplished by choosing a SIDACtor device that meets the following criteria to ensure proper coordination between the ring voltage and the maximum voltage rating of the relay to be protected. VDRM > VBATT + VRING VS VRelay Breakdown This criterion is typically accomplished using two P2600S_ SIDACtor devices (where _ denotes the surge current rating) connected from Tip to Ground and Ring to Ground. However, for applications using relays such as an LCAS (Line Card Access Switch), consider the P1200S_ from Tip to Ground and the P2000S_ from Ring to Ground.
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Reference Designs
Analog Line Cards
Off-Hook (SLIC) Protection
Off-hook protection is accomplished by choosing a SIDACtor device that meets the following criteria to ensure proper coordination between the supply voltage (VREF) and the maximum voltage rating of the SLIC to be protected. VDRM > VREF VS VSLIC Breakdown This criterion can be accomplished in a variety of different ways. For applications using an external ring generator and a fixed battery voltage, two P0641S_ SIDACtor devices (P0721S_, P0901S_, or P1101S_ depending on the value of VREF) are used -- one Tip to Ground, one Ring to Ground. For applications using a ring-generating SLIC such as AMD's Am79R79, the B1XX0C_ or B1XX1U_ can be used.
IPP Selection
The IPP of the SIDACtor device must be greater than or equal to the maximum available surge current (IPK(available)) of the applicable regulatory requirements. Calculate the maximum available surge current by dividing the peak surge voltage supplied by the voltage generator (VPK) by the total circuit resistance (RTOTAL). The total circuit resistance is determined by adding the source resistance (RS) of the surge generator to the series resistance in front of the SIDACtor device on Tip and Ring (RTIP and RRING). IPP IPK(available) IPK(available) = VPK / RTOTAL For metallic surges: RTOTAL = RS + RTIP + RRING For longitudinal surges: RTOTAL = RS + RTIP RTOTAL = RS + RRING
Reference Diagrams
Figure 3.21 shows the use of Teccor's "SC" rated SIDACtor devices and the F1250T TeleLink fuse to meet the surge immunity requirements of GR 1089. Teccor's P1200SC and P2000SC, specifically designed to protect Agere Systems (formerly Lucent Microelectronics) Line Card Access Switch (LCAS), provide on-hook protection. Two P0641SCs provide off-hook protection. Any additional series resistance is absent because the "C" series SIDACtor device and F1250T TeleLink fuse are designed to withstand GR 1089 surges without the aid of additional components such as line feed resistors and PTCs.
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Analog Line Cards
F1250T Tip P1200SC L C A S P2000SC Ring F1250T
Figure 3.21 SLIC Protection for LCAS
P0641SC S L I C P0641SC
Figure 3.22 illustrates uses of asymmetrical SIDACtor protection for overvoltage conditions and the F1250T for overcurrent conditions.
F1250T Tip P1200SC P2500SC P2500SC Ring F1250T with internal protection
A G E R E
S L I C
Figure 3.22
SLIC Asymmetrical Protection
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Reference Designs
Analog Line Cards
Figure 3.23 illustrates the use of the P2600SA and P0721CA2 for overvoltage protection and the F0500T for overcurrent protection in addition to 20 W of series resistance on both Tip and Ring. The series resistance is required to limit the transient surge currents to within the surge current rating of the "A" series SIDACtor devices and the F0500T TeleLink fuse.
20 Tip
F0500T
P0721CA2
P2600SA
P2600SA Ring 20
Figure 3.23
R E L A Y
S L I C
F0500T
SLIC Protection with Fixed Voltage SIDACtor Devices
The illustration of SLIC protection in Figure 3.24 shows Teccor's Battrax device protecting Legerity's (formerly AMD's) Am79R79 from overvoltages and uses a F1250T to protect against sustained power cross conditions. The Battrax product was designed specifically to protect SLICs that cannot withstand potential differences greater than VREF 10 V.
-VREF 0.1 F F1250T Tip B1XX0CC 1N4935/ MUR120 Legerity Am79R79 B1XX0CC Ring F1250T 0.1F -VREF
Figure 3.24 SLIC Protection with Programmable Voltage SIDACtor Devices
1N4935/ MUR120
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Analog Line Cards
Figure 3.25 shows protection of a SLIC using 20 W series resistors on both Tip and Ring in addition to Teccor's Battrax (B1100CC) and a diode bridge (General Semiconductor part number EDF1BS). However, the overshoot caused by the diode bridge must be considered. The series resistance (a minimum of 20 W on Tip and 20 W on Ring) limits the simultaneous surge currents of 100 A from Tip to Ground and 100 A from Ring to Ground (200 A total) to within the surge current rating of the SA-rated SIDACtor device and Battrax. The diode bridge shunts all positive voltages to Ground, and the B1100CC shunts all negative voltages greater than |-VREF -1.2 V| to Ground.
-VREF 20 Tip P3100SA F0500T 0.1 F
EDF1BS B1100CC
P3100SA Ring 20 F0500T
Figure 3.25
SLIC Protection with a Single Battrax Device
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Reference Designs
R E L A Y
S L I C
Analog Line Cards
In Figure 3.26 an application that requires 50 W Line Feed Resistors (LFR) uses one B1160CC and two EDF1BS diode bridges in place of multiple SLIC protectors. The overshoot caused by the diode bridge must be considered; however, with this approach it is imperative that the sum of the loop currents does not exceed the Battrax's holding current. In the application shown in Figure 3.26, each loop current would have to be limited to 80 mA. For applications requiring the protection of four twisted pair with one Battrax, use the B1200CC and limit each individual loop current to 50 mA.
50 LFR Tip P3100SA
P3100SA Ring 50 LFR
R E L A Y
EDF1BS
S L I C
B1160CC
50 LFR Tip P3100SA 0.1 F
-VREF
P3100SA Ring 50 LFR
Figure 3.26 SLIC Protection with a Single Battrax Device
R E L A Y
EDF1BS
S L I C
Figure 3.27 and Figure 3.28 show circuits that use negative Battrax devices containing an internal diode for positive surge protection. This obviates using the discrete diodes shown in Figure 3.24.
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Analog Line Cards
-VREF T F1250T B1xx1U_ Am79R79 0.1 F F1250T R
Figure 3.27
SLIC Protection with a Dual Battrax Device
-VREF T1 F1250T 4
5
2 0.1 F
Am79R79
6 R1 F1250T B1XX1U_ T2 F1250T 1
Am79R79
3 R2 F1250T
Figure 3.28
SLIC Protection with a Single Battrax Quad Negative Device
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Reference Designs
Analog Line Cards
Figure 3.29 shows two negative Battrax discrete parts and two positive Battrax discrete parts. This arrangement is required for SLIC applications using both the positive and negative ringing signals. Figure 3.30 shows a similar application but with the two negative Battrax discrete parts and two positive Battrax discrete parts integrated into a single surface mount package.
0.1 F F1250T Tip
+V
REF
-V
REF
0.1 F
B2050C_ B2050C_
B1xx0C_ B1xx0C_
SLIC
Ring F1250T +VREF
Figure 3.29
-VREF
SLIC Protection with discrete positive and negative Battrax Devices
0.1 F F1250T Tip
+VREF
-VREF
0.1 F
SLIC B3104UC
Ring F1250T +VREF
Figure 3.30
-VREF
SLIC Protection with a Battrax Dual Positive/Negative device
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PBX Systems
PBX Systems
Branch Exchange Switches
PBXs, KSUs, and PABXs contain line cards that support various transmission protocols such as ISDN, T1/E1, HDSL, and ADSL (Figure 3.31). PBXs also have features such as a POTS (plain old telephone service) pull-through which allows stations to have outside line access in the event of power failure. All incoming lines to the PBX are subject to environmental hazards such as lightning and power cross.
To Network
Station Cards Line Cards
Logic
Station Primary Protection POTS T1/E1 ADSL HDSL ISDN
PBX
Stations
Figure 3.31 PBX Overview
Protection Requirements
Branch exchange switches should be protected against overvoltages that can exceed 800 V and surge currents up to 100 A. The following regulatory requirements apply: * TIA-968 (formerly known as FCC Part 68) * UL 60950
Branch Exchange Reference Circuit
See the following sections of this data book for interface circuits used to protect of PBX line cards: * For POTS protection, see "Customer Premises Equipment (CPE)" on page 3-3. * For ADSL protection, see "ADSL Circuit Protection" on page 3-7. * For HDSL protection, see "HDSL Circuit Protection" on page 3-8. * For ISDN protection, see "ISDN Circuit Protection" on page 3-10. * For T1/E1 protection, see "T1/E1 Circuit Protection" on page 3-14. * For Station Protection, see "Analog Line Cards" on page 3-17.
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Reference Designs
Station Cards
Matrix Switch
CATV Equipment
CATV Equipment
As cable providers enter the local exchange market, protection of CATV (Community Antenna TV) equipment becomes even more critical in order to ensure reliable operation of equipment and uninterrupted service.
Protection Requirements
CATV line equipment should be able to withstand overvoltages that exceed 6000 V and surge currents up to 5000 A. CATV station protectors should be able to withstand overvoltages that exceed 5000 V and surge currents up to 1000 A. The SIDACtor devices illustrated in Figure 3.32 through Figure 3.35 meet these requirements. The following regulatory requirements may apply: * UL 497C * SCTE IPS-SP-204 * SCTE Practices * NEC Article 830
Power Inserter and Line Amplifier Reference Circuit
Figure 3.32 and Figure 3.33 show how the P1900ME SIDACtor device is used to protect line amplifiers and power supplies versus using two SCRs and one SIDACtor device (Figure 3.34). The P1900ME is used because the peak off-state voltage (VDRM) is well above the peak voltage of the CATV power supply (90 VRMS O2), and the peak pulse current rating (IPP) is 3000 A.
CATV Amplifiers
90 VAC P1900ME
Power Supply
Figure 3.32
CATV Amplifier Diagram
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CATV Equipment
90 VAC RF To Line Amplifiers
P1900ME
Power Port
90 VAC RF
K
G P1800EC
A
To Line Amplifiers
A
G
K
Figure 3.34
CATV Amplifier Protection
Station Protection Reference Circuit
Figure 3.35 shows a P1400AD SIDACtor device used in a CATV station protection application. Note that a compensation inductor may be required to meet insertion and reflection loss requirements for CATV networks. If so, the inductor should be designed to saturate quickly and withstand surges up to 200 V and 1000 A. An inductor with a core permeability of approximately 900 Wb/A*m and wound with 24-gauge wire to an inductance
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Reference Designs
Figure 3.33
CATV Amplifier Protection (incorporated into a power inserter module)
CATV Equipment
of 20 H to 30 H is an example of a suitable starting point, but the actual value depends on the design and must be verified through laboratory testing.
UL Approved Coaxial Fuse Line
Compensating Inductor
To Protected Equipment
P1400AD
Figure 3.35
CATV Station Protection
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Primary Protection
Primary Protection
Primary telecommunications protectors must be deployed at points where exposed twisted pairs enter an office building or residence. This requirement is mandated in North America by the National Electric Code (NEC) to protect end users from the hazards associated with lightning and power cross conditions. Primary protection is provided by the local exchange carrier and can be segregated into three distinct categories: * Station protection -- typically associated with a single twisted pair * Building entrance protection -- typically associated with multiple (25 or more) twisted pair * Central office protection -- typically associated with numerous twisted pair feeding into a switch Station protectors provide primary protection for a single-dwelling residence or office. The station protector is located at the Network Interface Unit (NIU), which acts as the point of demarcation, separating the operating company's lines from the customer's. Building entrance protection is accomplished by installing a multi-line distribution panel with integrated overvoltage protection. These panels are normally located where multiple twisted pairs enter a building. A five-pin protection module plugged into a Main Distribution Frame (MDF) provides Central and Remote Office protection. Like station and building entrance protection, the MDF is located where exposed cables enter the switching office. Teccor also offers a full line of five-pin protectors. For further details, contact factory at protectionsystems@teccor.com or +1 972-580-7777.
Protection Requirements
Station protectors must be able to withstand 300 A 10x1000 surge events. The building entrance protectors and CO protectors must be able to withstand 100 A 10x1000 surge events. Figure 3.36 shows building entrance protector and CO protector asymmetrical solutions. Figure 3.37 shows building entrance protector and CO protector balanced solutions. The following regulatory requirements apply: * UL 497 * GR 974-CORE * ITU K.28
Primary Protection Reference Circuit
Figure 3.36 and Figure 3.37 show different configurations used in primary protection. Note that the peak off-state voltage (VDRM) of any device intended for use in primary protection applications should be greater than the potential of a Type B ringer superimposed on a POTS (plain old telephone service) battery. 150 VRMS O2 + 56.6 VPK = 268.8 VPK
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Reference Designs
Primary Protection
P6002AC or P6002AD
Thermal Overload
Voltage-only Protection
P6002AC or P6002AD
Voltage and Sneak Current Protection
4 W Heat Coil
Figure 3.36 Primary Protection
P3203AC
Thermal Overload
Voltage-only Protection
P3203AC
Voltage and Sneak Current Protection
4 W Heat Coil
Figure 3.37 Balanced Primary Protection
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Secondary Protection
Secondary Protection
Secondary protectors (stand alone units or integrated into strip protectors and UPSs) are adjunct devices used to enhance the protection level of customer premise equipment (CPE). Due to the inadequate level of protection designed into CPE, secondary protectors often are required to prevent premature failure of equipment exposed to environmental hazards (Figure 3.38).
Primary Protector Telephone Network Tip P Ring Network Interface
Customer Premise Equipment Line Impedance S Fax/Modem Secondary Protector Phone
Figure 3.38
CPE Secondary Protection
Protection Requirements
Secondary protectors should be able to withstand overvoltages that can exceed 800 V and surge currents up to 100 A. Figure 3.39 illustrates a SIDACtor device selected because the associated peak pulse current (IPP) is sufficient to withstand the lightning immunity tests of TIA-968 (formerly known as FCC Part 68) without the additional use of series line impedance. Likewise, Figure 3.39 illustrates a fuse selected because the amps2time (I2t) rating is sufficient to withstand the lightning immunity tests of TIA-968, but low enough to pass UL power cross conditions.
F1250T Tip
P3203AB or P3203AC
To CPE Equipment
Ring F1250T
Figure 3.39 CPE Protection
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Reference Designs
Secondary Protection
Secondary Protection Reference Circuit
Figure 3.38 also shows an example of an interface design for a secondary protector. The P3203AB SIDACtor device is used because the peak off-state voltage (VDRM) is greater than the potential of a Type B ringer signal superimposed on the POTS (plain old telephone service) battery. 150 VRMS O2 + 56.6 VPK = 268.8 VPK Coordination between the station protector and the secondary protector occurs due to the line impedance between the two devices. The line impedance helps ensure that the primary protector will begin to conduct while the secondary protector limits any of the let-through voltage to within the VS rating of the SIDACtor device.
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Triac Protection
Triac Protection
Thyristors
Damage can occur to a thyristor if the thyristor's repetitive peak off-state voltage is exceeded. A thyristor's repetitive peak off-state voltage may be exceeded due to dirty AC power mains, inductive spikes, motor latch up, and so on.
Thyristor Reference Circuit
Figure 3.40 and Figure 3.41 show two different methods of protecting a triac. In Figure 3.40, a SIDACtor device is connected from MT2 to the gate of the triac. When the voltage applied to the triac exceeds the SIDACtor device's VDRM, the SIDACtor device turns on, producing a gate current which turns the triac on.
Load 47 MT2 SIDACtor To Gating Circuitry Triac MT1
Hot
Neutral
Figure 3.40
TRIAC Protection
The circuit in Figure 3.41 places a SIDACtor device across MT2 and MT1 of the triac. In this instance the SIDACtor device protects the triac by turning on and shunting the transient before it exceeds the VDRM rating of the triac.
Load
Hot
MT2 Triac To Gating Circuitry MT1 SIDACtor
Neutral
Figure 3.41
TRIAC Protection
With both methods, consider the following designs when using a SIDACtor device to protect a thyristor: * VDRM of the SIDACtor device < VDRM of Triac * SIDACtor device VDRM > 120% VPK(power supply) * SIDACtor device must be placed behind the load
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Reference Designs
Data Line Protectors
Data Line Protectors
In many office and industrial locations, data lines (such as RS-232 and ethernet) and AC power lines run in close proximity to each other, which often results in voltage spikes being induced onto the data line, causing damage to sensitive equipment.
Protection Requirements
Data lines should be protected against overvoltages that can exceed 1500 V and surge currents up to 50 A.
Data Line Reference Circuit
Figure 3.42 shows how a SIDACtor device is used to protect low voltage data line circuits.
TXD P0080SA or P0300SA RXD P0080SA or P0300SA RS-232 I.C.
CTS P0080SA or P0300SA
Figure 3.42
Data Line Protection
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LAN / WAN Protectors
LAN / WAN Protectors
10Base-T Protection
Capacitance across the pair of wires = (D1 || D2) + P0640EA/SA The MUR 1100E diodes capacitance is approximately (10 pF || 10 pF) 20 pF. Then, adding the capacitive effect of the SIDACtor (typically 50 pF), the total capacitance across the pair of wires is approximately 14 pF. This provides a GR 1089 intra-building compliant design. (Figure 3.43) Note: MURS160T3 is an SMT equivalent of the MUR 1100E.
F0500T
D1
D2
Figure 3.43
10Base-T Metallic-only Protection
Figure 3.44 shows an application requiring longitudinal protection.
F0500T
D1
D2
F0500T
D3
D4
Figure 3.44
10Base-T Metallic and Longitudinal Protection
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Reference Designs
LAN / WAN Protectors
100Base-T Protection
Capacitance across the pair of wires = (D1 || D2) + P0640EA/SA + (D3 || D4) The MUR 1100E pair of diodes capacitance is approximately (10 pF || 10 pF) 20 pF. Then, adding the capacitive effect of the P0640EA/SA (typically 50pF), the total capacitance across the pair of wires is approximately 8 pF. This will provide a GR 1089 intra-building compliant design. (Figure 3.45) Note: MURS160T3 is a SMT equivalent of the MUR 1100E.
D1
D2
P0640EA/SA
D3
D4
Figure 3.45
100 Base-T Protection
The P0642SA is a very low capacitance device that requires no compensating diodes. (Figure 3.46)
P0642SA
Figure 3.46
100 Base-T Protection Without External Compensation
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4 Regulatory
Requirements
Due to the enormous cost of interrupted service and failed network equipment, telephony service providers have adopted various specifications to help regulate the reliability and performance of the telecommunications products that they purchase. In Europe and much of the Far East, the most common standards are ITU-T K.20 and K.21. In North America, most operating companies base their requirements on GR 1089, TIA-968 (formerly known as FCC Part 68), and UL 60950. Note: This section is a paraphrase of existing documents and does not cover the listed regulatory requirements in their entirety. This information is intended to be used only as a reference. For exact specifications, obtain the referenced document from the appropriate source. GR 1089-Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 ITU-T K.20 and K.21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10 TIA/EIA-IS-968 (formerly known as FCC Part 68) . . . . . . . . . . . . . . . . . . . . . . . . . 4-14 UL 60950 3rd Edition (formerly UL 1950, 3rd edition) . . . . . . . . . . . . . . . . . . . . . . 4-16 UL 497 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24 UL 497A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27 UL 497B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-30 UL 497C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-32 Regulatory Compliant Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-34 Surge Waveforms for Various Standards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-37
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Regulatory Requirements
GR 1089-Core
GR 1089-Core
In the United States, the telecommunication network is primarily operated by the Regional Bell Operating Companies (RBOC) who follow the standards set by GR 1089 or a derivative thereof. GR 1089-Core (often referred to as GR 1089), "Electromagnetic Compatibility and Electrical Safety Generic Criteria for Network Telecommunications Equipment," covers the requirements for telecommunications equipment connected to the outside world through twisted pair. It also addresses the criteria for protection from lightning and AC power cross disturbances. Because twisted pair are metallic conductors exposed to lightning and AC power faults, GR 1089 documents the requirements to be met by manufacturers of public switched telephone network (PSTN) equipment to ensure safe and reliable operation. The criteria for these standards are based on transient conditions at exposed sites, such as remote facilities, central offices, and customers' premises where operating companies provide some type of primary voltage protection to limit transient voltages to 1000 V peak for surge conditions and 600 V rms for power cross conditions. All network equipment shall be listed by a Nationally Recognized Testing Laboratory (NRTL) if the equipment is directly powered by Commercial AC. Network equipment located on customer premises shall be listed by NRTL. In conjunction with primary voltage protectors, operating companies also may incorporate fuse links if there is the possibility of exposing the twisted pair to outside power lines. These fuse links are equivalent to 24- or 26-gauge copper wire and are coordinated with the current-carrying capacity of the voltage protector.
Requirements
Equipment required to meet GR 1089 must be designed to pass: * Both First and Second Level Lightning Surge and AC Power Fault Tests * Current Limiter Test * Short Circuit Test A minimum of three units are tested for each of the operating states in which the Equipment Under Test (EUT) may be expected to function -- idle, transmit, receive, on-hook, off-hook, talking, dialing, ringing, and testing. Table 4.1 and Table 4.2 show test connections, and Figure 4.1 shows the connection appearances.
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Regulatory Requirements
The last element of protection that may be provided by the operating company are current limiters which, if provided, are found on the line side of the network equipment after the primary voltage protection device. These current limiters typically come in the form of heat coils and have a continuous rating of 350 mA.
GR 1089-Core
Table 4.1
Test A
Test Conditions
Two-wire Interface Four-wire Interface 1. Each lead (T, R, T1, R1) to the Generator with the other three leads grounded 2. Tip and Ring to Generator, simultaneously; T1 and R1 to Ground 3. T1 and R1 to Generator, simultaneously; Tip and Ring to Ground T, R, T1, R1 to Generator simultaneously
1. Tip to Generator, Ring to Ground 2. Ring to Generator, Tip to Ground 3. Tip and Ring to Generator simultaneously
B
Tip and Ring to Generator simultaneously
Notes: * When performing longitudinal tests, the test generator will have a dual output. * Refer to Table 4.2 for switch positions for each test condition.
Table 4.2
Connections to Test Generator
Condition S1 Closed Open Closed S2 Open Closed Open S3 Open Closed Closed S4 Closed Open Open
Condition A-1 of Table 4.1 Condition A-2 of Table 4.1 Condition A-3 of Table 4.1
Note: Other outside plant leads associated with the unit should be grounded during the test and the test repeated with these leads terminated as in service. Leads that do not connect to outside plant should be terminated as appropriate for the operating mode(s) of the unit.
S1
Tip
Limiting Resistance (If Specified) S3
S2 Switch Unit Under Test Ring
T E R M
Voltage Source
S4 Associated Outside Plant Leads
T E R M
Test Generator
Figure 4.1
Connection Appearances
Passing Criteria
Passing criteria for the First Level Lightning Surge Test and the First Level AC Power Fault Test is that the EUT will not be damaged and that it will operate as intended after the stress is removed. Passing criteria for the Second Level Lightning Surge Test and Second Level
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GR 1089-Core
AC Power Fault Test is that the EUT may be damaged, but it may not become a fire, fragmentation, or electrical safety hazard. Passing criteria for the Current Limiter Test is that the EUT may be damaged but it may not exceed the acceptable time/current criteria (that is, cannot cause the wiring simulator as shown in Figure 4.2 to open) nor become a fire, fragmentation, or electrical safety hazard. The indicator used in measuring fire, fragmentation, and electrical safety hazards is a bleached, untreated cotton cheesecloth wrapped around the EUT. Compliance with testing is determined by the absence of ignition, charring, and the ejection of molten material or fragments.
First Level Lightning Surge Test
To pass the First Level Lightning Surge Test, the EUT must be undamaged and continue to operate properly after the stress is applied. This is referred to as passing "operationally." Table 4.3 presents the conditions for the First Level inter-building criteria. Applicants have the option to submit their equipment to meet surges 1, 2, 4, and 5 or surges 3, 4, and 5. Table 4.4 presents the conditions for the intra-building criteria.
Table 4.3 First Level Lightning Surge Test
Surge Voltage (VPK) 600 1000 1000 2500 1000 Waveform (s) 10x1000 10x360 10x1000 2x10 10x360 Surge Current per Conductor (A) 100 100 100 500 25 Repetitions Each Polarity 25 25 25 10 5 Test Connections (Table 4.1, Figure 4.1) A A A B B
Test (Notes 1 & 2) 1 2 (Note 3) 3 (Note 3) 4 (Note 4) 5 (Note 5)
Notes: 1. Primary protectors are removed for all tests. 2. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s) and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors. 3. Test 1 and 2 can be replaced with Test 3 or vice versa. 4. Alternatively, a surge generator of 1.2x50 s open-circuit voltage waveform (8x20 s short-circuit current waveform) per IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 3 W resistor placed externally to the surge generator. 5. This test is to be performed on up to 12 Tip and Ring pairs simultaneously.
Table 4.4
Intra-Building Lightning Surge Test
Surge Voltage (VPK) 800 1500 Wave-form (s) 2x10 2x10 Surge Current per Conductor (A) 100 100 Repetitions Each Polarity 1 1 Test Connections (Table 4.1, Figure 4.1) A1, A2 B
Test 1 2
Notes: * For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s) and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors. * Alternatively, a surge generator of 1.2x50 s open-circuit voltage waveform (8x20 s short-circuit current waveform) per IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 6 W resistor for Test 1 and a 12 W resistor for Test 2, placed externally to the surge generator.
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Regulatory Requirements
GR 1089-Core
Second Level Lightning Surge Test
The Second Level Lightning Surge Test, presented in Table 4.5, does not require the EUT to pass operationally, but GR 1089 does require that the EUT not become a fire, fragmentation, or electrical safety hazard. This is referred to as passing "non-operationally."
Table 4.5 Second Level Lightning Surge Test
Surge Voltage (VPK) 5000 Waveform (s) 2x10 Surge Current (A) 500 Repetitions Each Polarity 1 Test Connections (Table 4.1, Figure 4.1) B
Test 1
Notes: * Primary protectors are removed. * For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s) and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors. * Alternatively, a surge generator of 1.2x50 s open-circuit voltage waveform (8x20 s short-circuit current waveform) per IEEE C62.41 may be used. The current shall be limited by the inclusion of a series 8 W resistor placed externally to the surge generator.
AC Power Fault Tests
Power companies and telephone operating companies often share telephone poles and trenches; therefore, network equipment is often subjected to the voltages seen on power lines. If direct contact between the telephone line and the primary power line occurs, the operating company's network equipment may see as much as 600 V rms for five seconds, by which time the power company's power system should clear itself. If direct contact occurs with the secondary power line, voltages will be limited to 277 V rms; however, these voltages may be seen indefinitely because the resultant current may be within the operating range of the power system, and the power system will not reset itself. Another risk involved with power lines is indirect contact. Because of the large magnetic fields created by the currents in the power lines, large voltages may be induced upon phone lines via electro-magnetic coupling. In this instance voltages should be limited to 1000 V peak and 600 V rms using primary protectors, while the current will be limited by the current-carrying capacity of the 24-gauge wire.
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GR 1089-Core
First Level AC Power Fault Criteria
Table 4.6 presents test conditions for the First Level AC Power Fault Test. The EUT is required to pass operationally.
Table 4.6 First Level AC Power Fault Test
Applied Voltage, 60 Hz (VRMS) 50 100 200, 400, 600 1000 N/A 600 600 600 1000 Short Circuit Current per Conductor (A) 0.33 0.17 1A at 600 V 1 N/A 0.5 2.2 3 5
Test 1 (Note 1) 2 (Note 1) 3 (Note 1) 4 (Note 4) 5 (Note 2) 6 (Note 3) 7 (Note 3) 8 (Note 3) 9 (Note 3)
Duration 15 min 15 min 60 applications, 1 s each 60 applications, 1 s each 60 applications, 5 s each 30 s 2s 1s 0.5 s
Primary Protectors Removed Removed Removed In place Removed Removed Removed Removed In place
Test Connections (Table 4.1, Figure 4.1) A A A B N/A A A A B
Second Level AC Power Fault Criteria
Test conditions for the Second Level AC Power Fault Test are dependent on whether the EUT is intended for customer premises equipment or non-customer premises equipment. In both instances, although the EUT is not required to pass operationally, it may not become a fire, fragmentation, or electrical safety hazard.
Second Level AC Power Fault Criteria for Non-customer Premises Equipment
Table 4.7 presents test conditions for non-customer premises equipment. (Note that test conditions 1, 3, and 4 may be omitted if the EUT has previously met UL 60950.) See Figure 4.1 for test connection appearances.
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Regulatory Requirements
Notes: 1. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s) and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors. 2. Test 5 simulates a high impedance induction fault. For specific information, please contact Teccor Electronics. 3. Test conditions 6 through 9 are objective, not mandatory, requirements. 4. Sufficient time may be allowed between applications to preclude thermal accumulation.
GR 1089-Core
Table 4.7
Second Level AC Power Fault Test for Non-Customer Premises Equipment
Short Circuit Current per Conductor (A) (Note 5) 25 60 7 2.2A at 600 V N/A
Test (Notes 1, 2) 1 2 3 4 (Note 3) 5 (Note 4)
Applied Voltage, 60 Hz (VRMS) 120, 277 600 600 100-600 N/A
Duration 15 min 5s 5s 15 min 15 min
Test Connections (Table 4.1, Figure 4.1) A A A A N/A
Notes: 1. Primary protectors are removed for all tests. 2. For EUT containing secondary voltage limiting and current limiting protectors, tests are to be performed at the indicated voltage(s) and repeated at a reduced voltage and current just below the operating threshold of the secondary protectors. 3. This test is to be performed between the ranges of 100 V to 600 V and is intended to produce the greatest heating affect. 4. Test 5 simulates a high impedance induction fault. Specific information regarding this test is available upon request. 5. These tests are repeated using a short-circuit value just below the operating threshold of the current limiting device, or, if the EUT uses a fuse as current limiting protection, the fuse may be bypassed and the short circuit current available adjusted to 135% of the fuse rating. 6. Intra-building, second level lower fault test uses test condition 1 only. The applied voltage is at 120 V rms only.
Second Level AC Power Fault for Customer Premises Equipment
For customer premises equipment, the EUT is tested to the conditions presented in Table 4.8 and connected to a circuit equivalent to that shown in Figure 4.2. During this test, the wiring simulator cannot open. For equipment that uses premises type of wiring, the wiring simulator is a 1.6 A Type MDQ fuse from Bussman. For equipment that is connected by cable, the wiring simulator is a piece of 26-gauge copper wire.
Table 4.8 Second Level AC Power Fault for Customer Premises Equipment
Applied Voltage, 60 Hz (VRMS) (Notes 2, 3) 300 600 Source Impedance W 20 20 Test Connections (Table 4.1, Figure 4.2) (Note 1) A
Test 1 2
Notes: 1. Applied between exposed surfaces and Ground 2. The 60 Hz signal is applied with an initial amplitude of 30 V rms and increased by 20% every 15 minutes until one of the following occurs: -- Voltage reaches the maximum specified -- Current reaches 20 A or the wiring simulator opens -- EUT fails open circuit 3. If the EUT fails open circuit, the test continues for an additional 15 minutes to ensure that another component of the EUT does not create a fire, fragmentation, or electrical safety hazard.
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GR 1089-Core
20
Wiring Simulator
Tip Equipment Ring
20
Wiring Simulator
Tip Equipment Ring
Variable 60 Hz ac Voltage Source 0-600 V AC Equipment Ground (Green Wire Ground) (A) Metallic
Chassis Ground
20 Wiring Simulator Variable 60 Hz ac Voltage Source 0-600 V AC Equipment Ground (Green Wire Ground) (B) Longitudinal
Chassis Ground
Figure 4.2
Second Level AC Power Fault and Current Limiter Connection
Current Limiting Protector Test
The purpose of the Current Limiting Protector Test, presented in Table 4.9, is to determine if the EUT allows an excessive amount of current flow under power fault conditions. During this test, the EUT is connected to a circuit equivalent to that shown in Figure 4.2 with a 1.6 A Type MDQ fuse from Bussman used as the wiring simulator. If the EUT draws enough current to open the fuse, then the acceptable time/current criteria have not been met, and external current limiting protectors must be specified for use with that equipment in the manufacturer's documentation.
Table 4.9
Test 1
Current Limiting Protector Test
Applied Voltage, 60 Hz (VRMS) 600 Source Impedance W 2 Duration 15 min Test Connections (Table 4.1, Figure 4.2 A
Short-circuit Test
In addition to the AC Power Fault and Current Limiter Tests, equipment must also pass a Short-circuit Test to comply with GR 1089. During this test, a short-circuit condition is applied to the following Tip and Ring appearances for 30 minutes while the EUT is powered and under operating conditions: * Tip-to-Ring, Tip-to-Ground with Ring open circuit * Ring-to-Ground with Tip open circuit * Tip- and Ring-to-Ground simultaneously for 30 minutes At no time will the short circuit exceed 1 W. For equipment with more than one twisted pair, the short circuit is applied to all twisted pair simultaneously. To comply with the short circuit test, the EUT must function normally after the short-circuit condition is removed, and a fire hazard may not be present. The equipment shall not require manual intervention to restore service.
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Regulatory Requirements
ITU-T K.20 and K.21
ITU-T K.20 and K.21
Although the International Telecommunication Union (ITU) does not have the authority to legislate that organizations follow their recommendations, their standards are recognized throughout Europe and the Far East. ITU-T, the Telecommunication Standardization Sector of the ITU, developed fundamental testing methods that cover various environmental conditions to help predict the survivability of network and customer-based switching equipment. The testing methods cover the following conditions: * Surges due to lightning strikes on or near twisted pair and plant equipment (excluding a direct strike) * Short-term induction of AC voltage from adjacent power lines or railway systems * Direct contact between telecommunication lines and power lines (often referred to as AC power cross) Two ITU-T standards apply for most telecommunications equipment connected to the network: * ITU-T K.20 * ITU-T K.21 ITU-T K.20 is primarily for switching equipment powered by the central office; however, for complex subscriber equipment, test administrators may choose either K.20 or K.21, depending on which is deemed most appropriate. Note: Both standards are intended to address equipment reliability versus equipment safety. For specific concerns regarding equipment safety, research and follow national standards for each country in which the equipment is intended for use. K.21 covers telecommunication equipment installed in customer premises. Equipment submitted under these requirements must meet one of two levels: basic or enhanced. Guidelines for determining under which level the equipment under test (EUT) falls can be found in ITU-T K.11, but note that the final authority rests with the test administrator. ITU-T K.44 describes the test conditions used in K.20 and K.21. ITU-T defines the following acceptance criteria: * Criterion A states that equipment shall withstand the test without damage and shall operate properly after the test. It is not required to operate correctly during the test. * Criterion B states that a fire hazard shall not occur as a result of the tests. Any damage shall be confined to a small part of the equipment. Table 4.10 shows the lightning surge test conditions for ITU K.20. Figure 4.3 shows the connection schematic for the lightning surge tests. Table 4.11 shows the power cross test conditions for ITU K.20. Figure 4.4 shows the connection schematic for the power cross tests. Table 4.12 and Table 4.13 show the same test conditions respectively for ITU K.21.
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ITU-T K.20 and K.21
Table 4.10
K.20 Lightning Test Conditions for Telecom Equipment in Central Office/Remote Terminal
Voltage (10x700 s)
Single Port Metallic and Longitudinal Basic/Enhanced 1 kV/1.5 kV 4 kV/4 kV
Multiple Ports Longitudinal Only Basic/Enhanced
Current (5x310 s) Basic/Enhanced (A) 25/37.5 100/100
Repetitions * 5 5 5 5
Primary Protection None ** Installed if used None Installed if used
Acceptance Criteria A A A A
1.5 kV/1.5 kV 4 kV/6 kV
37.5/37.5 100/150
* One-minute rest between repetitions ** This test is not conducted if primary protection is used.
25 Surge Generator Decoupling Elements
Equipment Under Test A
B a) Transversal test
E
25 Surge Generator R3 = 25 b) Longitudinal test
Figure 4.3 Connection Appearances
Equipment Under Test A Decoupling Elements B E
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Regulatory Requirements
ITU-T K.20 and K.21
Equipment Under Test Ua.c. R A
R Timing Circuit Generator
B
E
Figure 4.4
Connection Appearances (R = 10 W, 20 W, 40 W, 80 W, 160 W, 300 W, 600 W, and 1000 W for the various power cross tests)
Table 4.11
K.20 Power Cross Test Conditions for Telecom Type Ports, Metallic, and Longitudinal
Current (5x310 s) Basic/Enhanced (A) 1/1 1/7.5 23/23 11.5/11.5 5.75/5.75 2.875/2.875 1.44/1.44 0.77/0.77 0.38/0.38 0.23/0.23 Duration Basic/Enhanced 0.2 s 1 s/2 s 15 min Primary Protection None None None Acceptance Criteria Basic/Enhanced A/A A/A B/B B/B B/B B/B B/A B/A B/A B/B
Voltage Basic/Enhanced 600 V/600 V 50 Hz or 60 Hz 600/1.5 kV 50 Hz or 60 Hz 230/230 V 50 Hz or 60 Hz
Repetitions * 5 5 1
* One-minute rest between repetitions
Table 4.12
K.21 Lightning Test Conditions for Telecom Equipment on Customer Premises
Voltage (10x700 s) Single Port
Longitudinal (kV) Basic/Enhanced 1.5/6 ** 4/6
Multiple Ports Longitudinal Only Current (5x310 s) Metallic (kV) (kV) Basic/Enhanced Basic/Enhanced Basic/Enhanced (A) 37.5/150 100/150 1.5/1.5 4/6 1.5/1.5 4/6 37.5/37.5 100/150
Repetitions * 5 5 5 5
Primary Protection None Installed if used None Installed if used
Acceptance Criteria A *** A A *** A
* One-minute rest between repetitions ** Reduce to 1.5 kV if SPD connects to GRD. *** Does not apply if primary protectors are used.
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ITU-T K.20 and K.21
Table 4.13
K.21 Power Cross Test Conditions for Telecom Type Ports, Metallic, and Longitudinal
Current Basic/Enhanced (A) 1/1 1/7.5 23/23 11.5/11.5 5.75/5.75 2.875/2.875 1.44/1.44 0.77/0.77 0.38/0.38 0.23/0.23 Duration Basic/Enhanced 0.2 s 1 s/2 s 15 min Primary Protection None Installed if used None Acceptance Criteria Basic/Enhanced A/A A/A B/B B/B B/B B/B B/A B/A B/A B/B
Voltage Basic/Enhanced 600 V / 600 V 50 Hz or 60 Hz 600 V / 1.5 kV 50 Hz or 60 Hz 230 V / 230 V 50 Hz or 60 Hz
Repetitions * 5 5 1
* One-minute rest between repetitions
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Regulatory Requirements
TIA-968 (formerly known as FCC Part 68)
TIA-968 (formerly known as FCC Part 68)
TIA-968 applies to all terminal equipment connected to the Public Switched Telephone Network (PSTN) and holds the "rule of law" by congressional order. The purpose of TIA-968 is to provide a set of uniform standards to protect the telephone network from any damage or interference caused by the connection of terminal equipment. This standard includes environmental simulations such as vibration tests, temperature and humidity cycling, drop tests and tests for hazardous voltages and currents, as well as tests for signal power levels, line balance, on-hook impedance, and billing protection. All these standards must be met before and after the environmental tests are applied.
Overvoltage Test
TIA-968 compliant equipment must undergo an overvoltage test that includes a Type A and Type B Metallic Voltage Surge and a Type A and Type B Longitudinal Voltage Surge. These surges are part of the environmental simulation, and although a provision does allow the EUT to reach an open circuit failure mode during the Type A tests, failures must: 1. Arise from an intentional design that will cause the phone to be either disconnected from the public network or repaired rapidly 2. Be designed so that it is substantially apparent to the end user that the terminal equipment is not operable A common example of an acceptable failure would be an open circuit due to an open connection on either Tip or Ring. For Type B surges, equipment protection circuitry is not allowed to fail. The EUT must be designed to withstand Type B surges and continue to function in all operational states.
Metallic Voltage Surge
The Type A and Type B Metallic Voltage Surges are applied in both the positive and negative polarity across Tip and Ring during all operational states (on-hook, off-hook, ringing, and so on). The Type A surge is an 800 V, 100 A peak surge while the Type B surge is a 1000 V, 25 A peak surge, as presented in Table 4.14.
Table 4.14 TIA-968 Voltage Surge
Peak Voltage (VPK) 800 1500 1000 1500 Rise & Decay Time (Voltage Waveform) 10x560 s 10x160 s 9x720 s 9x720 s Peak Current (A) 100 200 25 37.5 Rise & Decay Time (Current Waveform) 10x560s 10x160s 5x320s 5x320s Repetitions Each Polarity 1 1 1 1
Surge Type Metallic A Longitudinal A Metallic B Longitudinal B
Notes: * For Type A surges, the EUT may pass either "operationally" or "non-operationally." * For Type B surges, the EUT must pass "operationally." * The peak current for the Type A longitudinal surge is the total available current from the surge generator. * The peak current for the Type B longitudinal surge is the current supplied to each conductor.
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TIA-968 (formerly known as FCC Part 68)
Longitudinal Voltage Surge
The Type A and Type B Longitudinal Voltage Surges are applied in both positive and negative polarity during all operational states. The Type A surge is a 1500 V, 200 A peak surge applied to the EUT with Tip and Ring tied together with respect to Ground. The Type B Longitudinal Voltage Surge is a simultaneous surge in which 1500 V and 37.5 A are applied concurrently to Tip with respect to Ground and Ring with respect to Ground, as presented in Table 4.14. Note: Type B surge requirements guarantee only a minimum level of surge protection. For long term reliability of terminal equipment, consideration should be given to complying with Type A surges operationally.
On-hook Impedance Limitations
Another important aspect of TIA-968 is on-hook impedance, which is affected by transient protection. On-hook impedance is analogous to the leakage current between Tip and Ring, and Tip, Ring, and Ground conductors during various on-hook conditions. "On-hook Impedance Measurements" (next paragraph) outlines criteria for on-hook impedance and is listed as part of the Ringer Equivalent Number (REN). The REN is the largest of the unitless quotients not greater than five; the rating is specified as the actual quotient followed by the letter of the ringer classification (for example, 2B).
On-hook Impedance Measurements
On-hook impedance measurements are made between Tip and Ring and between Tip and Ground and Ring and Ground. For all DC voltages up to and including 100 V, the DC resistance measured must be greater than 5 MW. For all DC voltages between 100 V and 200 V, the DC resistance must be greater than 30 kW. The REN values are then determined by dividing 25 MW by the minimum measured resistance up to 100 V and by dividing 150 kW by the minimum measured resistance between 100 V and 200 V. On-hook impedance is also measured during the application of a simulated ringing signal. This consists of a 40 V rms through 150 V rms ringer signal at frequencies ranging from 15.3 Hz to 68 Hz superimposed on a 56.5 V dc for a class "B" ringer. During this test, the total DC current may not exceed 3 mA. In addition, the minimum DC resistance measured between Tip and Ring must be greater than 1600 W, while the DC resistance measured between the Tip and Ring conductors and Ground must be greater than 100 kW. The REN values for the simulated ringing test are determined by dividing the maximum DC current flowing between Tip and Ring by 0.6 mA, and by dividing 8000 W by the minimum impedance value measured.
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Regulatory Requirements
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
After the divestiture of the AT&T/Bell system, the National Electric Code (NEC) implemented Article 800-4, which mandates that "all equipment intended for connection to the public telephone network be listed for that purpose" in order to ensure electrical safety. A manufacturer can meet this requirement by listing their product with Underwriters Laboratories under UL 60950 (based on IEC 60950, 3rd edition). NEC requires all telecommunication wiring that enters a building to pass through a primary protector, which is designed to limit AC transients in excess of 600 V rms. These transients are due to the fact that telephone lines run in close proximity to AC power lines. Most telecommunication equipment uses a secondary overvoltage protector such as the SIDACtor device. The secondary devices typically limit transients in excess of 350 V rms. Therefore, a potentially dangerous condition exists because of the voltage threshold difference of the primary protector and the secondary protector. To minimize this danger, compliance with UL 60950 overvoltage tests is required. UL 60950 covers equipment with a rated voltage (primary power voltage) not exceeding 600 V and equipment designed to be installed in accordance with NEC NFPA 70. This standard does not apply to air-conditioning equipment, fire detection equipment, power supply systems, or transformers. The effective date of UL 60950 allows new products submitted through April 1, 2003 to be evaluated using the requirements of either UL 60950 or UL 1950, 3rd edition. After April 1, 2003, all new product submittals must be evaluated using only UL 60950. Products certified by UL to requirements of UL 1459 prior to April 1, 2000 may continue to be certified without further reinvestigation until April 1, 2005, provided no significant changes or revisions are made to the products. Products certified by UL to requirements of UL 1950 3rd edition prior to April 1, 2003 may continue to be certified without further reinvestigation until April 1, 2005. In order to have the UL Mark applied after April 1, 2005, all products, including those previously certified by UL, must comply with UL 60950. UL 69050 is intended to prevent injury or harm due to electrical shock, energy hazards, fire, heat hazards, mechanical hazards, radiation hazards, and chemical hazards. It defines three classes of equipment: * Class 1 -- protection achieved by basic insulation * Class 2 -- protection achieved by double or reinforced insulation * Class 3 -- protection relying upon supply from SELV circuits (voltages up to 40 V peak or 60 V dc) UL 60950 also defines five categories of insulation: * Functional * Basic * Supplementary * Reinforced * Double
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UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
UL 60950 Terminology
The following definitions assist in understanding UL 60950: SELV TNV TNV3 TNV2 TNV1 Secondary circuit whose voltage values do not exceed a safe value (voltage less than hazardous levels of 42.4 V peak or 60 V dc) Telecommunication Network Voltage (a secondary circuit) SELV but with exposure to surges SELV but without exposure to surges SELV with exposure to surges
Creepage distance is the shortest distance between two conductors, measured along the surface of the insulation. DC voltages shall be included in determining the working voltage for creepage distances. (The peak value of any superimposed ripple or short disturbances, such as cadenced ringing signals, shall be ignored.) Clearance distance is the shortest distance between two conductive parts or between a conductive part and the outer surface of the enclosure measured through air. DC voltages and the peak value of any superimposed ripple shall be included in determining the working voltage for clearance distances. Creepage and clearance distances are also subject to the pollution degree of the equipment: * Pollution degree 1 -- components and assemblies that are sealed to prevent ingress of dust and moisture * Pollution degree 2 -- generally applicable to equipment covered by UL 60950 * Pollution degree 3 -- equipment is subject to conductive pollution or to dry nonconductive pollution, which could become conductive due to expected condensation. To ensure safe operating conditions of the equipment, UL 60950 focuses on the insulation rating of the circuit(s) under consideration. Table 4.15 and Table 4.16 indicate the required creepage and clearance distances depending on material group, pollution degree, working voltage, and maximum transient voltage in the secondary circuit. For a typical telecommunication application with a working voltage of 200 V, pollution degree 2, material group IIIb, the creepage distance is 2 mm. The clearance distance is 2 mm for reinforced insulation.
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Regulatory Requirements
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
Table 4.15
Minimum Clearances in Secondary Circuits (millimeters)
Nominal AC Mains Supply voltage > 300 V 600 V (transient rating for Secondary Circuit 2500 V) Pollution Degrees 1, 2, and 3 R 2.6 2.6 2.6 F 1.7 1.7 1.7 1.7 1.7 B/S 2 2 2 2 2 R 4 4 4 4 4
Working Voltage up to and including
Nominal AC Mains Supply voltage 150 V (transient rating for Secondary Circuit 800 V) Pollution Degrees 1 and 2 Pollution Degree 3 F 1 1 1 B/S 1.3 1.3 1.3 R 2.6 2.6 2.6
Nominal AC Mains Supply voltage > 150 V 300 V (transient rating for Secondary Circuit 1500 V) Pollution Degrees 1 and 2 F 0.7 0.7 0.7 B/S 1 1 1 R 2 2 2 F 1 1 1 Pollution Degree 3 B/S 1.3 1.3 1.3
Circuit Not Subject to Transient Overvoltages Pollution Degrees 1 and 2 only F 0.4 0.6 0.6 1.1 1.4 B/S 0.4 0.7 0.7 1.1 1.4 R 0.8 1.4 1.4 2.2 2.8
V* 71 140 210 280 420
V ** 50 100 150 200 300
F 0.4 0.6 0.6
B/S 0.7 0.7 0.9
R 1.4 1.4 1.8
F 1.1; B/S 1.4; R 2.8 F 1.6; B/S 1.94; R 3.8
* Voltage peak or DC ** Voltage rms (sinusoidal) Note: F = Functional B/S = Basic/Supplementary R = Reinforced
Table 4.16
Working Voltage
Minimum Creepage Distances (millimeters)
Functional, Basic, and Supplementary Insulation Pollution Degree 1 Material Group I, II, IIIa, or IIIb Use the Clearance from the appropriate table I 0.6 0.7 0.8 0.8 1 1.3 1.6 2 3.2 4 5 Pollution Degree 2 Material Group II 0.9 1 1.1 1.1 1.4 1.8 2.2 2.8 4.5 5.6 7.1 IIIa or IIIb 1.2 1.4 1.5 1.6 2 2.5 3.2 4 6.3 8 10 I 1.5 1.8 1.9 2 2.5 3.2 4 5 8 10 12.5 Pollution Degree 3 Material Group II 1.7 2 2.1 2.2 2.8 3.6 4.5 5.6 9.6 11 14 IIIa or IIIb 1.9 2.2 2.4 2.5 3.2 4 5 6.3 10 12.5 16
V RMS or DC 50 100 125 150 200 250 300 400 600 800 1000
Note: Linear interpolation is permitted between the nearest two points, the calculated spacing being rounded to the next higher 0.1 mm increment.
The following separations require the specified insulation grade: * TNV3 from TNV3 -- functional insulation * TNV3 from SELV -- basic insulation * TNV3 from TNV1 -- basic insulation * TNV3 from TNV2 -- basic insulation
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UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
The application must meet the creepage and clearance distances and electric strength of Section 5.3.2 of UL 60950 for functional insulation. The electric strength test (Table 5B of UL 60950) lists 1 kV to 1.5 kV as the test voltages for functional and supplementary grade of insulation and 2 kV to 3 kV for reinforced grade of insulation. Separation requirements are tested (Section 6.2.2.1 of UL 60950) by applying an impulse test and an electric strength test: * Impulse test allows for the SIDACtor device to turn on (either a 10x700 2.5 kV 62.5 A or 1 kV 37.5 A 10 times with 60-second rest period). * Electric strength test allows the SIDACtor device to be removed (60 Hz at rated voltage for 60 seconds). These are applied between Ground and all Tip and Rings connected together, and/or between Ground and all conductors intended to be connected to other equipment connected together. Basic insulation is not required if all the following conditions are met: * SELV, TNV1 circuit is connected to the protective earth. * Installation procedures specify that protective earth terminal shall have a permanent connection to earth. * Any TNV2 or TNV3 circuit with an external port connection intended to receive signals in excess of SELV (60 V dc or 50 V peak) will have the maximum normal expected operating voltage applied to it for up to 30 minutes without deterioration. (If no maximum normal specification exists then 120 V 100 mA 60 Hz is applied.) (In other words, if a permanent Ground connection is made, then creepage distances may not be required.)
ANNEX C of UL 60950 covers transformers. The secondary side is loaded for maximum heating effect. The maximum working voltage is applied to the primary. The DC peak value of any superimposed ripple shall be included. The permitted temperature limits for the windings depend on the classification: * Class A limit is 150 C. * Class B limit is 175 C. * Class E limit is 165 C. * Class F limit is 190 C. * Class H limit is 210 C.
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Regulatory Requirements
Any surge suppressor that bridges the insulation (connects to Ground) shall have a minimum DC turn on voltage of 1.6 times the rated voltage UNLESS one of the following occurs (Section 6.1.2.2 of UL 60950): * Equipment is permanently connected or uses an industrial plug and socket-outlet. * Equipment is installed by service personnel. * Equipment has provision for a permanently connected protective earth.
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
Overvoltage Flowchart
The overvoltage flowchart in Figure 4.5 shows specific guidelines for determining overvoltage requirements applicable to specific designs.
Connects to Outside Cable
No
No Overvoltage Testing
Yes
100 A2-S Limiting1
No
26 AWG Line Cord3
No
Pass 1
No
Yes No 1.3 A Limiting2
Yes
Yes
Pass 6.1.24
No
Pass 5
No
Yes
Yes
Yes
Fire Enclosure
No
Yes
Fire Enclosure and Spacings5
No
Pass 26 Pass 3, 47
No
Yes Yes
Acceptable
Not Acceptable
Notes: 1. Current Limiting -- Equipment that has a method for limiting current to an I2t rating of 100A2s 2. Current Limiting -- Equipment that has a method for limiting current to 1.3 A max steady state 3. 26 AWG Line Cord -- Minimum 26 American Wire Gauge (AWG) telecommunications line cord either supplied with the equipment or described in the safety instructions 4. Clause 6.3.3 -- The telephone line must be adequately isolated from earth for the operating mode being considered and at a voltage of 120 V rms. Refer to Section 6.1.2 of UL 60950. 5. Fire Enclosure and Spacing -- Fire enclosures minimize fire hazards by containing any emission of flame, molten metal, flaming drops, or glowing particles that could be emitted by the equipment under fault conditions. Fire enclosure construction is covered in Section 4.4.6 of UL 60950. Spacing applies to parts in the TNV circuits that might ignite under overvoltage conditions. Spacing requirements mandate that parts be separated from internal materials of flammability class V-2 or lower, by at least 25 mm of air or a barrier material of flammability class V-1 or better. Parts also should be separated from openings in the top or sides of the enclosure by at least 25 mm of air or a material barrier. 6. Test Condition 2 is not required for equipment with 1.3 A limiting. 7. Test Conditions 3 and 4 are not required for connections limited to outside cable less than 1,000 m.
Figure 4.5
Overvoltage Flowchart
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UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
Passes 1, 2, 3, 4, and 5 shown in Figure 4.5 refer respectively to Tests L1 and M1, L2 and M2, L3 and M3, L4 and M4, and L5 shown in Table 4.17. Equipment may be subject to the overvoltage tests shown in Table 4.17. The tests are designed to simulate the following: * Contact with primary power * Short-term induction as a result of a primary power fault to a multi-earth neutral * Long duration power fault to Ground * Direct contact between the power mains and a telecommunications cable
Table 4.17
Test L1 L2 L3 L4 L5 M1 M2 M3 M4
UL 60950 Overvoltage Test
Voltage (VRMS) 600 V 600 V 600 V 200 V 120 V 600 V 600 V 600 V 600 V Current (A) 40 7 2.2 2.2 25 40 7 2.2 2.2 Time 1.5 s 5s 30 min 30 min 30 min 1.5 s 5s 30 min 30 min Reduce to 135% fuse rating Reduce to 135% fuse rating Reduce to 135% fuse rating Reduce to 135% fuse rating Comments
Current Limiting Resistor
Secondary Protector Simulator or Wiring Station
Timed Switch Variable Voltage Source
Telecommunication Equipment Network Connection Under Test Points
Equipment Earth
Figure 4.6
Metallic Connection Appearances
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Regulatory Requirements
Notes: * ISDN S/T interface only L1, L2, L5, M1, and M2. * Reduce to 135% rated value of fuse if Test 3 resulted in open condition. * L4 and M4 are conducted only if SIDACtor VS 285 VS and then run at voltage level just below VS. * For test conditions M1, L1, M5, and L5 a wiring simulator (MDL 2 A fuse) is used. * Compliance means no ignition or charring of the cheesecloth, and/or the wiring simulator does not open. * If the secondary protector simulator is used (MDQ 1.6), it is allowed to open. * Tests 2, 3, and 4 are required only if the unit is not a fire enclosure. * Figure 4.6 and Figure 4.7 show the M (metallic) and L (longitudinal) test connections.
UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
Current Limiting Resistors
Secondary Protector Simulators or Wiring Stations Equipment Under Test
Timed Switch Variable AC Voltage Source Equipment Earth
Figure 4.7
Longitudinal Connection Appearances
Overvoltage Test Procedures
Use the following criteria when applying the overvoltage tests presented in Table 4.17: 1. Test Set-up -- Equipment is to be mounted as it is intended to be used. Tests may be conducted on either the equipment as an assembly, individual subassemblies, or a partial assembly containing those components which may be exposed to an overvoltage condition. 2. Indicators -- Before testing, two single pieces of cheesecloth are to be wrapped tightly around the assembly, subassembly, or partial assembly. The cheesecloth acts as an indicator for conditions that may result in fire. 3. Line Cords -- Equipment with a removable telecommunications line cord is to be connected to the test circuit with a line cord having 0.4 mm (26 AWG) or larger copper wire conductors and not more than 1 W total resistance. 4. Functional Circuitry -- UL mandates that functional circuitry must be used for each overvoltage test conducted. This allows repair or replacement of damaged circuitry before subsequent testing. Alternatively, separate samples may be used for each test. 5. Wiring Simulators -- A wiring simulator is used to indicate whether the maximum I2t imposed upon telecommunications wiring has been exceeded. For Tests 1 and 5, a wiring simulator is to be used unless the equipment is specified for use with a suitable secondary protector or a secondary protector simulator. The wiring simulator can consist of one of the following: a. 50mm length of 0.2 mm (32 AWG) bare or enameled solid copper wire (for test condition 1) b. Bussman Mfg. Co. Type MDL-2A fuse (for test condition 1) c. 300 mm length of 0.4 mm (26 AWG) solid copper wire which connects to a representative installation (includes wiring an connectors) [This option is used when the manufacturer specifies the complete installation from the network interface to the equipment.] d. Current probe used with a 300 mm length of 0.5 mm (24 AWG) copper wire (for test condition 1)
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UL 60950 3rd Edition (formerly UL 1950, 3rd edition)
Note: Test conditions 2, 3, and 4 do not require the use of a wiring simulator or a secondary protector simulator. Any secondary protection simulators used in Tests 1 and 5 should be similar to the test fuse used in UL 497A, "Standard for Secondary Protectors for Communications Circuits."
Overvoltage Test Compliance
Equipment is deemed compliant if each of the following conditions are met during test: * Absence of ignition or charring of the cheesecloth indicator (Charring is deemed to have occurred when the threads are reduced to char by a glowing or flaming condition.) * Wiring simulator does not open during test condition 1 or 5 * For test condition 1, presented in Table 4.17, the integral I2t measured with a current probe is less than 100 A2s. After completion of the overvoltage tests, equipment must comply with either the Dielectric Voltage-withstand Test requirements with all components in place or the Leakage Current Test requirements.
Special Considerations Regarding the SIDACtor Device and UL 60950
The epoxy used for SIDACtor devices is UL recognized and the encapsulated body passes UL 94V-0 requirements for flammability. The only specific requirements of UL 60950 that pertain to the SIDACtor device itself are the impulse test and the mandate that components be UL recognized. All other UL 60950 requirements pertain to the equipment being evaluated.
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Regulatory Requirements
UL 497
UL 497
UL 497 Series of Safety Standards
The UL 497 series is a family of three safety standards that provides requirements for protection devices used in low-voltage circuits. * UL 497 addresses requirements for primary protectors used in paired communications circuits. * UL 497A covers secondary protectors for use in single or multiple pair-type communications circuits. * UL 497B addresses protectors used in data communication and fire alarm circuits. * UL 497C addresses protectors for coaxial circuits. The focus of UL 497 is to ensure that paired communication circuit protectors do not become a fire or safety hazard. The requirements in UL 497 cover any protector that is designed for paired communications circuits and is employed in accordance with Article 800 of the National Electric Code. The protectors covered in UL 497 include solid state primary and station protectors. These circuit protectors are intended to protect equipment, wiring, and service personnel against the effects of excessive voltage potential and currents in the telephone lines caused by lightning, power cross, power induction, and rises in Ground potential.
UL 497 Construction and Performance Requirements
The "Construction" section covers the following requirements: * General * Enclosures * Protection Against Corrosion * Field-wiring Connections * Components * Spacing The "Performance" section covers the following requirements: * General * Line Fuse Test * Instrument Fuse Test * Arrestor Test * Polymeric Material Test * Rubber Materials Test * Corrosion Test, Outdoor Use Protector * Jarring Test * Water Spray Test * Drop Test * Cover Replacement Test * Strain Relief Test * Replacement Arrestors Installation Test * Applique Assemblies Installation Test * Dielectric Voltage-withstand Test * Manufacturing and Production Tests * Marking
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UL 497
Performance Tests
Key performance tests which concern overvoltage protectors are detailed in the arrestor test section. Specific requirements are: * Breakdown Voltage Measurement -- Arrestors are to be tested in the protector blocks or panels in which they are intended to be employed. Arrestors are required to break down within 25% of the manufacturer's specified breakdown rating. In no case shall the breakdown voltage exceed 750 V peak when subjected to the strike voltage test shown in Figure 4.8. At no time during this test will the supply voltage be increased at a rate greater than 2000 V/s. * Impulse Spark-over Voltage Measurement -- The arrestor must break down at less than 1000 V peak when subjected to a single impulse potential. Arrestors are to be tested in each polarity with a rate of voltage rise of 100 V/s, 10%. * Abnormal Operation -- Single pair fuseless arrestors must be able to simultaneously carry 30 A rms at 480 V rms for 15 minutes without becoming a fire hazard. A fire hazard is determined by mounting the arrestor on a vertical soft wood surface and covering the unit with cheesecloth. Any charring or burning of the cheesecloth results in test failure. During this test, although the arrestors may short, they must not have an impulse sparkovervoltage or DC breakdown voltage greater than 1500 V peak. * Discharge Test -- Protectors must comply with the strike voltage requirements after being subjected to five successive discharges from a 2 F capacitor charged to 1000 V dc. (Figure 4.9). * Repeated Discharge Test -- The arrestor must continue to break down at or below its maximum rated breakdown voltage after being subjected to 500 discharges from a 0.001 F capacitor charged to a potential of 10,000 V dc. The interval between pulses is five seconds. Arrestors are to be tested in each polarity, and it is acceptable for the protector to short circuit following the discharge testing. (Figure 4.9)
R1 50,000 25 W
R2 10 5W
C1
V
Test Specimen
Variable DC Supply 0-1000 V
Figure 4.8 UL 497 Breakdown Voltage Measurement
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Regulatory Requirements
UL 497
Variable DC Supply * 0-12,000 V
R1 5 M 50 W
Spot Switch
R2 10 5W
C1
V
Test Specimen
*Or Voltage Capability Necessary to Develop 10,000 V Across Capacitor
Figure 4.9
UL 497 Discharge Test
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UL 497A
UL 497A
UL 497A addresses secondary protectors for use in single or multiple pair-type communication circuits intended to be installed in accordance with Article 800 of the National Electric Code and to have an operating voltage of less than 150 V rms with respect to Ground. The purpose of UL 497A is to help reduce the risk of fire, electric shock, or injury resulting from the deployment and use of these protectors. UL 497A requirements do not cover telephone equipment or key systems.
UL 497A Construction, Risk of Injury, and Performance Requirements
The "Construction" section covers the following requirements: * General * Product Assembly * Enclosures * Internal Material * Accessibility and Electric Shock * Protection Against Corrosion * Cords * Current-carrying Parts * Internal Wiring * Interconnecting Cords and Cables * Insulating Material * Printed Wiring * Spacing
The "Performance" section covers the following requirements: * General * Impulse Voltage Measurement * Overvoltage Test * Endurance Conditioning * Component Temperature Test * Drop Test * Crush Test * Leakage Current Test * Dielectric Voltage-withstand Test * Rain Test * Maximum Moment Measurement Test * Weather-o-meter and Micro Tensile Strength Test * Thermal Aging and Flame Test * Electric Shock Current Test * Manufacturing and Production Line Test * Marking, Installation, and Instructions
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Regulatory Requirements
The "Risk of Injury" section covers the following requirements: * Modular Jacks * Sharp Edges * Stability * Protection of Service Personnel
UL 497A
Performance Tests
The following key performance tests relate to overvoltage protection of the secondary protectors: 1. Impulse Voltage Measurement Test -- Secondary protectors must break down within 25% of the manufacturer's breakdown rating when tested in each polarity with a rate of voltage rise of 100 V/s, 10%. Note that the manufacturer may assign separate breakdown voltage ratings for the Breakdown Voltage Measurement Test. This requirement only applies to secondary protectors that connect between Tip and Ring of the telephone loop. 2. Breakdown Voltage Measurement Test -- Secondary protectors must break down within 25% of the manufacturer's breakdown rating when tested in each polarity with a rate of voltage rise no greater than 2000 V/s. The secondary protector is to be mounted in accordance with the manufacturer's installation instructions and then subjected to the test circuit shown in Figure 4.10. This requirement applies only to secondary protectors connected between Tip and Ring or Tip/Ring and Ground of the telephone loop. 3. Overvoltage Test -- Secondary protectors must limit current and extinguish or open the telephone loop without loss of its overvoltage protector, indication of fire risk, or electric shock. Upon completion of this test, samples must comply with the Dielectric Voltagewithstand Test. The overvoltage test is used to determine the effects on secondary protectors and is shown in Table 4.18. Test connections are shown in Figure 4.11.
Test Compliance
Compliance with the overvoltage test is determined by meeting the following criteria: * Cheesecloth indicator may not be either charred or ignited * Wiring simulator (1.6 A Type MDQ fuse or 26 AWG line cord) may not be interrupted * Protector meets the applicable dielectric voltage withstand requirements after the completion of the overvoltage tests
Table 4.18
Test L1 L2 L3 L4
UL 497A Overvoltage Test
Voltage (VRMS) 600 600 600 200 V rms or just below the breakdown voltage of the overvoltage protection device 240 Current (A) 40 7 2.2, 1, 0.5, 0.25 2.2 A or just below the interrupt value of the current interrupting device 24 Time 1.5 s 5s 30 min at each current level 30 min Connection (Note 1, Figure 4.11) (Note 1, Figure 4.11) (Note 2, Figure 4.11) (Note 2, Figure 4.11)
L5
30 min
(Note 1, Figure 4.11)
Notes: 1. Apply Tests L1, L2, and L5 between Tip and Ground or Ring and Ground. 2. Apply Tests L3 and L4 simultaneously from both Tip and Ring to Ground.
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UL 497A
R1 50,000 25 W
R2 10 5W
C1
V
Test Specimen
Variable DC Supply 0-1000 V
Figure 4.10 UL 497A Breakdown Voltage Measurement Test
Circuit for Common Mode (Longitudinal) Overvoltage Tests Current Limiting Resistors Secondary Protector Simulator or Wiring Station Equipment Under Test
Circuit for Differential Mode (Metallic) Overvoltage Tests
Current Limiting Resistor
Secondary Protector Simulator or Wiring Station
Timed Switch Variable AC Voltage Source Equipment Ground
Timed Switch Variable Voltage Source Equipment Ground
Equipment Ground
Figure 4.11
UL 497A Overvoltage Test
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Regulatory Requirements
Telecommunication Equipment Network Connection Under Test Points
UL 497B
UL 497B
UL 497B provides requirements for protectors used in communication and fire alarm circuits. This standard does not cover devices for primary protection or protection devices used on telephone lines. SIDACtor devices are components recognized in accordance with UL 497B under UL file number E133083.
Construction and Performance Requirements
The "Construction" section covers the following requirements: * General * Corrosion Protection * Field-wiring Connections * Components * Spacing * Fuses The "Performance" section covers the following requirements: * General * Strike Voltage Breakdown * Endurance Conditioning * Temperature Test * Dielectric Voltage-withstand Test * Vibration Conditioning * Jarring Test * Discharge Test * Repeated Discharge Test * Polymeric Materials Test * High Temperature Test * Marking
Performance Requirements Specific to SIDACtor Devices
1. Strike Voltage Breakdown Test -- Protectors are required to break down within the manufacturer's specified breakdown range or within 10% of a nominal single breakdown voltage rating. (Figure 4.12) 2. Endurance Conditioning -- Protectors are subjected to 50 impulse cycles. Each cycle is a 1000 V peak, 10 A, 10x1000 s pulse. Pulses are applied in one polarity at 10-second intervals and then repeated in the opposite polarity. 3. Variable Ambient Conditioning -- Protectors must comply with the strike voltage requirements after being subjected to an ambient temperature of 0 C for four hours and again after being subjected to an ambient temperature of 49 C for an additional four hours. 4. Discharge Test -- Protectors must comply with strike voltage requirements after being subjected to five successive discharges from a 2 F capacitor charged to 1000 V dc. (Figure 4.13) 5. Repeated Discharge Test -- Protectors must not break down at a voltage higher than the manufacturer's maximum rated breakdown voltage nor lower than rated stand-off
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UL 497B
voltage after being subjected to 500 discharges from a 0.001 F capacitor charged to 10,000 V dc. The discharges are applied in five-second intervals between one side of the protector and Ground. Upon completion of the discharge tests, protectors are once again required to meet the strike voltage requirement. (Figure 4.13) Note: The epoxy used to construct a SIDACtor device body meets UL 94V-0 requirements for flammability.
R1 50,000 25 W
R2 10 5W
C1
V
Test Specimen
Variable DC Supply 0-1000 V
Figure 4.12 UL 497B Strike Voltage Breakdown Test
Variable DC Supply * 0-12,000 V
C1
V
Test Specimen
*Or Voltage Capability Necessary to Develop 10,000 V Across Capacitor
Figure 4.13
UL 497B Discharge Test
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Regulatory Requirements
R1 5 M 50 W
Spot Switch
R2 10 5W
UL 497C
UL 497C
UL 497C requirements cover protectors for use on coaxial cable circuits. This standard covers construction and performance requirements.
UL 497C Construction and Performance Requirements
The "Construction" section covers the following requirements: * General * Corrosion Protection * Field-wiring Connections * Components * Spacing * Enclosures The "Performance" section covers the following requirements: * General * I2t Limiting * Abnormal Sustained Current * Component Temperature Test * Breakdown Voltage Measurement * Impulse Spark-over Voltage Measurement * Limited Short-circuit Test * High Current Ground Path Test * Cable Shield Fuse Test * Endurance Conditioning Test * Induced Low Current Test * Distortion Test * Flame Test * Impact Test (Polymeric Enclosures) * Jarring Test * Water Spray Test * Leakage Current Test * Dielectric Voltage-withstand Test * Ultraviolet Light and Water Exposure * Tensile Strength and Elongation Tests * Air Oven Aging * Ozone Exposure
Performance Requirements Specific to SIDACtor Devices
1. Strike Voltage Breakdown Test -- Protectors are required to break down within 25% of the manufacturer's specified breakdown range but no higher than 750 V at 2 kV/s rise time. 2. Endurance Conditioning -- Protectors are subjected to 500 impulse cycles. Each cycle is a 1000 V peak, 10 A, 10x1000 s pulse. Pulses are applied in one polarity at 10-second intervals and then repeated in the opposite polarity. Then, 100 cycles of 1000 V peak, 100 A, 10x1000 s pulse are applied to three new protectors. Finally, two cycles of
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UL 497C
1000 V peak, 5000 A, 8x20 s pulse are applied to three new protectors, with a rest period of one minute between surges. 3. Variable Ambient Conditioning -- Protectors must comply with the strike voltage requirements after being subjected to an ambient temperature of 25 C for four hours and again after being subjected to an ambient temperature of 90 C for an additional four hours. 4. Discharge Test -- Protectors must comply with strike voltage requirements after being subjected to a discharge of 1000 V, 100 10 V/s, 10 A impulse.
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Regulatory Requirements
Regulatory Compliant Solutions
Regulatory Compliant Solutions
When determining the most appropriate solution to meet the lightning and AC power fault conditions for regulatory requirements, coordination is essential between the SIDACtor device, fuse, and any series impedance that may be used. Figure 4.14 through Figure 4.19 show templates in which this coordination is considered for the most cost effective and reliable solutions available. For exact design criteria and information regarding the applicable regulatory requirements, refer to the SIDACtor device and fuse selection criteria in this Section 4, "Regulatory Requirements", and in Section 5, "Technical Notes".
GR 1089 and ITU-T K.20 and K.21
Figure 4.14 and Figure 4.15 show line interface protection circuits to meet GR 1089 surge immunity requirements without the additional use of series resistance. Use the "C" series SIDACtor device and F1250T to meet GR 1089 surge immunity requirements. Use the "A" series SIDACtor device and F0500T to meet ITU-T K.20 and K.21 basic surge immunity requirements without the additional use of resistance. The enhanced surge immunity requirements of ITU K.20 and K.21 require the use of "C" rated SIDACtor devices if no series resistor is used.
.
F1250T Tip To Protected Equipment Ring F1250T
Figure 4.14 Balanced Line Protection using Teccor's "AC" or "AA" series
F1250T / F0500T Tip To Protected Equipment Ring
Figure 4.15 Metallic-only Solution using Teccor's "SC" or "SA" series.
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Regulatory Compliant Solutions
TIA-968 (formerly known as FCC Part 68) and UL 60950
Because equipment that is tested to TIA-968 (formerly known as FCC Part 68) specifications is also generally tested to UL 60950 specifications, it is easiest to look at a solution that meets both FCC and UL requirements simultaneously.
TIA-968 Operational Solution and UL 60950
Figure 4.16 and Figure 4.17 show line interface protection circuits that meet UL 60950 power cross requirements and pass TIA-968 Type A and Type B lightning immunity tests operationally.
F1250T Tip To Protected Equipment Ring F1250T
Figure 4.16 Balanced Line Protection using Teccor's "AC" Series
F1250T Tip To Protected Equipment Ring
Figure 4.17 Metallic-only Solution using Teccor's "SB" or "EB" Series
TIA-968 Non-Operational Solution and UL 60950
Although the circuits shown in Figure 4.16 and Figure 4.17 provide an operational solution for TIA-968, TIA-968 allows telecommunications equipment to pass Type A surges nonoperationally as well. For non-operational TIA-968 solutions, coordinate the IPP rating of the SIDACtor device and the I2t rating of the fuse so that both will withstand the TIA-968 Type B surge, but that during the Type A surge the fuse will open.
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Regulatory Requirements
Regulatory Compliant Solutions
Figure 4.18 and Figure 4.19 are line interface protection circuits that meet UL power cross requirements and pass TIA-968 lightning immunity surge A tests "non-operationally".
F0500T Tip To Protected Equipment Ring F1250T
Figure 4.18
Balanced Line Protection using Teccor's "AA" Series
F0500T Tip To Protected Equipment Ring
Figure 4.19
Metallic-only Solution using Teccor's "SA" or "EA" Series
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Surge Waveforms for Various Standards
Surge Waveforms for Various Standards
TIA-968 now replaces FCC Part 68, except for hearing aid compatibility (HAC), volume control, and indoor cabling. This has become harmonized with Canadian requirements. Various countries around the world have adopted this regulation. GR 1089 is a standard generally supported by the US Regional Bell Operating Companies (RBOC). It is updated by Telcordia Technology (formerly Bellcore). The RBOC typically requires compliance with GR 1089 for any of their telecom purchases. ITU is a specialized agency of the UN devoted to international harmonization. Most European countries recognize the ITU standards. CNET is the Centre National d'etudes de Telecommunications, a French organization. VDE is the Verband Deutsher Elektrotechniker, a Federation of German electrical engineers. VDE is very similar to the IEEE (Institute of Electrical and Electronics Engineers) but is national in scope rather than global. ANSI is the American National Standards Institute, which is a non-government organization. The British equivalent to this is BSI. IEC is the International Electrotechnical Commission, a result of Europe's move toward a single market structure and its drive to formalize and harmonize member countries' requirements. FTZ R12 is a German specification.
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Regulatory Requirements
Table 4.19 and Table 4.20 show the recommended SIDACtor device surge rating for each standard.
Surge Waveforms for Various Standards
Table 4.19
Surge Waveforms for Various Standards
Voltage Standard Volts 800 Voltage Waveform s 10x560 Current Amps 100 Current Waveform s 10x560 SIDACtor Device w/o series R B or C
TIA-968 (formerly known as FCC Part 68)
Surge A Metallic
Surge A Longitudinal Surge B Metallic Surge B Longitudinal GR 1089 Test 1 Test 2 Test 3 Test 4 Test 5 ITU K.17 RLM 88, CNET CNET 131-24 VDE 0433 VDE 0878 IEC 61000-4-5 FTZ R12
1500 1000 1500 600 1000 1000 2500 1000 1500 1500 1000 2000 2000 2 kV 4 kV 2000
10x160 9x720 9x720 10x1000 10x360 10x1000 2x10 10x360 10x700 0.5x700 0.5x700 10x700 1.2x50 10x700 10x700 10x700
200 25 37.5 100 100 100 500 25 37.5 38 25 50 50 50 100 50
10x160 5x320 5x320 10x1000 10x360 10x1000 2x10 10x360 5x310 0.2x310 0.8x310 5x310 1x20 5x310 8x20 5x310
C A, B, or C A, B, or C C B or C C C A, B, or C A, B, or C A, B, or C A, B, or C A, B, or C A, B, or C A, B, or C C A, B, or C
Table 4.20
Surge Waveforms for Various Standards
Voltage Volts Basic/ Enhanced 1 kV/4 kV 1.5 kV/4 kV 1.5 kV/4 kV 1.5 kV/6 kV 600 600/1.5 kV 1.5 kV/4 kV 1.5 kV/6 kV 1.5 kV/4 kV 1.5 kV/6 kV 600 600/1.5 kV Voltage Waveform Current Amps Basic/ Enhanced 25/100 37.5/100 37.5/100 37.5/100 1 1/7.5 37.5/100 37.5/150 37.5/100 37.5/150 1 1/7.5 Current Waveform s Basic/ Enhanced 5x310 5x310 5x310 5x310 0.2 s 0.2 s/2 s 5x310 5x310 5x310 5x310 0.2 s 0.2 s/2 s SIDACtor Device w/o series R Basic/ Enhanced A, B, C/B, C A, B, C/B, C A, B, C/B, C A, B, C/C F1250T F1250T * A, B, C/B, C A, B, C/C A, B, C/B, C A, B, C/C F1250T F1250T *
Standard ITU K.20 Basic single port Enhanced single Basic multiple ports Enhanced multiple Basic power cross Enhanced power cross ITU K.21 Basic single port Enhanced single Basic multiple ports Enhanced multiple Basic power cross Enhanced power cross
s 10x700 10x700 10x700 10x700 50 Hz, 60 Hz 50 Hz, 60 Hz 10x700 10x700 10x700 10x700 50 Hz, 60Hz 50 Hz, 60Hz
* At 7.5 A the F1250T will open, which is not allowed for enhanced requirements of ITU K.20 and K.21.
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5 Technical Notes
This section is offered to help answer any questions not previously addressed in this data book regarding the SIDACtor device and its implementation. Construction and Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 SIDACtor Device Selection Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5 Fuse Selection Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8 Overvoltage Protection Comparison. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 Overcurrent Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14 PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18 SIDACtor Soldering Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-22 TeleLink Fuse Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25 Telecommunications Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-26 Lightning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-27
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Technical Notes
Construction and Operation
Construction and Operation
SIDACtor devices are thyristor devices used to protect sensitive circuits from electrical disturbances caused by lightning-induced surges, inductive-coupled spikes, and AC power cross conditions. The unique structure and characteristics of the thyristor are used to create an overvoltage protection device with precise and repeatable turn-on characteristics with low voltage overshoot and high surge current capabilities.
Key Parameters
Key parameters for SIDACtor devices are VDRM, IDRM, VS, IH, and VT, as shown in Figure 5.1. VDRM is the repetitive peak off-state voltage rating of the device (also known as stand-off voltage) and is the continuous peak combination of AC and DC voltage that may be applied to the SIDACtor device in its off-state condition. IDRM is the maximum value of leakage current that results from the application of VDRM. Switching voltage (VS) is the maximum voltage that subsequent components may be subjected to during a fast-rising (100 V/s) overvoltage condition. Holding current (IH) is the minimum current required to maintain the device in the on state. On-state voltage (VT) is the maximum voltage across the device during full conduction.
+I
IT IS IH IDRM -V VT VDRM VS +V
-I
Figure 5.1 V-I Characteristics
Operation
The SIDACtor device operates much like a switch. In the off state, the device exhibits leakage currents (IDRM) less than 5 A, making it invisible to the circuit it is protecting. As a transient voltage exceeds the SIDACtor device's VDRM, the device begins to enter its protective mode with characteristics similar to an avalanche diode. When supplied with enough current (IS), the SIDACtor device switches to an on state, shunting the surge from the circuit it is protecting. While in the on state, the SIDACtor device is able to sink large
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Technical Notes
Construction and Operation
amounts of current because of the low voltage drop (VT) across the device. Once the current flowing through the device is either interrupted or falls below a minimum holding current (IH), the SIDACtor resets, returning to its off state. If the IPP rating is exceeded, the SIDACtor device typically becomes a permanent short circuit.
Physics
The SIDACtor device is a semiconductor device which is characterized as having four layers of alternating conductivity: PNPN. (Figure 5.2) The four layers include an emitter layer, an upper base layer, a mid-region layer, and a lower base layer. The emitter is sometimes referred to as a cathode region, with the lower base layer being referred to as an anode region. As the voltage across the SIDACtor device increases and exceeds the device's VDRM, the electric field across the center junction reaches a value sufficient to cause avalanche multiplication. As avalanche multiplication occurs, the impedance of the device begins to decrease, and current flow begins to increase until the SIDACtor device's current gain exceeds unity. Once unity is exceeded, the SIDACtor device switches from a high impedance (measured at VS) to a low impedance (measured at VT) until the current flowing through the device is reduced below its holding current (IH).
P N N
Figure 5.2
N
P
Geometric Structure of Bidirectional SIDACtor devices
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SIDACtor Device Selection Criteria
SIDACtor Device Selection Criteria
When selecting a SIDACtor device, the following criteria should be used:
Off-state Voltage (VDRM)
The VDRM of the SIDACtor device must be greater than the maximum operating voltage of the circuit that the SIDACtor device is protecting. Example 1: For a POTS (Plain Old Telephone Service) application, convert the maximum operating Ring voltage (150 V rms) to a peak voltage, and add the maximum DC bias of the central office battery: 150 VRMS O2 + 56.6 VPK = 268.8 VPK \ VDRM > 268.8 V Example 2: For an ISDN application, add the maximum voltage of the DC power supply to the maximum voltage of the transmission signal (for U.S. applications, the U-interface will not have a DC voltage, but European ISDN applications may): 150 VPK + 3 VPK = 153 VPK \ VDRM > 153 V
Switching Voltage (VS)
The VS of the SIDACtor device should be equal to or less than the instantaneous peak voltage rating of the component it is protecting. Example 1: VS VRelay Breakdown Example 2:
Peak Pulse Current (IPP)
For circuits that do not require additional series resistance, the surge current rating (IPP) of the SIDACtor device should be greater than or equal to the surge currents associated with the lightning immunity tests of the applicable regulatory requirement (IPK): IPP IPK For circuits that use additional series resistance, the surge current rating (IPP) of the SIDACtor device should be greater than or equal to the available surge currents associated with the lightning immunity tests of the applicable regulatory requirement (IPK(available)): IPP IPK(available)
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Technical Notes
VS SLIC VPK
SIDACtor Device Selection Criteria
The maximum available surge current is calculated by dividing the peak surge voltage (VPK) by the total circuit resistance (RTOTAL): IPK(available) = VPK/RTOTAL For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and Ring: RSOURCE = VPK/IPK RTOTAL = RTIP + RSOURCE RTOTAL = RRING + RSOURCE For metallic surges (Tip-Ring): RSOURCE = VPK/IPK RTOTAL = RTIP + RRING + RSOURCE Example 1: A modem manufacturer must pass the Type A surge requirement of TIA-968 (formerly known as FCC Part 68) without any series resistance. IPK = 100 A, 10x560 s IPP 100 A, 10x560 s Therefore, either a "B" rated or "C" rated SIDACtor device would be selected. Example 2: A line card manufacturer must pass the surge requirements of GR 1089 with 30 W on Tip and 30 W on Ring. IPK = 100 A, 10x1000 s VPK = 1000 V RSOURCE = VPK/IPK = 10 W RTOTAL = RSOURCE + RTIP = 40 W IPK (available) = VPK/RTOTAL = 1000 V/40 W \ IPP 25 A
Holding Current (IH)
Because TIA-968 4.4.1.7.3 specifies that registered terminal equipment not exceed 140 mA dc per conductor under short-circuit conditions, the holding current of the SIDACtor device is set at 150 mA. For specific design criteria, the holding current (IH) of the SIDACtor device must be greater than the DC current that can be supplied during an operational and short circuit condition.
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SIDACtor Device Selection Criteria
Off-State Capacitance (CO)
Assuming that the critical point of insertion loss is 70% of the original signal value, the SIDACtor device can be used in most applications with transmission speeds up to 30 MHz. For transmission speeds greater than 30 MHz, the new MC series is highly recommended.
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Technical Notes
Fuse Selection Criteria
Fuse Selection Criteria
A fuse can be relied upon to operate safely at its rated current, at or below its rated voltage. This voltage rating is covered by the National Electric Code (NEC) regulations and is a requirement of UL as protection against fire risk. The standard voltage ratings used by fuse manufacturers for most small dimension fuses are 32 V, 63 V, 125 V, 250 V, and 600 V. Fuses are not sensitive to changes in voltage; however, they are sensitive to changes in current. The fuse will maintain "steady-state" operation from zero volts to the maximum voltage rating. It is not until the fuse element melts and internal arcing occurs, that circuit voltage and available power become an issue. The interrupt rating of the fuse addresses this issue. Specifically, the voltage rating determines the ability of the fuse to suppress internal arcing that occurs after the fuse link melts. For telecommunication applications, a voltage rating of 250 V is chosen because of the possibility of power line crosses. A three-phase voltage line will have voltage values up to 220 V. It is desirable for the voltage rating of the fuse to exceed this possible power cross event. UL 60950 has a power cross test condition that requires a fuse to have an interrupt rating of 40 A at 600 V. GR 1089 contains a power cross test condition that requires a fuse to have an interrupt rating of 60 A at 600 V. A 125 V-rated part will not meet this requirement. A 250 V part with special design consideration, such as Teccor's F1250T TeleLink fuse, does meet this requirement. Because fuses are rated in terms of continuous voltage and current-carrying capacity, it is often difficult to translate this information in terms of peak pulse current ratings. To simplify this process, Table 5.1 shows the surge rating correlation to fuse rating.
Table 5.1 Surge Rating Correlation to Fuse Rating
Equivalent IPP Rating Fuse Rating (mA) 250 350 400 500 600 750 1000 1250 10x160 s (A) 30 45 50 65 75 90 130 160 10x560 s (A) 15 25 30 35 45 65 85 115 10x1000 s (A) 10 20 25 30 35 50 65 100
Notes: * The IPP ratings apply to a 2AG (glass body) slow blow fuse only. * Because there is a high degree of variance in the fusing characteristics, the IPP ratings listed should only be used as approximations.
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Fuse Selection Criteria
Peak Pulse Current (IPP)
For circuits that do not require additional series resistance, the surge current rating (IPP) of the fuse should be greater than or equal to the surge currents associated with the lightning immunity tests of the applicable regulatory requirement (IPK): IPP IPK For circuits that use additional series resistance, the surge current rating (IPP) of the fuse should be greater than or equal to the available surge currents associated with the lightning immunity tests of the applicable regulatory requirement (IPK(available)): IPP IPK(available) The maximum available surge current is calculated by dividing the peak surge voltage (VPK) by the total circuit resistance (RTOTAL): IPK(available) = VPK/RTOTAL For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and Ring: RSOURCE = VPK/IPK RTOTAL = RTIP + RSOURCE RTOTAL = RRING + RSOURCE For metallic surges (Tip-Ring): RSOURCE = VPK/IPK RTOTAL = RTIP + RRING + RSOURCE
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Technical Notes
Overvoltage Protection Comparison
Overvoltage Protection Comparison
The four most commonly used technologies for overvoltage protection are: * SIDACtor devices * Gas Discharge Tubes (GDTs) * Metal Oxide Varistors (MOVs) * TVS diodes All four technologies are connected in parallel with the circuit being protected, and all exhibit a high off-state impedance when biased with a voltage less than their respective blocking voltages.
SIDACtor devices
A SIDACtor device is a PNPN device that can be thought of as a TVS diode with a gate. Upon exceeding its peak off-state voltage (VDRM), a SIDACtor device will clamp a transient voltage to within the device's switching voltage (VS) rating. Then, once the current flowing through the SIDACtor device exceeds its switching current, the device will crowbar and simulate a short-circuit condition. When the current flowing through the SIDACtor device is less than the device's holding current (IH), the SIDACtor device will reset and return to its high off-state impedance.
Advantages
Advantages of the SIDACtor device include its fast response time (Figure 5.3), stable electrical characteristics, long term reliability, and low capacitance. Also, because the SIDACtor device is a crowbar device, it cannot be damaged by voltage and it has extremely high surge current ratings.
Restrictions
Because the SIDACtor device is a crowbar device, it cannot be used directly across the AC line; it must be placed behind a load. Failing to do so will result in exceeding the SIDACtor device's surge current rating, which may cause the device to enter a permanent short-circuit condition.
Applications
Although found in other applications, SIDACtor devices are primarily used as the principle overvoltage protector in telecommunications and data communications circuits. For applications outside this realm, follow the design criteria in "SIDACtor Device Selection Criteria" on page 5-5.
Gas Discharge Tubes
Gas tubes are either glass or ceramic packages filled with an inert gas and capped on each end with an electrode. When a transient voltage exceeds the DC breakdown rating of the device, the voltage differential causes the electrodes of the gas tube to fire, resulting in an arc, which in turn ionizes the gas within the tube and provides a low impedance path for the
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Overvoltage Protection Comparison
transient to follow. Once the transient drops below the DC holdover voltage and current, the gas tube returns to its off state.
Advantages
Gas tubes have high surge current and low capacitance ratings. Current ratings can be as high as 500 A for 200 impulses, and capacitance ratings can be as low as 1 pF with a zerovolt bias.
Restrictions
Gas tubes have a limited shelf life and their performance degrades with usage. Out of the four devices discussed, gas tubes exhibit the slowest response time and highest peak voltage measurement. (Figure 5.3)
Applications
Because gas tubes are large and require a substantial amount of time to reach full conduction, they are rarely used as board-level components. Consequently, gas tubes are not normally used in telecommunications applications other than station protection modules.
Metal Oxide Varistors
Metal Oxide Varistors (MOVs) are two-leaded, through-hole components typically shaped in the form of discs. Manufactured from sintered oxides and schematically equivalent to two back-to-back PN junctions, MOVs shunt transients by decreasing their resistance as voltage is applied.
Advantages
Since MOVs surge capabilities are determined by their physical dimensions, high surge current ratings are available. Also, because MOVs are clamping devices, they can be used as transient protectors in secondary AC power line applications.
Restrictions Technical Notes
Like gas tubes, MOVs have slow response times resulting in peak clamping voltages which can be greater than twice the device's voltage rating. (Figure 5.3) MOVs also have longterm reliability and performance issues due to their tendency to fatigue, high capacitance, and limited packaging options.
Applications
Although MOVs are restricted from use in many telecom applications (other than disposable equipment), they are useful in AC applications where a clamping device is required and tight voltage tolerances are not.
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Overvoltage Protection Comparison
TVS Diodes
Transient Voltage Suppressor (TVS) diodes are clamping voltage suppressors that are constructed with back-to-back PN junctions. During conduction, TVS diodes create a low impedance path by varying their resistance as voltage is applied across their terminals. Once the voltage is removed, the diode will turn off and return to its high off-state impedance.
Advantages
Because TVS diodes are solid state devices, they do not fatigue nor do their electrical parameters change as long as they are operated within their specified limits. TVS diodes effectively clamp fast-rising transients and are well suited for low-voltage applications that do not require large amounts of energy to be shunted.
Restrictions
Because TVS diodes are clamping devices, they have two inherent weaknesses. First, TVS diodes are both voltage- and current-limited, so careful consideration should be given to using these in applications that require large amounts of energy to be shunted. Secondly, as the amount of current flowing through the device increases, so does its maximum clamping voltage.
Applications
Due to their low power ratings, TVS diodes are not used as primary interface protectors across Tip and Ring; they are used as secondary protectors that are embedded within a circuit.
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Overvoltage Protection Comparison
dv/dt Chart
Figure 5.3 shows a peak voltage comparison between SIDACtor devices, gas discharge tubes, MOVs, and TVS diodes, all with a nominal stand-off voltage rating of 230 V. The X axis represents the dv/dt (rise in voltage with respect to time) applied to each protector, and the Y axis represents the maximum voltage drop across each protector.
1000
900
230 V Devices
800
Breakover Voltage - Volts
700
600
Gas Tube MOV
500
400
SIDACtor
300
Avalanche Diode
200 0.001
0.01
0.1
1
10
100
1000
dv/dt - Volts/s
Figure 5.3
Overshoot Levels versus dv/dt
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Technical Notes
Overcurrent Protection
Overcurrent Protection
In addition to protecting against overvoltage conditions, equipment should also be protected from overcurrent conditions using either PTCs, fuses, power/line feed resistors, or flameproof resistors. In all instances the overcurrent protector is a series element placed in front of the overvoltage protector on either Tip or Ring for metallic (closed loop) applications and on both Tip and Ring for longitudinal (grounded) applications.
PTCs
PTCs are positive temperature coefficient thermistors used to limit current. During a fault condition, heat is generated at a rate equal to I2R. When this heat becomes sufficient, the PTC increases its resistance asymptotically until the device simulates an open circuit, limiting the current flow to the rest of the circuit. As the fault condition drops below the PTC's holding current, the device begins to reset, approximating its original off-state value of impedance.
Advantages
Because PTCs are resettable devices, they work well in a variety of industrial applications where electrical components cannot withstand multiple, low-current faults.
Restrictions
Although PTCs are well suited for the industrial environment and in many telecom applications, they exhibit some limitations that have prevented them from being endorsed by the entire telecommunications industry. Limitations include low surge current ratings, unstable resistance, and poor packaging options.
Applications
PTCs are used in a variety of applications. In addition to protecting telecommunications equipment, PTCs are also used to prevent damage to rechargeable battery packs, to interrupt the current flow during a motor lock condition, and to limit the sneak currents that may cause damage to a five-pin module.
Fuses
Due to their stability, fuses are one of the most popular solutions for meeting AC power cross requirements for telecommunications equipment. Similar to PTCs, fuses function by reacting to the heat generated due to excessive current flow. Once the fuses I2t rating is exceeded, the center conductor opens.
Advantages
Fuses are available in both surface mount and through-hole packages and are able to withstand the applicable regulatory requirements without the use of any additional series impedance. Chosen correctly, fuses only interrupt a circuit when extreme fault conditions exist and, when coordinated properly with an overvoltage protector, offer a very competitive and effective solution for transient immunity needs.
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Overcurrent Protection
Advantages include: * Elimination of series line resistance enabling longer loop lengths * Precise longitudinal balance allowing better transmission quality * Robust surge performance which eliminates costly down time due to nuisance blows * Greater surge ratings than resettable devices, ensuring regulatory compliance * Non-degenerative performance * Available in surface mount packaging which uses less Printed Circuit Board (PCB) real estate, eliminates mixed technologies, and reduces manufacturing costs
Weaknesses
Because a fuse does not reset, consideration should be given to its use in applications where multiple fault occurrences are likely. For example, AC strip protectors and ground fault interrupting circuits (GFIC) are applications in which an alternative solution might be more prudent.
Applications
Telecommunications equipment best suited for a fuse is equipment that requires surface mount technology, accurate longitudinal balance, and regulatory compliance without the use of additional series line impedance.
Selection Criteria
For circuits that do not require additional series resistance, the surge current rating (IPP) of the TeleLink SM fuse should be greater than or equal to the surge currents associated with the lightning immunity tests of the applicable regulatory requirement (IPK). IPP IPK For circuits that use additional series resistance, the surge current rating (IPP) of the TeleLink SM fuse should be greater than or equal to the available surge currents associated with the lightning immunity tests of the applicable regulatory requirement (IPK (available)). IPP IPK (available) The maximum available surge current is calculated by dividing the peak surge voltage (VPK) by the total circuit resistance (RTOTAL). IPP IPK (available) = VPK/RTOTAL For longitudinal surges (Tip-Ground, Ring-Ground), RTOTAL is calculated for both Tip and Ring. RTOTAL = RTIP + RSOURCE RTOTAL = RRING + RSOURCE For metallic surges (Tip-Ring): RTOTAL = RTIP + RRING + RSOURCE
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Technical Notes
Overcurrent Protection
To select the most appropriate combination of TeleLink SM fuse and SIDACtor device, decide the regulatory requirement your equipment must meet:
Regulatory Requirement GR 1089 TIA-968, Type A TIA-968, Type B ITU K.20 ITU K.21 Basic/Enhanced UL 60950 TeleLink SM Fuse F1250T F1250T F0500T F1250T F1250T All SIDACtor Device C Series B Series A Series A Series A Series All
For applications that do not require agency approval or multiple listings, contact the factory.
Power/Line Feed Resistors
Typically manufactured with a ceramic case or substrate, power and line feed resistors have the ability to sink a great deal of energy and are capable of withstanding both lightning and power cross conditions.
Advantages
Power and line feed resistors are available with very tight resistive tolerances, making them appropriate for applications that require precise longitudinal balance.
Restrictions
Because power and line feed resistors are typically very large and are not available in a surface mount configuration, these devices are less than desirable from a manufacturing point of view. Also, because a thermal link is typically not provided, power and line feed resistors may require either a fuse or a PTC to act as the fusing element during a power cross condition.
Applications
Power and line feed resistors are typically found on line cards that use overvoltage protectors that cannot withstand the surge currents associated with applicable regulatory requirements.
Flameproof Resistors
For cost-sensitive designs, small (1/8 W - 1/4 W), flameproof metal film resistors are often used in lieu of PTCs, fuses, and power or line feed resistors. During a transient condition, flameproof resistors open when the resultant energy is great enough to melt the metal used in the device.
Advantages
Flameproof resistors are inexpensive and plentiful.
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Overcurrent Protection
Restrictions
Flameproof resistors are not resistive to transient conditions and are susceptible to nuisance blows.
Applications
Outside of very inexpensive customer premise equipment, small resistors are rarely used as a means to protect telecommunications equipment during power fault conditions.
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Technical Notes
PCB Layout
PCB Layout
Because the interface portion of a Printed Circuit Board (PCB) is subjected to high voltages and surge currents, consideration should be given to the trace widths, trace separation, and grounding.
Trace Widths
Based on the Institute for Interconnecting and Packaging Electronic Currents, IPC D 275 specifies the trace widths required for various current-carrying capacities. This is very important for grounding conditions to ensure the integrity of the trace during a surge event. The required width is dependent on the amount of copper used for the trace and the acceptable temperature rise which can be tolerated. Teccor recommends a 0.025 inch trace width with 1 ounce copper. (For example, a 38-AWG wire is approximately equal to 8 mils to 10 mils. Therefore, the minimum trace width should be greater than 10 mils.)
35 30 25 20 15 12 10 8 7 6 5 4 3 2 1.5 1 .75 .50 .25 .125 0 0 1 5 10 20 30 50 70 100 150 200 250 300 400 Conductor Cross-Section Area (sq mils)
75 C Allowable 60 C Temperature 45 C Rise 30 C 20 C 10 C
Current in Amperes
500 600 700
Figure 5.4
Current versus Area
The minimum width and thickness of conductors on a PCB is determined primarily by the current-carrying capacity required. This current-carrying capacity is limited by the allowable temperature rise of the etched copper conductor. An adjacent ground or power layer can significantly reduce this temperature rise. A single ground plane can generally raise the allowed current by 50%. An easy approximation can be generated by starting with the information in Figure 5.4 to calculate the conductor cross-sectional area required. Once this
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PCB Layout
has been done, Figure 5.5 shows the conversion of the cross-sectional area to the required conductor width, dependent on the copper foil thickness of the trace.
0 .001
Conductor width in inches
.005 .010 .020 .030 .050 .070 .100 .150 .200 .250 .300 .350 0 1 5 10 20
(1/
2o
z/f
t 2)
(2 o
0.0 00 7"
(3 oz
z/ft 2 ) 0.0
014
/ft 2)
0.00 42"
(1
oz/
028 "
ft 2)
0.0
"
30 50 70 100 150 200
250
300
400
500
600
700
Conductor Cross-Section Area (sq mils)
Figure 5.5
Conductor Width versus Area
Trace Separation
Tip and Ring traces are subjected to various transient and overvoltage conditions. To prevent arcing between traces, minimum trace separation should be maintained. UL 60950 will provide additional information regarding creepage and clearance requirements, which are dependent on the Comparative Tracking Index (CTI) rating of the PCB, working voltage, and the expected operating environment. See "UL 60950 3rd Edition (formerly UL 1950, 3rd edition)" on page 4-16 of this data book. A good rule of thumb for outside layers is to maintain a minimum of 18 mils for 1kV isolation. Route the Tip and Ring traces towards the edge of the PCB away from areas containing static sensitive devices.
Grounding
Although often overlooked, grounding is a very important design consideration when laying out a protection interface circuit. To optimize its effectiveness, several things should be considered in sequence: 1. Provide a large copper plane with a grid pattern for the Ground reference point. 2. Decide if a single-point or a multi-point grounding scheme is to be used. A single-point (also called centralized) grounding scheme is used for circuit dimensions smaller than one-tenth of a wavelength (l = 300,000/frequency) and a multi-point (distributed) grounding scheme is used for circuit trace lengths greater than one-fourth of a wavelength.
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Technical Notes
PCB Layout
3. Because traces exhibit a certain level of inductance, keep the length of the ground trace on the PCB as short as possible in order to minimize its voltage contribution during a transient condition. In order to determine the actual voltage contributed to trace inductance, use the following equations: V = L (di/dt) L = 0.0051 r [loge 2 r/(t+w) +1/2 - logeG] in H where r = length of trace G = function of thickness and width as provided in Table 5.3 t = trace thickness w = trace width For example, assume circuit A is protected by a P3100SC with a VS equal to 300 V and a ground trace one inch in length and a self-inductance equal to 2.4 H/inch. Assume circuit B has the identical characteristics as Circuit A, except the ground trace is five inches in length instead of one inch in length. If both circuits are surged with a 100 A, 10x1000 s wave-form, the results would be as shown in Table 5.2:
Table 5.2 Overshoot Caused by Trace Inductance
VL = L (di/dt) Circuit A Circuit B VL = 2.4 H (100 A/10 s) = 24 V VL = 12 H (100 A/10 s) = 120 V SIDACtor device VS 300 V 300 V Total protection level (VL + VS) 324 V 420 V
Other practices to ensure sound grounding techniques are: 1. Cross signal grounds and earth grounds perpendicularly in order to minimize the field effects of "noisy" power supplies. 2. Make sure that the ground fingers on any edge connector extend farther out than any power or signal leads in order to guarantee that the ground connection invariably is connected first.
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PCB Layout
Table 5.3
Values of Constants for the Geometric Mean Distance of a Rectangle
t/w or w/t 0.000 0.025 0.050 0.100 0.150 0.200 0.250 0.300 0.350 0.400 0.450 0.500 0.500 0.550 0.600 0.650 0.700 0.750 0.800 0.850 0.900 0.950 1.000 0.000 K 0.22313 0.22333 0.22346 0.22360 0.22366 0.22369 0.22369 0.22368 0.22366 0.22364 0.22362 0.22360 0.22360 0.22358 0.22357 0.22356 0.22355 0.22354 0.22353 0.22353 0.22353 0.223525 0.223525 0.0 LogeG 0.0 0.00089 0.00146 0.00210 0.00239 0.00249 0.00249 0.00244 0.00236 0.00228 0.00219 0.00211 0.00211 0.00203 0.00197 0.00192 0.00187 0.00184 0.00181 0.00179 0.00178 0.00177 0.00177 0.0
Note: Sides of the rectangle are t and w. The geometric mean distance R is given by: logeR = loge(t+w) - 1.5 + logeG. R = K(t+w), logeK = -1.5 + logeG.
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Technical Notes
SIDACtor Soldering Recommendations
SIDACtor Soldering Recommendations
When placing surface mount components, a good solder bond is critical because: * The solder provides a thermal path in which heat is dissipated from the packaged silicon to the rest of the board. * A good bond is less subject to thermal fatiguing and results in improved component reliability.
Reflow Soldering
The preferred technique for mounting the DO-214AA package is to reflow-solder the device onto a PCB-printed circuit board, as shown in Figure 5.6.
1. Screen print solder paste (or flux)
2. Place component (allow flux to dry)
3. Reflow solder
Figure 5.6
Reflow Soldering Procedure
For reliable connections, the PCB should first be screen printed with a solder paste or fluxed with an easily removable, reliable solution, such as Alpha 5003 diluted with benzyl alcohol. If using a flux, the PCB should be allowed to dry to touch at room temperature (or in a 70 C oven) prior to placing the components on the solder pads. Relying on the adhesive nature of the solder paste or flux to prevent the devices from moving prior to reflow, components should be placed with either a vacuum pencil or automated pick and place machine. With the components in place, the PCB should be heated to a point where the solder on the pads begins to flow. This is typically done on a conveyor belt which first transports the PCB through a pre-heating zone. The pre-heating zone is necessary in order to reduce thermal shock and prevent damage to the devices being soldered, and should be limited to a maximum temperature of 165 C for 10 seconds. After pre-heating, the PCB goes to a vapor zone, as shown in Figure 5.7. The vapor zone is obtained by heating an inactive fluid to its boiling point while using a vapor lock to regulate the chamber temperature. This temperature is typically 215 C, but for temperatures in excess of 215 C, care should be taken so that the maximum temperature of the leads does
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SIDACtor Soldering Recommendations
not exceed 275 C and the maximum temperature of the plastic body does not exceed 250 C. (Figure 5.8)
Transport
Vapor lock (secondary medium) Vapor phase zone
Cooling pipes PC board Heating elements
Boiling liquid (primary medium)
Figure 5.7 Principle of Vapor Phase Soldering
260 240 220
Pre-heat
Soak
Peak Temperature 220 C - 245 C 1.3 - 1.6 C/s
Reflow
Cool Down
Temperature - C
200 180 160 140 120 100 80 60 40 20 0 30 60 90 <2.5 C/s 0.5 - 0.6 C/s
<2.5 C/s
Soaking Zone
60 - 90 s typical ( 2 min. MAX )
Reflow Zone
30 - 60 s typical ( 2 min. MAX )
Pre-heating Zone
( 2-4 min MAX )
120
150
180
210
240
270
300
Time (Seconds)
Figure 5.8 Reflow Soldering Profile
During reflow, the surface tension of the liquid solder draws the leads of the device towards the center of the soldering area, correcting any misalignment that may have occurred during placement and allowing the device to set flush on the pad. If the footprints of the pad are not concentrically aligned, the same effect can result in undesirable shifts as well. Therefore, it is important to use a standard contact pattern which leaves sufficient room for self-positioning. After the solder cools, connections should be visually inspected and remnants of the flux removed using a vapor degreaser with an azeotrope solvent or equivalent.
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Technical Notes
0
SIDACtor Soldering Recommendations
Wave Soldering
Another common method for soldering components to a PCB is wave soldering. After fluxing the PCB, an adhesive is applied to the respective footprints so that components can be glued in place. Once the adhesive has cured, the board is pre-heated and then placed in contact with a molten wave of solder which has a temperature between 240 C and 260 C and permanently affixes the component to the PCB. (Figure 5.8 and Figure 5.10) Although a popular method of soldering, wave soldering does have drawbacks: * A double pass is often required to remove excess solder. * Solder bridging and shadows begin to occur as board density increases. * Wave soldering uses the sharpest thermal gradient.
Apply glue
Place component
Cure glue Wave solder
Screen print glue
Figure 5.9
Wave Soldering Surface Mount Components Only
PC board
Insert leaded components Turn over the PC board Apply glue
Place SMDs
Cure glue
Turn over the PC board
Wave solder
Figure 5.10
Wave Soldering Surface Mount and Leaded Components
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TeleLink Fuse Soldering
TeleLink Fuse Soldering
For wave soldering a TeleLink fuse, the following temperature and time are recommended: * Reservoir temperature of 260 C (500 F) * Time in reservoir -- three seconds maximum For infrared, the following temperature and time are recommended: * Temperature of 240 C (464 F) * Time -- 30 seconds maximum Hand soldering is not recommended for this fuse because excessive heat can affect the fuse performance. Hand soldering should be used only for rework and low volume samples. Note the following recommendations for hand soldering: * Maximum tip temperature of 240 C (464 F) * Minimize the soldering time at temperature to achieve the solder joint. Measure the fuse resistance before and after soldering. Any fuse that shifts more than 3% should be replaced. An increase in resistance above this amount increases the possibility of a surge failure, and a decrease in resistance may cause low overloads to exceed the maximum opening times. * Inspect the solder joint to ensure an adequate solder fillet has been produced without any cracks or visible defects.
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Technical Notes
Telecommunications Protection
Telecommunications Protection
Because early telecommunications equipment was constructed with components such as mechanical relays, coils, and vacuum tubes, it was somewhat immune to lightning and power cross conditions. But as cross bar and step-by-step switches have given way to more modern equipment such as digital loop carriers, repeater amplifiers, and multiplexers, an emphasis has been put on protecting this equipment against system transients caused by lightning and power cross conditions.
Lightning
During an electrical storm, transient voltages are induced onto the telecommunications system by lightning currents which enter the conductive shield of suspended cable or through buried cables via ground currents. As this occurs, the current traveling through the conductive shield of the cable produces an equal voltage on both the Tip and Ring conductors at the terminating ends. Known as a longitudinal voltage surge, the peak value and wave-form associated with this condition is dependent upon the distance the transient travels down the cable and the materials with which the cable is constructed. Although lightning-induced surges are always longitudinal in nature, imbalances resulting from terminating equipment and asymmetric operation of primary protectors can result in metallic transients as well. A Tip-to-Ring surge is normally seen in terminating equipment and is the primary reason most regulatory agencies require telecom equipment to have both longitudinal and metallic surge protection.
Power Cross
Another system transient that is a common occurrence for telecommunications cables is exposure to the AC power system. The common use of poles, trenches, and ground wires results in varying levels of exposure which can be categorized as direct power cross, power induction, and ground potential rise. Direct power cross occurs when a power line makes direct contact to telecommunications cables. Direct contact is commonly caused by falling trees, winter icing, severe thunderstorms, and vehicle accidents. Direct power cross can result in large currents being present on the line. Power induction is common where power cables and telecommunications cables are run in close proximity to one another. Electromagnetic coupling between the cables results in system transients being induced onto the telecommunications cables, which in turn can cause excessive heating and fires in terminal equipment located at the cable ends. Ground potential rise is a result of large fault currents flowing to Ground. Due to the varying soil resistivity and multiple grounding points, system potential differences may result.
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Lightning
Lightning
Lightning is one of nature's most common and dangerous phenomena. At any one time, approximately 2,000 thunderstorms are in progress around the globe, with lightning striking the earth over 100 times per second. According to IEEE C.62, during a single year in the United States lightning strikes an average of 52 times per square mile, resulting in 100 deaths, 250 injuries, and over 100 million dollars in damage to equipment property.
The Lightning Phenomenon
Lightning is caused by the complex interaction of rain, ice, up drafts, and down drafts that occur during a typical thunderstorm. The movement of rain droplets and ice within the cloud results in a large build up of electrical charges at the top and bottom of the thunder cloud. Normally, positive charges are concentrated at the top of the thunderhead while negative charges accumulate near the bottom. Lightning itself does not occur until the potential difference between two charges is great enough to overcome the insulating resistance of air between them.
Formation of Lightning
Cloud-to-ground lightning begins forming as the level of negative charge contained in the lower cloud levels begins to increase and attract the positive charge located at Ground. When the formation of negative charge reaches its peak level, a surge of electrons called a stepped leader begins to head towards the earth. Moving in 50-meter increments, the stepped leader initiates the electrical path (channel) for the lightning strike. As the stepped leader moves closer to the ground, the mutual attraction between positive and negative charges results in a positive stream of electrons being pulled up from the ground to the stepped leader. The positively charged stream is known as a streamer. When the streamer and stepped leader make contact, it completes the electrical circuit between the cloud and ground. At that instant, an explosive flow of electrons travels to ground at half the speed of light and completes the formation of the lightning bolt.
Lightning Bolt
The initial flash of a lightning bolt results when the stepped leader and the streamer make connection resulting in the conduction of current to Ground. Subsequent strokes (3-4) occur as large amounts of negative charge move farther up the stepped leader. Known as return strokes, these subsequent bolts heat the air to temperatures in excess of 50,000 F and cause the flickering flash that is associated with lightning. The total duration of most lightning bolts lasts between 500 ms and one second. During a lightning strike, the associated voltages range from 20,000 V to 1,000,000 V while currents average around 35,000 A. However, maximum currents associated with lightning have been measured as high as 300,000 A.
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Technical Notes
NOTES
6 Mechanical Data
The following section describes the mechanical specifications of SIDACtor products. Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3 DO-214AA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3 Modified DO-214AA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4 TO-92 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5 MS-013 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6 Modified TO-220 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7 TO-218 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8 TeleLink Surface Mount Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9 Single In-line Protector (SIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10 Summary of Packing Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12 Packing Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14 DO-214AA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14 TO-92 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15 Modified MS-013 Six-pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16 Modified TO-220 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17 TeleLink Surface Mount Fuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18 Lead Form Options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20 Modified TO-220 Type 60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20 Modified TO-220 Type 61 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21 Modified TO-220 Type 62 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21
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Mechanical Data
Package Dimensions
Package Dimensions
DO-214AA
The DO-214AA package is designed to meet mechanical standards as set forth in JEDEC publication number 95.
CASE TEMPERATURE MEASUREMENT POINT
B D
C
A
H
F L
E
J
K
G
.079 (2.0)
.110 (2.8)
.079 (2.0) PAD OUTLINE (MM)
Note: A stripe is marked on some parts, to indicate the cathode. IPC-SM-782 recommends 2.4 instead of 2.0. Inches Dimension A B C D E F G H J K L MIN 0.140 0.205 0.077 0.166 0.036 0.073 0.004 0.077 0.043 0.008 0.039 MAX 0.155 0.220 0.083 0.180 0.056 0.083 0.008 0.086 0.053 0.012 0.049 MIN 3.56 5.21 1.96 4.22 0.91 1.85 0.10 1.95 1.09 0.20 0.99 Millimeters MAX 3.94 5.59 2.11 4.57 1.42 2.11 0.20 2.18 1.35 0.30 1.24
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Mechanical Data
Notes: * Dimensions and tolerances per ASME Y14.5M-1994 * Mold flash shall not exceed 0.13 mm per side. * Dimensions B and C apply to plated leads. * All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one minute from leads to case over the operating temperature range) * Dimension "C" is measured on the flat section of the lead.
Package Dimensions
Modified DO-214AA
The Modified DO-214AA package is a three-leaded surface mount (SM) package.
TEMPERATURE MEASUREMENT POINT
B D M N
PIN 3
P
AC
PIN 1 PIN 2 H E .079 (2.0) .079 (2.0) J .079 (2.0) .040 (1.0) .110 (2.8) .030 (.76)
F L
K
G
PAD OUTLINE (MM)
Note: A stripe is marked on some parts, to indicate the cathode. IPC-SM-782 recommends 2.4 instead of 2.0. Inches Dimension A B C D E F G H J K L M N P MIN 0.140 0.205 0.077 0.166 0.036 0.073 0.004 0.077 0.043 0.008 0.039 0.022 0.027 0.052 MAX 0.155 0.220 0.083 0.180 0.056 0.083 0.008 0.086 0.053 0.012 0.049 0.028 0.033 0.058 MIN 3.56 5.21 1.96 4.22 0.91 1.85 0.10 1.95 1.09 0.20 0.99 0.56 0.69 1.32 Millimeters MAX 3.94 5.59 2.11 4.57 1.42 2.11 0.20 2.18 1.35 0.30 1.24 0.71 0.84 1.47
Notes: * Dimensions and tolerancing per ASME Y14.5M-1994 * Mold flash shall not exceed 0.13 mm per side. * Dimensions B and C apply to plated leads. * All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one minute from leads to case over the operating temperature range)
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Package Dimensions
TO-92
The TO-92 is designed to meet mechanical standards as set forth in JEDEC publication number 95.
TEMPERATURE MEASUREMENT POINT
A
N
B
MT1/PIN 1 E
MT2/PIN 3
M F L D K J
H
G
Inches Dimension A B D E F G H J K L M N MIN 0.176 0.500 0.095 0.150 0.046 0.135 0.088 0.176 0.088 0.013 0.013 0.054 0.145 0.096 0.186 0.096 0.019 0.017 0.060 0.105 MAX 0.196 MIN 4.47 12.70 2.41 3.81 1.16 3.43 2.23 4.47 2.23 0.33 0.33
Millimeters MAX 4.98 2.67 1.37 3.68 2.44 4.73 2.44 0.48 0.43 1.52
Notes: * Type 70 lead form as shown is standard for the E package. * All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one minute from leads to case over the operating temperature range) * Mold flash shall not exceed 0.13 mm per side.
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Mechanical Data
Package Dimensions
MS-013
The MS-013 is designed to meet mechanical standards as set forth in JEDEC publication number 95.
K
J E
PAD OUTLINE
[.065] 1.65 [.460] 11.68
[.138] 3.50 1 FH F 7 TYP A B MOLD SPLIT LINE A G 7 TYP M
X [.059] 1.50 W BURR SIDE 96 R
4
P N
MIN LENGTH U OF FLAT T
0.08 DETAIL A SCALE 20:1
D C
7 TYP
A L 7 TYP
Inches Dimension A B C D E F G H J K L M N P R S T U W X 0.293 0.289 0.089 0.045 0.034 0.008 0.036 0.020 0.010 0.023 0.010 0.023 MIN 0.360 0.348 0.352 0.138 0.400 MAX 0.364 0.352 0.356 0.138 0.412 0.051 0.043 0.051 0.118 0.089 0.293 0.293 0.093 0.045 0.036 0.008 0.036 0.30 7.34 2.26 1.14 0.86 0.20 0.91 0.51 0.25 0.58 MIN 9.14 8.84 8.94 3.51 10.16
Millimeters MAX 9.25 8.94 9.04 3.51 10.46 1.30 1.09 1.30 3.00 2.26 7.44 7.44 2.36 1.14 0.91 0.20 0.91 0.25 0.58
Notes: * Dimensions and tolerances per ASME Y14.5M-1982 * Mold flash shall not exceed 0.13 mm per side. * All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one minute from leads to case over the operating temperature range)
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Package Dimensions
Modified TO-220
The Modified TO-220 package is designed to meet mechanical standards as set forth in JEDEC publication number 95.
A
O
D
F
TEMPERATURE MEASUREMENT POINT P PIN 3 PIN 2 PIN 1 L K H J N M
G
Inches Dimension A D F G H J K L M N O P MIN 0.400 0.360 0.110 0.540 0.025 0.195 0.095 0.075 0.070 0.018 0.178 0.290 MAX 0.410 0.375 0.130 0.575 0.035 0.205 0.105 0.085 0.085 0.024 0.188 0.310 MIN 10.16 9.14 2.80 13.71 0.63 4.95 2.41 1.90 1.78 0.46 4.52 7.37
Millimeters MAX 10.42 9.53 3.30 14.61 0.89 5.21 2.67 2.16 2.16 0.61 4.78 7.87
Notes: * All leads are insulated from case. Case is electrically non-conductive. (Rated at 1600 V ac rms for one minute from leads to case over the operating temperature range) * Mold flash shall not exceed 0.13 mm per side.
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Mechanical Data
Package Dimensions
TO-218
The TO-218 package is designed to meet mechanical standards as set forth in JEDEC publication number 95.
TC Measurement Point B U DIA. Tab is connected to PIN 2 C D
A F E W
PIN 3 P PIN 1 M PIN 2 R H G J
Q
N 3 Times
K L
Note: Maximum torque to be applied to mounting tab is 8 in-lbs. (0.904 Nm).
Inches Dimension A B C D E F G H J K L M N P R S T U V MIN 0.810 0.610 0.178 0.055 0.487 0.635 0.022 0.075 0.575 0.211 0.422 0.100 0.045 0.095 0.008 0.038 0.025 0.159 0.090 MAX 0.835 0.630 0.188 0.070 0.497 0.655 0.029 0.095 0.625 0.219 0.437 0.110 0.055 0.115 0.016 0.048 0.032 0.163 0.100 MIN 20.57 15.49 4.52 1.40 12.37 16.13 0.56 1.91 14.61 5.36 10.72 2.54 1.14 2.41 0.20 0.97 0.64 4.04 2.29
Millimeters MAX 21.21 16.00 4.78 1.78 12.62 16.64 0.74 2.41 15.88 5.56 11.10 2.79 1.40 2.92 0.41 1.22 0.81 4.14 2.54
Notes: * Mold flash shall not exceed 0.13 mm per side. * Maximum torque to be applied to mounting tab is 8 in-lbs. (0.904 Nm). * Pin 3 has no connection. * Tab is non-isolated (connects to middle pin).
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Package Dimensions
TeleLink Surface Mount Fuse
The following illustration shows the end view dimensions of a TeleLink fuse:
.109 .006 (2.77 0.15)
.109 .006 (2.77 0.15)
Dimensions are in inches (and millimeters)
The following illustration shows the top view or side view dimensions of a TeleLink fuse:
.055 .010 (1.40 0.25)
.055 .010 (1.40 0.25)
.109 .006 (2.77 0.15)
.405 .008 (10.29 0.20)
Dimensions are in inches (and millimeters)
The following illustration shows the footprint dimensions of a TeleLink fuse:
.204 (5.2) .145 3.7
.157 (4.0)
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Mechanical Data
.496 (12.6)
Dimensions are in inches (and millimeters)
Package Dimensions
Single In-line Protector (SIP)
The following illustration shows a balanced three-chip SIP protector:
0.040 0.004 (1.016 0.102) 0.450 +0.010 / -0.002 (11.430 +0.254 -0.051)
2.250 +0.010 / -0.002 (57.150 +0.254 -0.051)
0.010 (0.025) typ
0.500 (12.70) max
0.260 (6.604) max
Dimensions are in inches (millimeters). 0.110 0.010 (2.794 0.254) 0.100 0.010 non-cumulative (2.540 0.254)
The following illustration shows a longitudinal two-chip SIP protector:
0.040 0.004 (1.016 0.102) 0.450 +0.010 / -0.002 (11.430 +0.254 -0.051)
2.250 +0.010 / -0.002 (57.150 +0.254 -0.051) 0.260 (6.604) max
0.010 typ (0.025)
0.500 (12.70) max
0.075 0.010 (1.905 0.254) 0.110 0.010 (2.794 0.254)
Dimensions are in inches (millimeters). 0.020 (0.508) typ 0.100 0.010 non-cumulative (2.540 0.254)
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Package Dimensions
The following illustration shows a four-port metallic line SIP protector:
Front
0.040 0.004 (1.02 0.10)
0.500 max (12.70)
0.450 +0.010 / -0.002 (11.43 +0.25 / -0.05) Front Back
0.120 0.015 (3.05 0.38)
1.300 +0.010 / -0.002 (33.02 +0.25 / -0/05) Back
0.010 typ (0.025) 0.260 max (6.60)
Dimensions are in inches (millimeters).
0.100 0.010 (2.54 0.25) 0.020 typ (0.05) 0.100 0.008 non-cumulative (2.54 0.20)
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Mechanical Data
Summary of Packing Options
Summary of Packing Options
Package Type DO-214AA SA, SB, SC, SD, including MC Description Embossed Carrier Reel Pack Bulk Pack Packing Quantity 2500 1000 Added Suffix RP BP Industry Standard EIA-481-1 N/A
3-lead TO-92 EA, EB, EC, including MC Bulk Pack Tape and Reel Pack Ammo Pack 2000 2000 2000 RP1, RP2 AP N/A EIA-468-B EIA-468-B
Note: Standard lead spacing for TO-92 reel pack is 0.200". Modified MS-013 Tape and Reel Pack Bulk Pack Tube Pack 1500 500 50 per tube, 50 tubes per container 500 700 700 50 per tube, 10 tubes per container RP RP TP RP BP TP EIA-481-1 EIA-481-1
TO-220 AA, AB, AC, AD
Bulk Pack Tape and Reel Pack Tape and Reel Pack for Type 61 lead form Tube Pack
N/A EIA-468-B EIA-468-B EIA-468-B
Type 61 TO-218 ME Bulk Pack 250 N/A
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Summary of Packing Options
Package Type
Description Embossed Carrier Reel Pack Bulk Pack
Packing Quantity 2500 5000
Added Suffix RP BP
Industry Standard EIA-481-B N/A
TeleLink Surface Mount Fuse
Balanced Longitudinal SIP
Plastic trays
150/tray
None
None
Metallic SIP
Plastic trays
300/tray
None
None
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Mechanical Data
Packing Options
Packing Options
DO-214AA
Tape and reel packing options meet all specifications as set forth in EIA-481-1. Standard reel pack quantity is 2500. Bulk pack quantity is 500.
0.157 (4.0)
3-lead
0.472 (12.0)
0.36 (9.2)
0.315 (8.0)
0.059 DIA (1.5) 12.99 (330.0)
Cover tape
0.512 (13.0) Arbor Hole Dia.
Dimensions are in inches (and millimeters).
0.49 (12.4)
Direction of Feed
The following illustration shows the DO-214AA component orientation for P0641S, P0721S, P0901S, and P1101S:
CATHODE
The following illustration shows the modified DO-214 tape and reel:
Pin 2 Anode
0.157 (4.0) 0.472 0.374 (12.0) (9.5) 0.315 (8 0)
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C th d
Gt
Di
i
iih
(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Packing Options
TO-92
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel pack quantity is 2000.
0.25 (6.35)
0.50 (12.7) 0.236 (6.0) 1.62 (41.2) 0.708 (18.0) 0.354 (9.0) 0.50 (12.7) 14.17 (360.0) 0.02 (0.5)
0.125 (3.2) MAX 1.27 (32.2)
0.20 (5.08) 0.157 DIA (4.0)
Flat Down 1.97 (50.0) Dimensions are in inches (and millimeters).
Notes: * Part number suffix RP2 denotes 0.200" (5 mm) lead spacing and is Teccor's default value. * Part number suffix RP1 denotes 0.100" (2.54 mm) lead spacing and is available upon request.
Direction of Feed
The following figure shows the TO-92 Ammo Pack option:
0.50 (12.7) 0.02 (0.5)
0.25 (6.35)
1.62 (41.2) MAX
0.236 (6.0)
0.125 (3.2) MAX
1.27 (32.2)
0.708 (18.0)
0.354 (9.0) 0.50 (12.7) 0.20 (5.08) 0.157 (4.0) DIA
Flat down
n of Feed Directio
25 Devices per fold
1.85 (47.0)
12.2 (310.0) Dimensions are in inches (and millimeters).
1.85 (47.0) 13.3 (338.0)
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Mechanical Data
Packing Options
6 5 4 1 2 3
Modified MS-013 Six-pin
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel pack quantity is 1500.
.157 (4.0)
.630 (16.0)
.472 (12.0) 14.173 (360)
Component/Tape Layout 1,500 Devices per Reel
.512 (13.0) Arbor Hole Dia.
Dimensions are in inches (and millimeters)
.646 (16.4)
Direction of Feed
The following illustration shows the tube pack:
Message Location .020 WALL TYP. (0.51 0.13) .108 .005 A .110 (2.79)
.045 (1.14) 90 .165 (4.19)
.310 (7.87) 6 Interior of the Tube
20.000 .030 (508.00 0.76)
.150 (3.81)
.225 (5.72) .525 (13.34)
A Dimensions are in inches (and millimeters)
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Packing Options
Modified TO-220
Tape and reel packing options meet all specifications as set forth in EIA-468-B. Standard reel pack quantity is 700.
0.240 (6.10) 1.626 (41.15) 0.720 (18.29) 0.360 (9.14) 0.500 (12.7) 14.173 (360.0) 0.100 (2.54)
0.019 (0.5) 0.750 0.010 (19.05 0.25)
Type 61
0.100 (2.54)
Component/Tape Layout Standard Reel Pack (RP)
1.968 (50.0)
Direction of Feed
Dimensions are in inches (and millimeters).
The following illustration shows the tube pack:
22.0 .2 (559 5)
.220 (5.58)
.160 (4.06)
1.250 .015 (31.75) .630 .015 (16.00 0.38)
1.300 REF (136.25)
Dimensions are in inches (and millimeters)
.140 (3.56)
.025 .005 (0.64 0.13) TYP. WALL
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Mechanical Data
Packing Options
TeleLink Surface Mount Fuse
The following illustration shows the TeleLink embossed carrier tape:
.436.004 (3.15.10) .124.004 (1.75.10)
.157.004 (4.00.10) 'A' .079.004 (2.00.10)
.059.004 Dia. (1.50.10)
.453.004 (11.50.10) 'B' .436.004 (11.07.10) +.012 .945 -.004 (24.00) +.30 -.10 4 Max. .0135.0005 (.343.013) Section 'A'-'A' 'A' .315.004 (8.00.10) .129.004 (3.28.10) .059.010 Dia. (1.50.25) 'B'
24 mm Black Anti-static Carrier Tape
Dimensions are in inches (and millimeters)
8 Max.
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Packing Options
The following illustration shows the TeleLink 13-inch (330 mm), injection-molded, highimpact, anti-static, white, plastic reel. Material conforms to EIA-481-1. Surface resistivity is 1011 W/square. Materials comply with ASTM D-257.
1.00.069 (25.651.75) Measured at outer edge
.197.020 (5.00.51) Tape starter slot
Access hole greater than 40.00 at slot 1.575 location 1.19 (30.40) Measured at hub 2.00 min. .079 (Drive Spokes)
2.362.039 (60.001.00) Hub dia. .512.008 (13.00.20) Arbor hole
.795 min. (20.20)
Tape slot depth greater than .394 (10.00) 12.992 (330.00) Max dia. +.079 .960 -.00 (24.40) +2.00 -.00 Measured at hub
Dimensions are in inches (and millimeters)
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Mechanical Data
Lead Form Options
Lead Form Options
Modified TO-220 Type 60
.645.025 (16.380.64)
0.047 (1.19) Dia. ref.
A
0.324 (8.23) 30
C B
0.177 (4.50) Dimensions are in inches (and millimeters)
Inches Dimension A B C Min 0.485 0.162 0.162 0.192 0.192 Max Min 12.32 4.11 4.11
Millimeters Max 4.88 4.88
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(c) 2002 Teccor Electronics SIDACtor(R) Data Book and Design Guide
Lead Form Options
Modified TO-220 Type 61
A
PIN 1
PIN 3
Inches Dimension A Min 0.030 Max 0.060 Min 0.762
Millimeters Max 1.52
Modified TO-220 Type 62
A
B
C
5 TYP.
Inches Dimension A B C Min 0.172 0.440 0.120 Max 0.202 0.460 0.130 Min 4.37 11.18 3.05
Millimeters 5.13 11.68 3.30
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Mechanical Data
Max
NOTES

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